Patents by Inventor Dieter P. Griffis

Dieter P. Griffis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemically enhanced focused ion beam micro-machining of copper
    Publication number: 20040056249
    Abstract: A method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment. The organic chloride or hydroxide concentration at the substrate is an amount sufficient to enhance the relative removal of the copper layer by decreasing the removal of the dielectric or increasing the removal of the copper or a combination of both.
    Type: Application
    Filed: September 26, 2003
    Publication date: March 25, 2004
    Inventors: Phillip E. Russell, Dieter P. Griffis, Juan Carlos Gonzales Perez
  • Chemically enhanced focused ion beam micro-machining of copper
    Patent number: 6645872
    Abstract: A method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment. The organic chloride or hydroxide concentration at the substrate is an amount sufficient to enhance the relative removal of the copper layer by decreasing the removal of the dielectric or increasing the removal of the copper or a combination of both.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: November 11, 2003
    Assignee: North Carolina State University
    Inventors: Phillip E. Russell, Dieter P. Griffis, Juan Carlos Gonzales Perez
  • Chemically enhanced focused ion beam micro-machining of copper
    Publication number: 20030060048
    Abstract: A method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment. The organic chloride or hydroxide concentration at the substrate is an amount sufficient to enhance the relative removal of the copper layer by,decreasing the removal of the dielectric or increasing the removal of the copper or a combination of both.
    Type: Application
    Filed: October 31, 2002
    Publication date: March 27, 2003
    Inventors: Phillip E. Russell, Dieter P. Griffis, Juan Carlos Gonzales Perez
  • Chemically enhanced focused ion beam micro-machining of copper
    Patent number: 6514866
    Abstract: A method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment. The organic chloride or hydroxide concentration at the substrate is an amount sufficient to enhance the relative removal of the copper layer by decreasing the removal of the dielectric or increasing the removal of the copper or a combination of both.
    Type: Grant
    Filed: May 31, 2001
    Date of Patent: February 4, 2003
    Assignee: North Carolina State University
    Inventors: Phillip E. Russell, Dieter P. Griffis, Juan Carlos Gonzales Perez
  • Chemically enhanced focused ion beam micro-machining of copper
    Publication number: 20020094694
    Abstract: A method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment. The organic chloride or hydroxide concentration at the substrate is an amount sufficient to enhance the relative removal of the copper layer by decreasing the removal of the dielectric or increasing the removal of the copper or a combination of both.
    Type: Application
    Filed: May 31, 2001
    Publication date: July 18, 2002
    Inventors: Phillip E. Russell, Dieter P. Griffis, Juan Carlos Gonzales Perez
  • Method for water vapor enhanced charged-particle-beam machining
    Patent number: 6140655
    Abstract: Water vapor enhanced focused particle beam machining speeds up the removal of polymer-based dielectric materials from areas surrounding metallic interconnects on integrated circuits while at the same time decreasing the rate of removal of aluminum. Selective material removal protects metal interconnects from machining damage and greatly reduces the time that protective material is exposed to the particle beam.
    Type: Grant
    Filed: March 24, 1999
    Date of Patent: October 31, 2000
    Assignee: North Carolina State University
    Inventors: Phillip E. Russell, Dieter P. Griffis, Gordon M. Shedd, Terrance J. Stark, James Vitarelli
  • Method for water vapor enhanced charged-particle-beam machining
    Patent number: 5958799
    Abstract: Water vapor enhanced focused particle beam machining speeds up the removal of polymer-based dielectric materials from areas surrounding metallic interconnects on integrated circuits while at the same time decreasing the rate of removal of aluminum. Selective material removal protects metal interconnects from machining damage and greatly reduces the time that protective material is exposed to the particle beam.
    Type: Grant
    Filed: April 13, 1995
    Date of Patent: September 28, 1999
    Assignee: North Carolina State University
    Inventors: Phillip E. Russell, Dieter P. Griffis, Gordon M. Shedd, Terrance J. Stark, James Vitarelli