Abstract: An improved apparatus for the plating of the contact elements of encapsulated electronic components - suitably of the type known as P-Dip strips - is provided with a continuous flexible parts-carrier belt of stainless steel, running in a horizontally aligned loop, with the web of the belt vertical. In the lower edge of the belt an array of flexible gripping fingers is formed, provided with projections, suitable for engagement by laterally disposed cams, on alternating sides of the belt for successive grip fingers. A loading device, co-ordinated with the operation of the cams, presents a part to be plated into the gripping fingers during an interval when the belt is stationary and the cams have been activated to separate the tips of the grip fingers. Upon retraction of the cams the parts are securely held by the grip fingers and moved through the plating stations upon the activation of belt motion. After plating, the parts are released by cam action on the grip fingers.

Abstract: An improved apparatus for the plating of the projecting, bent contact elements of electronic components encapsulated in ceramic packages--suitably of the type known as C-Dips--is provided with a continuous flexible conveyor belt of stainless steel running in a vertically aligned loop with a web of the belt horizontal. The edges of the belt are bevelled to receive, pressed thereover, a gap between the ceramic package and the selvedge associated with the untrimmed lead frame of the contact elements in a frictional, reversible grip. The parts to be plated are forced onto the edge of the intermittently moving belt during its period of rest, and are carried through the treatment stations of the plating apparatus as the belt progresses from a loading station towards an unload station, after the parts have been plated, where the individual encapsulated electronic components are stripped from the belt into receiving trays or magazines.