Patents by Inventor Dieter STEINDL

Dieter STEINDL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210176885
    Abstract: A backplane is for electrically connecting electrical components, and a method is for producing the backplane. The backplane includes a mounting board, conductor tracks arranged on the mounting board, and at least one sensor unit. The method includes integrating the at least one sensor unit into the mounting board by an additive manufacturing method; printing the conductor tracks from an electrically conductive paste, the electrically conductive paste being cured after being applied to the mounting board, by way of 3D printing; and detecting and monitoring, via the at least one sensor unit, function of the conductor tracks during production of the backplane.
    Type: Application
    Filed: April 15, 2019
    Publication date: June 10, 2021
    Applicant: Siemens Aktiengesellschaft
    Inventors: Dirk POEHLER, Joachim SEIDL, Klaus WILKE, Dieter STEINDL