Abstract: In a single-row and expandable into a multi-row stretch blow molding method and apparatus, at least one row of tray plates in a tray unit is used to collect molded preforms ejected from the opening clamp of a preform-molding unit, transfer the preforms with or without transfer beads out of the molding area and align them with the center row distances of the downstream processing units. At least one robot having a universal gripper assembly is used to pick up either all or consecutively fractions of the preforms align them to the center distances of the blow mold cavities to place them at variable time intervals into a conditioning, stretch blow molding and oriented discharge unit, releases finished hollow articles and returns to a waiting position at the preform-molding and tray unit again at the preform mold's center distance independent of the preform-molding cycle. Simultaneously, component transfer devices may pick up external components, i.e.

Abstract: In a single-row and expandable into a multi-row stretch blow molding method and apparatus, at least one row of tray plates in a tray unit is used to collect molded preforms ejected from the opening clamp of a preform-molding unit, transfer the preforms with or without transfer beads out of the molding area and align them with the center row distances of the downstream processing units. At least one robot having a universal gripper assembly is used to pick up either all or consecutively fractions of the preforms align them to the center distances of the blow mold cavities to place them at variable time intervals into a conditioning, stretch blow molding and oriented discharge unit, releases finished hollow articles and returns to a waiting position at the preform-molding and tray unit again at the preform mold's center distance independent of the preform-molding cycle. Simultaneously, component transfer devices may pick up external components, i.e.

Abstract: Preforms or parisons are blow molded from synthetic resin into hollow articles including a neck region and a body area, the hollow articles having hooks and recessed areas formed into their outside walls. Flexible strings are molded below the neck region of varying thickness in the longitudinal direction to achieve molecular orientation of the synthetic resin. The flexible strings are looped around the hooks or lifted above the neck finishes to form flexible handle containers. Rigid handles or combined flexible string and rigid handle portions are incorporated into the hollow articles to form rigid handle containers.

Abstract: Preforms or parisons are blow molded from synthetic resin into hollow articles including a neck region and a body area, the hollow articles having hooks and recessed areas formed into their outside walls. Flexible strings are molded below the neck region of varying thickness in the longitudinal direction to achieve molecular orientation of the synthetic resin. The flexible strings are looped around the hooks or lifted above the neck finishes to form flexible handle containers. Rigid handles or combined flexible string and rigid handle portions are incorporated into the hollow articles to form rigid handle containers.

Abstract: In a single-row and expandable into a multi-row stretch blow molding method and apparatus, a robot having a universal gripper assembly is used to pick up molded preforms during the clamp opening stroke of a preform-molding unit and then transfer the preforms at variable time intervals to a conditioning, stretch blow molding and discharge unit, releases finished hollow articles and returns to a waiting position at the preform-molding unit independent of the preform-molding cycle. Simultaneously, component transfer devices pick up external components, i.e. labels, valves or handles during the stretch blow molding phase and release the components into the blow-mold cavities while the universal gripper assembly is in the waiting position. The universal gripper assembly can alternatively also be pivoted to pick up preforms from a lateral reheat unit to supplement the molded preform supply.

Abstract: One or several molten materials are extruded at low pressure from one or several continuous plasticizers through central stationary nozzles via individually circumferential flow passages of common distribution spools directly into individual extendable transfer reservoirs. From there, the molten materials are transferred in a continuous cascading manner into secondary transfer reservoirs to be subsequently transferred and condensed within mold cavities into finished molded articles. The central stationary nozzles and stationary primary displacement plugs are grooved with lateral longitudinal melt-flow channels to allow the conveyance of molten materials across intersecting molten material passage ways during the extending movement of the manifold assembly. The molten materials are conveyed through secondary displacement plugs into secondary transfer reservoirs by external cylinders, retracting the manifold assembly on adjustable-length spacer rods in unison against the stationary primary displacement plugs.

Abstract: Hollow plastic articles are produced by a method wherein molten material is first conveyed at low pressure via a telescoping nozzle, across compensating rods in the melt passages and individually circumferential flow passages of common primary distribution spools into transfer reservoirs. Upon completion of the controlled filling phase, primary and secondary distribution spools are shifted, the mold manifold assembly with the transfer housing together with the mold cavity bottoms and outside wall-forming sleeves are drawn in unison against stationary displacement plugs which transfer the molten material from the transfer reservoirs around the fixed-position core pin tips and into corresponding mold cavities. After completion of the cavity filling phase, the common secondary distribution spools, located close to the mold cavity bottom gates, are shifted laterally such that their land areas shut off the external melt streams.

Abstract: Communication system having a multiprocessor system serving the purpose of central control. Multiprocessor systems are used in communication systems for the purpose of central control. Care must thereby be exercised to ensure that the jobs/messages arriving from a periphery according to the FIFO principle are in turn deposited in the original sequence after being handled by processes being executed on the processors. A coordination procedure required for this purpose thereby uses a holding table. The logical sequence of jobs/messages is thus assured during the processing in the multiprocessor system.

Abstract: An electrical external resistor with a plate-like, electrical insulating carrier element and a flat resistance element arranged on the upper side of the carrier element. The carrier element has several films forming a closed coating and varying in their electrical conductivity. The films arranged on the upper side and on the lower side of the carrier element consist of cermet, and the film covering the edge area of the carrier element consists of an electrically insulating material. By means of springs or a pressure distribution plate, the resistance element is pressed against the upper cermet film of the carrier element. The interior space of the housing is filled with a casting compound made of addition cross-linking two-component silicon caoutchouc (rubber). The electrical external resistance is discharge-free.

Abstract: Semiconductor module, including a metallic bottom plate, at least two semiconductor bodies disposed on the bottom plate, at least one of the semiconductor bodies being a thyristor tablet having at least one control electrode, a frame having an inner surface, the frame being connected to the bottom plate and surrounding the semiconductor bodies, at least one control line for each thyristor tablet having first and second sections, each of the first sections being firmly connected to a respective one of the control electrodes and having an end facing away from the one control electrode, the ends each being adjacent the inner surface of the frame and including a contact region, each of the second sections being mechanically connected to the frame and having a contact region in contact with the contact region of a respective one of the first sections, and the second sections each including a contact terminal accessible from outside the module.

Abstract: A disk-shaped housing for a semiconductor element comprising a cup (1) of insulating material with an opening (2) at the bottom. Through this opening (2) passes a contact surface (4) of one of two plate type connecting bodies (3), between which lies a pressure-contacted semiconductor body (14). Both connecting bodies (3, 5) comprise radially and axially oriented seal surfaces (8, 9; 11, 12), against which there abuts under pressure an elastic ring (13) which surrounds the semiconductor body. The cup is filled with sealing compound (18); the semiconductor body is thus protected against penetration of the sealing compound.

Abstract: Semiconductor component with a disc-shaped case, including a ceramic ring having an inner surface, two metal discs, metal rings connecting the metal discs to the ceramic ring, a semiconductor body disposed in the case between the metal discs, an additional metal ring fastened to the periphery of each of the metal discs within the case, at least one electrically and thermally insulating foil having a high energy of evaporation disposed between the semiconductor body and the ceramic ring covering the inner surface of the ceramic ring and overlapping the additional metal rings.

Abstract: Semiconductor component includes a closed housing having a base and a cover and being formed with a plurality of recesses therewithin, a plurality of semiconductor elements received in the recesses, respectively, and having at least two poles, a plurality of contact strips heat-conductively connected to and electrically insulated from the housing base, one of the poles of each of the semiconductor elements being in contact with a respective one of the contact strips and therethrough being in heat-conductive contact with the housing base, a plurality of supply electrodes, respectively, connected to another of the poles of the respective semiconductor elements, the respective contact strip in contact with a respective pole of one of the semiconductor elements and the respective supply electrode connected to a respective pole of another of the semiconductor elements being electrically connected to one another, a cross-piece disposed in the housing between the recesses wherein the semiconductor elements are recei

Abstract: This invention is an improved apparatus for detecting residue that is left on a core rod of injection blow molding apparatus after blown articles have been stripped from the core rods at a pick-off station, and before the core rods are delivered to an injection station. The detecting apparatus moves in a straight line across a row of core rods extending from the face of an indexing head and while the core rods are stationary.