Abstract: A semiconductor probe and alignment system are disclosed. The semiconductor probe includes a silicon-based substrate and membrane on which a plurality of pyramid shaped contactors are formed. Each of the contactors includes a metalized tip for contacting bonding pads on a semiconductor die. The area of the probe surrounding each contactor is thinned to form a membrane to provide flexibility and thus compliance to assure contact between each contactor and its respective bonding pad. In the alignment system, a guide wall formed from a photo-imageable material is created around at least a portion of each bonding pad to provide alignment for guiding the contactors on the probe onto the bonding pads.

Abstract: A test cell for non-contact testing a circuit board for shorts and opens includes a hermetically sealable container for that circuit board, at least one wall of the container providing access to permit a circuit board to be positioned at an imaging plane inside the container. A pair of planar electrodes positioned inside the container are spaced on opposite sides of and parallel to the imaging plane and these electrodes are connected to contacts on the exterior of the container so that the electrodes can be releasably connected to an external voltage source to provide an electric field inside the container which extends perpendicular to the imaging plane. One of these electrodes and the container wall adjacent thereto are transparent to light from a pulsed laser positioned outside the container which is arranged to image a selected spot on a conductor of a circuit positioned at the imaging plane.