Patents by Inventor Dietmar Dengler

Dietmar Dengler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9068104
    Abstract: The invention relates to combined radiation- and moisture-curing compounds, which are characterized in particular by rapid curing by means of moisture. The compounds can be used as adhesives, coatings or potting materials. The use of the compounds according to the invention is particularly preferred for filling electro-optical components.
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: June 30, 2015
    Assignee: Delo Industrie Klebstoffe GMBH & Co. KGAA
    Inventors: Markus True, Dietmar Dengler, Robert Born
  • Publication number: 20140222662
    Abstract: Methods, techniques, and systems for providing adaptive automated interaction capabilities for computer applications that request automated conducting of domain specific transactions via a domain specific online transaction website, e.g. an online-banking web site in a failure-proof manner. Particular methods, techniques and systems employ adaptive mixing of script-based and avatar-based execution entities for delegating sub-tasks and activities of a domain-specific transaction workflow for automated processing via a domain-specific online transaction website, the transactions being requested by a third party computer application and the domain e.g. pertaining to online banking.
    Type: Application
    Filed: January 31, 2014
    Publication date: August 7, 2014
    Applicant: Buhl Data Service GmbH
    Inventors: Ingo Bierwas, Dietmar Dengler, Daniel Porta, Robert Nesselrath, Sebastian Germesin
  • Publication number: 20120329897
    Abstract: The invention relates to combined radiation- and moisture-curing compounds, which are characterized in particular by rapid curing by means of moisture. The compounds can be used as adhesives, coatings or potting materials. The use of the compounds according to the invention is particularly preferred for filling electro-optical components.
    Type: Application
    Filed: March 3, 2011
    Publication date: December 27, 2012
    Applicant: DELO INDUSTRIE KLEBSTOFFE GMBH & CO. KGAA
    Inventors: Markus True, Dietmar Dengler, Robert Born
  • Patent number: 7397140
    Abstract: A chip module having a chip which is mounted by means of chip adhesive on a mount and is electrically connected via bonding wires to contact pads, and an encapsulation compound which surrounds the chip and the bonding wires and is bounded by a subarea of the mount. The encapsulation compound is radiation-hardened and heat-hardened in a combined form and has radiation-impermeable pigments.
    Type: Grant
    Filed: August 16, 2005
    Date of Patent: July 8, 2008
    Assignees: Infineon Technologies AG, Delo Industire Klebstoffe GmbH + Co. KG
    Inventors: Frank Puschner, Dietmar Dengler, Wolfgang Schindler, Thomas Spottl
  • Publication number: 20060049532
    Abstract: A chip module having a chip which is mounted by means of chip adhesive on a mount and is electrically connected via bonding wires to contact pads, and an encapsulation compound which surrounds the chip and the bonding wires and is bounded by a subarea of the mount. The encapsulation compound is radiation-hardened and heat-hardened in a combined form and has radiation-impermeable pigments.
    Type: Application
    Filed: August 16, 2005
    Publication date: March 9, 2006
    Applicants: Infineon Technologies AG, DELO Industrie Klebstoffe GmbH & Co. KG
    Inventors: Frank Puschner, Dietmar Dengler, Wolfgang Schindler, Thomas Spottl
  • Publication number: 20020113217
    Abstract: For the pre-activation of cationically polymerizing materials a radiation source is used which has a radiation surface formed by a plurality of LEDs. The radiation surface is spaced a small distance from the material to be irradiated. Irradiation is performed such that the material is heated to less than 50° C. and that a sufficient potlife is achieved which enables the material to be further processed before it cures.
    Type: Application
    Filed: February 21, 2002
    Publication date: August 22, 2002
    Applicant: DELO Industrieklebstoffe GmbH & Co. KG
    Inventors: Wolf-Dietrich Herold, Dietmar Dengler, Rainer Moest
  • Patent number: 6420450
    Abstract: Cationically hardening masses are described, which can be stored and handled as single-component masses and comprise at least one difunctional cationically polymerizable compound; a photo-initiator for the cationic hardening based upon diaryliodonium salts; at least one compound containing an hydroxyl group; a compound releasing radicals when heated and having a half-life of one hour at a temperature of less than 100° C.; a photo-initiator forming radicals or of a photo-sensitizing agent for diaryliodonium salts; and from 0 to 60 parts by mass of modifier. The compounds are used for bonding, casting, sealing and coating of substrates.
    Type: Grant
    Filed: June 14, 2000
    Date of Patent: July 16, 2002
    Assignee: Delo Industrieklebstoffe GmbH & Co. KG
    Inventors: Dietmar Dengler, Michael Stumbeck
  • Patent number: 6284827
    Abstract: A polymerizable fluorine-containing composition is proposed, containing at least one polymerizable compound and at least one fluorine-containing compound, which for reducing the content of fluoride ions extractable with water of cured polymer masses obtainable from the composition additionally contains at least one magnesium compound. The composition is particularly suitable for bonding, potting and coating of electronic devices and for mounting electronic devices on printed circuit boards. Further proposed is a process for the preparation of cured polymer masses having a reduced content of fluoride ions extractable with water, comprising polymerizing and curing the composition to which at least one magnesium compound is added prior to the polymerization.
    Type: Grant
    Filed: March 11, 1999
    Date of Patent: September 4, 2001
    Assignee: Delo Industrieklebstoffe GmbH Co. K
    Inventors: Gunther Eckhardt, Dietmar Dengler, Ursula Somnitz