Abstract: An apparatus for depositing organic layers on a substrate includes a gas-mixing device with one or more inlets, each for supplying a gas flow consisting of previously vaporized organic molecules that are conveyed by a carrier gas and have a molar mass greater than 300 g/mol or 400 g/mol, gas diversion elements which homogeneously mix the organic molecules in the carrier gas, and an outlet from which a homogeneous gas mixture discharges. The apparatus also comprises a conveying pipe which is connected to the outlet, and a gas inlet element that has a gas distribution volume, into which the conveying pipe leads and which has a gas outlet face that has gas outlet openings and faces a substrate holder for receiving the substrate. Furthermore, layers are deposited on the substrate using such an apparatus. The lateral homogeneity of the deposited layers is improved by one of several techniques.

Abstract: A delivery device, manufacturing system, and process of manufacturing are disclosed. The delivery device includes a feed tube and a chemical vapor deposition coating applied over an inner surface of the feed tube, the chemical vapor deposition coating being formed from decomposition of dimethylsilane. The manufacturing system includes the delivery device and a chamber in selective fluid communication with the delivery device. The process of manufacturing uses the manufacturing system to produce an article.

Abstract: In a photosensitive semiconductor diode device (1), in particular, a PIN diode device (2) for converting optical signals into electronic signals, the semiconductor diode is provided with a lead for contacting the doped regions and for electroconductively connecting them to a following circuit (11), e.g., an electronic amplifier. To realize a matching between the semiconductor diode and the following circuit that is effective over a wide bandwidth by means of a passive matching circuit (10), the lead contains the matching circuit such that lead (4, 5) is constructed on at least part of its length (L) as a coplanar line or a microstrip line such that conductor width (S) and/or conductor spacing width (gap width W) varies along its length area (L) of the lead, with the characteristic impedance of this lead varying along the corresponding part of the line. A very high operating frequency and a low signal attenuation are thereby achieved, among other things.