Abstract: Systems and methods are provided for a high density liquid cooling unit to cool electrical components. A replaceable pump unit (RPU) can include a pump configured to provide fluid flow to cool the electrical components (e.g., via direct liquid cooling of the electrical components by the pumped fluid and air-to-liquid cooling of the pumped fluid via a heat exchanger in fluid communication with the RPU). The RPU can be configured to be operated with or satisfy one or more RPU performance characteristics.

Abstract: Systems and methods are provided for a high density liquid cooling unit to cool electrical components. A replaceable pump unit (RPU) can include a pump configured to provide fluid flow to cool the electrical components (e.g., via direct liquid cooling of the electrical components by the pumped fluid and air-to-liquid cooling of the pumped fluid via a heat exchanger in fluid communication with the RPU). The RPU can be configured to be operated with or satisfy one or more RPU performance characteristics.

Abstract: An air-to-liquid cooling system includes a cabinet, a fluid inlet, a fluid outlet, a heat exchanger within the cabinet, a plurality of fan assemblies, and a hot-swappable control module. The cabinet defines a front and rear portion, and includes lateral side panels and a front face. The heat exchanger is in fluid communication with the fluid inlet and fluid outlet. The heat exchanger is positioned at an oblique angle relative to the lateral side panels of the cabinet. The plurality of fan assemblies are mounted along the front face and further include a fan and blind mate connectors. The hot-swappable control module is positioned vertically above the plurality of fan assemblies. The hot-swappable control module includes a controller that is in electronic communication with the plurality of fan assemblies, and includes instructions stored within the controller to control a speed of the fans.

Abstract: Embodiments of the invention provide a high-density liquid cooling system including a cabinet with side panels on opposing sides of the cabinet. A heat exchanger is mounted within the cabinet, and is positioned at an oblique angle relative to the side panels. The heat exchanger is fluidly positioned along a liquid cooling circuit and includes a fluid inlet for receiving a fluid of the liquid cooling circuit. A fan assembly is mounted at a front of the cabinet and includes a plurality of fans configured to generate an air flow across a surface of the heat exchanger. A pumping unit within the cabinet includes a control unit and a first pump for inducing a flow of the fluid of the liquid cooling circuit. The control unit includes a first and second removable controller, and the control unit is electrically connected with the first pump and at least one fan.

Abstract: Systems and methods are provided for a high density liquid cooling unit to cool electrical components. A replaceable pump unit (RPU) can include a pump configured to provide fluid flow to cool the electrical components (e.g., via direct liquid cooling of the electrical components by the pumped fluid and air-to-liquid cooling of the pumped fluid via a heat exchanger in fluid communication with the RPU). The RPU can be configured to be operated with or satisfy one or more RPU performance characteristics.

Abstract: A subrack assembly can be configured for use with a subrack that includes an installation space for electronic circuit boards, an air distribution duct, an air collecting duct, and a slot. A fan tray can be configured to be slidably and removably received in the slot and can include panel and support one or more electric fans. The panel of the fan tray can at least partly define a first air chamber within the fan tray, and, in cooperation with the subrack, can define a second air chamber within the subrack, with the panel separating the second air chamber from the first air chamber. The one or more electric fans can be configured to drive an air flow through the first and second air chambers, the air collecting duct, and the air distribution duct, to cool the electronic circuit boards within the installation space.

Abstract: A subrack assembly can be configured for use with a subrack that includes an installation space for electronic circuit boards, an air distribution duct, an air collecting duct, and a slot. A fan tray can be configured to be slidably and removably received in the slot and can include panel and support one or more electric fans. The panel of the fan tray can at least partly define a first air chamber within the fan tray, and, in cooperation with the subrack, can define a second air chamber within the subrack, with the panel separating the second air chamber from the first air chamber. The one or more electric fans can be configured to drive an air flow through the first and second air chambers, the air collecting duct, and the air distribution duct, to cool the electronic circuit boards within the installation space.

Abstract: A cabinet for housing electronic plug-in cards has front and rear card baskets for inserting plug-in cards and first and second vertical backplanes. The front side of the first backplane faces the front of the cabinet and the front side of the second backplane faces the back of the cabinet. A distance piece connects the two backplanes and a counterbore is disposed in at least one of the rear sides of the two backplanes. The depth of the counterbore or the residual thicknesses of the backplane after drilling the counterbore is sized such that the distance between the front side of the second backplane and the front of the cabinet is a predetermined value. This ensures that the plug-in cards pushed onto the second backplane are completely received inside the rear card basket and the front plate of the plug-in cards ends flush with the rear card basket.

Abstract: A rack for electronic plug-in boards has board cages on the front and rear sides and at least one vertical backplane arranged between the board cages. The rack has an installation space provided underneath or above the board cages and into which fan modules can be horizontally inserted from the front side. A power supply module with an electronics unit supplies power to the backplane. The installation space continuously extends up to the region of the board cage on the rear side. The electronics unit is arranged in the region of the rear side of the rack underneath or above the board cage and defines the installation space toward the rear. The electronics unit is connected to the backplane by rigid electric conductors horizontally extending between the board cage on the rear side and the installation space parallel and at a distance from one another.

Abstract: A cabinet for housing electronic plug-in cards has front and rear card baskets for inserting plug-in cards and first and second vertical backplanes. The front side of the first backplane faces the front of the cabinet and the front side of the second backplane faces the back of the cabinet. A distance piece connects the two backplanes and a counterbore is disposed in at least one of the rear sides of the two backplanes. The depth of the counterbore or the residual thicknesses of the backplane after drilling the counterbore is sized such that the distance between the front side of the second backplane and the front of the cabinet is a predetermined value. This ensures that the plug-in cards pushed onto the second backplane are completely received inside the rear card basket and the front plate of the plug-in cards ends flush with the rear card basket.

Abstract: A rack for electronic plug-in boards has board cages on the front and rear sides and at least one vertical backplane arranged between the board cages. The rack has an installation space provided underneath or above the board cages and into which fan modules can be horizontally inserted from the front side. A power supply module with an electronics unit supplies power to the backplane. The installation space continuously extends up to the region of the board cage on the rear side. The electronics unit is arranged in the region of the rear side of the rack underneath or above the board cage and defines the installation space toward the rear. The electronics unit is connected to the backplane by rigid electric conductors horizontally extending between the board cage on the rear side and the installation space parallel and at a distance from one another.