Patents by Inventor Dietmar Nessmann

Dietmar Nessmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9425500
    Abstract: In a method of manufacturing an antenna (11) formed on a substrate (1) an antenna structure (2) is formed on the substrate (1). The antenna structure (2) comprises an area (3) which initially is electrically short-circuited and is designed to be turned into an antenna contact (4a,4b) to be contacted with contacts (12,13) of an integrated circuit (IC). The antenna contact (4a,4b) is formed by mechanically separating the electrically short-circuited 5 area (3) particularly utilizing cutting or stamping means (5).
    Type: Grant
    Filed: November 21, 2008
    Date of Patent: August 23, 2016
    Assignee: NXP B.V.
    Inventors: Christian Zenz, Dietmar Nessmann
  • Publication number: 20100310124
    Abstract: In a method of determining the distance (d) between an integrated circuit (1) and a substrate (2) a picture (31,32) of the integrated circuit (1) is taken. The integrated circuit (1) is attached to the substrate (2) that is at least semi transparent. An at least semi transparent material, particularly an at least semi transparent adhesive (8), is located between the integrated circuit (1) and the substrate (2). The picture (31,32) of the integrated circuit (1) is taken through the substrate (2) and the material (8). The picture (31,32) and/or image data related to the picture (31,32) is evaluated and the distance (d) between the integrated circuit (1) and the substrate (2) is determined in response to the evaluated picture (31,32) and/or image data related to the picture (31,32).
    Type: Application
    Filed: November 25, 2008
    Publication date: December 9, 2010
    Applicant: NXP B.V.
    Inventors: Christian Zenz, Dietmar Nessmann, Shafqat Hussain, Martin Weinberger
  • Publication number: 20100253589
    Abstract: In a method of manufacturing an antenna (11) formed on a substrate (1) an antenna structure (2) is formed on the substrate (1). The antenna structure (2) comprises an area (3) which initially is electrically short-circuited and is designed to be turned into an antenna contact (4a,4b) to be contacted with contacts (12,13) of an integrated circuit (IC). The antenna contact (4a,4b) is formed by mechanically separating the electrically short-circuited 5 area (3) particularly utilizing cutting or stamping means (5).
    Type: Application
    Filed: November 21, 2008
    Publication date: October 7, 2010
    Applicant: NXP B.V.
    Inventors: Christian Zenz, Dietmar Nessmann