Abstract: A power semiconductor module of a power electronic system includes: a power electronic substrate; a power semiconductor die arranged on and electrically coupled to a first side of the substrate; a plastic frame arranged at the first side and defining an interior volume of the module; and a load current contact electrically connected to the first side and partially exposed from the frame. The frame includes a recess above a side of the load current contact facing away from the substrate. A driver board arranged above the module includes circuitry configured to drive power circuitry of the module. A current sensor arranged on and electrically coupled to a side of the driver board facing the module is configured to detect an alternating current flowing through the load current contact. The sensor is arranged at least partially within the recess. The frame electrically isolates the sensor from the load current contact.