Abstract: A process for connecting a winding wire of a coil with a terminal pin of a casing for surface mounting is introduced, whereby one end section of the winding wire is wound around the terminal pin. The area of the terminal pin wound with the end section of the winding wire is soft-soldered, and the soft-solder is then blown off of the partial area of the area wound, which forms the soldering application surface for surface mounting. The inventive process can be used in the manufacture of inductive SMD components, the terminal pins of which possess excellent coplanarity, particularly if terminal pins bent in a wing-shape are used.