Abstract: A substrate with an organic undercoat as bonding layer for a printing medium to be deposited subsequently on the substrate in a printing process is such that the organic undercoat contains fine grained constituents of organic and/or inorganic substances, whereby the surface of the inorganic constituents is treated or provided with a coating of organic substances. Suitable inorganic constituents are e.g. highly dispersed silica, the surface of which is treated with a resin or a polymer. Suitable compositions for the organic undercoat layer on the substrate are organic coatings based on many commercially available organic coating materials with an addition of e.g. 0.3 to 20 wt. % silica. By adding highly dispersed silica to the undercoat the adhesion between the undercoat and the printing medium can be greatly improved, also in the case of laser printing methods with small thermal energy.

Abstract: A substrate with an organic undercoat as bonding layer for a printing medium to be deposited subsequently on the substrate in a printing process is such that the organic undercoat contains fine grained constituents of organic and/or inorganic substances, whereby the surface of the inorganic constituents is treated or provided with a coating of organic substances. Suitable inorganic constituents are e.g. highly dispersed silica, the surface of which is treated with a resin or a polymer. Suitable compositions for the organic undercoat layer on the substrate are organic coatings based on many commercially available organic coating materials with an addition of e.g. 0.3 to 20 wt. % silica. By adding highly dispersed silica to the undercoat the adhesion between the undercoat and the printing medium can be greatly improved, also in the case of laser printing methods with small thermal energy.

Abstract: Foil includes a first etch-resistant layer which at least partially covers the neighboring layer and has a weight per unit area of 0.5-20 g/m.sup.2, a first aluminum or aluminum alloy layer having a thickness of about 30 .mu.m to 150 .mu.m, a dielectric layer of plastic having a thickness of about 5 to 100 .mu.m, a second aluminum or aluminum alloy layer having a thickness of about 30 .mu.m to 150 .mu.m, and a second etch-resistant layer which at least partially covers the neighboring layer and has a weight per unit area of 0.5 to 20 g/m.sup.2.

Abstract: To adapt the frequency band of oscillating circuits with frequencies greater than the set frequency, made from a metal-plastic-metal sandwich foil useful as an identification label and manufactured from rolls (1) of sandwich foil connected to each other by at least one plastic film, the oscillating circuits are conveyed almost continuously through two frequency-measuring cells (5,6) between which is located a reduction unit (7). After comparison of the set value and actual value, the frequency band of an oscillating circuit is adapted by reduction of the capacitor part of the oscillating circuit by means of the reduction unit (7), which is controlled by the correction unit (8).