Abstract: Thermoplastic molding materials containA) from 40 to 99.69% by weight of a polyoxymethylene homo- or copolymer,B) from 0.1 to 2% by weight of at least one stabilizer selected from the group consisting of benzotriazole derivatives or benzophenone derivatives or aromatic benzoate derivatives,C) from 0.1 to 2% by weight of at least one sterically hindered amino compound,D) from 0.005 to 2% by weight of a polyamide,E) from 0 to 2% by weight of an epoxy-containing compound,F) from 0 to 50% by weight of a toughened polymer andG) from 0 to 50% by weight of a fibrous or particulate filler or of a mixture thereof.

Abstract: Molding materials of(A) one or more polyoxymethylene homopolymers and/or copolymers and(B) one or more thermoplastic polyurethane elastomers,(C) with or without additives, contain, as an additive,(D) one or more alkaline earth metal silicates, advantageously in an amount of from 0.005 to 2% by weight, based on the weight of the components (A) and (B), for improving the heat stability, reducing the tendency to discoloration and minimizing the free formaldehyde content.To prepare the molding materials, the components (A), (B), (D) and, if required (C) are advantageously melted together in an extruder at from 150.degree. to 260.degree. C.The molding materials are useful for the production of films or moldings, which are used, for example, in the automotive, electrical appliances and electronics industries.

Abstract: A positive working photosensitive film resist material suitable for multiple image-wise exposure comprises, on a dimensionally stable base film, a photosensitive coating which contains (a) a polymer which possesses aromatic or hetero-aromatic o-nitrocarbinol ester groups (for example o-nitrobenzyl acrylate units) and which can be washed out, after exposure, with an alkaline solvent, and (b) a transparent plasticizer compatible with (a). The product may be used as photopolymer dry film resist material in the production of electrical conductor boards, chemically milled fine-line parts, and identification plates.

Abstract: Gravure printing plates comprising a plastic printing layer applied on a printing plate base are produced by a method wherein a solid photosensitive layer (L) firmly bonded on the printing plate base is exposed imagewise to actinic light, and the exposed layer is washed out with a developer and then subjected to thermal hardening to form the plastic printing layer. In this process, the photosensitive layer (L) employed contains, as the photosensitive component, a compound possessing two or more aromatic and/or heteroaromatic o-nitrocarbinol ester groups, and a compound which effects crosslinking and possesses two or more reactive groups which are capable of reacting with --COOH groups under the action of heat to form a covalent chemical bond.

Abstract: Relief images or resist images are produced by a negative-working process, using a photosensitive resist layer which is applied on a base and contains a compound possessing two or more aromatic and/or heteroaromatic o-nitrocarbinol ester groups as well as a crosslinking compound possessing two or more reactive groups which are capable, under the action of heat, of reacting with carboxyl groups to form a covalent chemical bond. To produce the relief images or resist images, the photosensitive resist layer is first exposed imagewise to actinic light, the exposed areas of this layer are subjected to selective thermal hardening and crosslinking and the resist layer is then post-exposed uniformly to actinic light and finally washed out with an aqueous developer.

Abstract: Relief images or resist images are produced by a positive-working process, using a solid photosensitive resist layer which is applied to a base and contains a compound possessing two or more aromatic and/or heteroaromatic o-nitrocarbinol ester groups and crosslinking compounds possessing two or more reactive groups which are capable, under the action of heat, of reacting with carboxyl groups to form a covalent chemical bond. To produce the relief images or resist images, the photosensitive resist layer is first exposed imagewise to actinic light, the exposed areas of this layer are then washed out with an aqueous developer, the remaining resist layer is post-exposed uniformly to actinic light and finally the post-exposed resist layer is thermally crosslinked and hardened.

Abstract: Photopolymerizable coating and recording materials, such as photopolymer dry film resist materials and photoresist materials, comprising at least one photopolymerizable olefinic compound, which materials contain, as activated photoinitiator system, a carbonyl compound that, when exposed to actinic light, forms free radicals which initiate polymerization, such as benzophenone and benzophenone derivatives, as well as a benzene compound having at least two dichloromethyl groups bound to the benzene nucleus, such as bis(dichloromethyl)-benzene and 2,5-dichloro-1,4-bis(dichloromethyl)benzene, and preferably also a dye which changes color in the presence of acid. The coating and recording materials of the invention exhibit improved curing when exposed to ultraviolet light for the usual periods and can be readily washed out with solvents without any damage to the exposed areas.