Abstract: A container system includes a container having an opening and an insert configured to be placed in the container through the opening. The insert includes a sleeve substantially corresponding in shape to a shape of an inner surface of the container adjacent to the opening.

Abstract: A container system includes a container having an opening and an insert configured to be placed in the container through the opening. The insert includes a sleeve substantially corresponding in shape to a shape of an inner surface of the container adjacent to the opening.

Abstract: The present invention provides systems and methods of controlling local environment. In one embodiment, incoming air enters a contactor such the Direct Contact Cooler-Condenser (DCCC) where the air contacts water distributed on the contact media. After passing through the DCCC, the air is saturated at a temperature equal or close to that of the water. Depending on the state of the incoming air, in the DCCC will be humidified or dehumidified to yield saturated air at the desired humidity ratio. In one embodiment, a blower draws air through the DCCC and blows into the heater. The heater heats the air to the desired dry-bulb temperature. Before exiting, the air may pass through a filter.

Abstract: The present invention provides systems and methods of controlling local environment. In one embodiment, incoming air enters a contactor such the Direct Contact Cooler-Condenser (DCCC) where the air contacts water distributed on the contact media. After passing through the DCCC, the air is saturated at a temperature equal or close to that of the water. Depending on the state of the incoming air, in the DCCC will be humidified or dehumidified to yield saturated air at the desired humidity ratio. In one embodiment, a blower draws air through the DCCC and blows into the heater. The heater heats the air to the desired dry-bulb temperature. Before exiting, the air may pass through a filter.

Abstract: This invention is a thermal management method for efficient, rapid, controllable and uniform thermal management over a wide temperature range. The method integrates a thermal source, thermal sink and a thermal diffuser. According to the invention, a thermal diffuser is positioned stationary relative to the wafer surface and coupled to a thermal source and a thermal sink, which are also stationary relative to the wafer surface. The thermal sink comprises a heat-carrying media with a controllable temperature. The wafer is heated from a first processing temperature to a second processing temperature during a heating time interval and then cooled to the first processing temperature from the second processing temperature during a cooling time interval. During heating and cooling, the wafer is constantly held in a fixed position. Zonal control of the thermal source and non-uniform flow of the thermal sink enable sensitive mitigation of thermal non-uniformity on a heating surface.

Abstract: This invention is a thermal management method for efficient, rapid, controllable and uniform thermal management over a wide temperature range. The method integrates a thermal source, thermal sink and a thermal diffuser. According to the invention, a thermal diffuser is positioned stationary relative to the wafer surface and coupled to a thermal source and a thermal sink, which are also stationary relative to the wafer surface. The thermal sink comprises a heat-carrying media with a controllable temperature. The wafer is heated from a first processing temperature to a second processing temperature during a heating time interval and then cooled to the first processing temperature from the second processing temperature during a cooling time interval. During heating and cooling, the wafer is constantly held in a fixed position. Zonal control of the thermal source and non-uniform flow of the thermal sink enable sensitive mitigation of thermal non-uniformity on a heating surface.

Abstract: This invention is a substrate thermal management system for efficient, rapid, controllable and uniform thermal management over a wide temperature range. The thermal management system integrates a thermal source, thermal sink and a thermal diffuser. According to the invention, a thermal diffuser is positioned stationary relative to the wafer surface and coupled to a thermal source and a thermal sink, which are also stationary relative to the wafer surface. The thermal source includes a plurality of zones adapted to provide differing amounts of heat and a controllable temperature field over a surface proximal to the thermal diffuser. The thermal sink comprises a heat-carrying media with a controllable temperature.

Abstract: This invention is a thermal management method for efficient, rapid, controllable and uniform thermal management over a wide temperature range. The method integrates a thermal source, thermal sink and a thermal diffuser. According to the invention, a thermal diffuser is positioned stationary relative to the wafer surface and coupled to a thermal source and a thermal sink, which are also stationary relative to the wafer surface. The thermal sink comprises a heat-carrying media with a controllable temperature. The wafer is heated from a first processing temperature to a second processing temperature during a heating time interval and then cooled to the first processing temperature from the second processing temperature during a cooling time interval. During heating and cooling, the wafer is constantly held in a fixed position. Zonal control of the thermal source and non-uniform flow of the thermal sink enable sensitive mitigation of thermal non-uniformity on a heating surface.