Abstract: A container suitable for the preparation, storage and dispensing of compounded suppositories is provided. Methods of preparing, storing and dispensing compounded suppositories utilizing such a container and related kits are also provided.

Abstract: An image recording medium has a substrate having a hot melt extruded ink-receiving layer formed on a first side of the substrate. The ink-receiving layer includes at least 50% of a hydrogel by weight. The hydrogel is capable of absorbing at least 50% of its dry weight of water.

Abstract: A container suitable for the preparation, storage and dispensing of compounded suppositories is provided. Methods of preparing, storing and dispensing compounded suppositories utilizing such a container and related kits are also provided.

Abstract: The invention is a method and apparatus for tracking the location of assets, such as capitalized fixed assets, for tax reporting and insurance value reporting purposes. In accordance with the invention, each time a transaction occurs with respect to an asset, a tax location finder routine is performed. The tax location finder routine runs through a hierarchical sequence of queries to attempt to classify the asset as one of a plurality of categories corresponding to a customized audit technique that is likely to be able to derive a location for said asset. If and when the asset is correlated to one of the customized audit techniques, that audit technique is applied to attempt to derive a tax location for the asset. If a location can be derived, the location is reported. If the asset cannot be correlated to one of the customized audit techniques or, if it can be correlated to a customized audit technique, but that audit technique cannot derive a location, an error is reported.

Abstract: A vehicle safety system requiring seat belt use including a car seat positioned within the vehicle. The car seat has a seat portion and a back portion. A seat belt is coupled with respect to the car seat. The seat belt is comprised of a shoulder harness and a waist belt together joined with a belt buckle. The seat belt includes a buckle receptacle secured to the seat portion for receiving the belt buckle in a locked orientation. The buckle receptacle includes a release button for releasing the belt buckle from the buckle receptacle in an unlocked orientation. A sensor system is disposed within the vehicle. The sensor system includes a main sensor in communication with the transmission of the vehicle.

Abstract: An electronic component assembly (10) is formed by mounting an electronic component (15) to the leads (12) of a leadframe (18). The portions of the leadframe (18) that come in physical contact with the electronic component (15) are electrically connected to the electronic component with bonding wires (31) or by placing the bonding regions (30) of the electronic component (15) in direct physical contact with the tips (35) of the leads (12). A package (20) is used to encapsulate the leads (12) and the electronic component (15).

Abstract: A transport head (10) and a method for transporting flux and solder balls (50) to locations for bonding pads (46) on a workpiece (44). To transfer flux, a first pattern definition mask (12) is attached to the transport head (10) and allows selector pins (64) to fully extend and receive flux for transport to the bonding pads (46) on the substrate (44). To transfer the solder balls (50), pattern definition mask (12) attached to the transport head (10) defines locations that are to be populated with the solder balls (50). The transport head (10) transfers the solder balls (50) to the bonding pads (46) of the substrate (44).

Abstract: A semiconductor device includes a substrate (10) that can be cut into different sizes. A plurality of wirebond fingers (12) are formed on a top surface (13) of the substrate (10). The plurality of wirebond fingers (12) are located within concentric interconnect regions (23, 25, 27, 29, 31, 33, 35) and electrically connected to a via (14) by a signal interconnect line (11). The size of substrate (10) can be altered by cutting the substrate (10) to remove any of the interconnect regions (23, 25, 27, 29, 31, 33, 35). A semiconductor component (44) attached to the top side (13) of the substrate (10) can have a die pad (48) wirebonded to any of the plurality of wirebond fingers (12) located along the signal interconnect line (11) for connection to the via (14).