Abstract: An epoxide based composition that can be cured at a temperature of less than about 70 C is disclosed. The composition is a liquid at ambient conditions and, therefore, can be used to rehabilitate the interior surfaces of pipelines. The epoxide-based composition comprises at least one epoxide component (component A) and at least one curing agent component (component B) wherein (A) the epoxide component comprises a phenyl glycidyl ether polyepoxide; and (B) the curing agent component comprises a mixture of two salt compounds formed, respectively, from an N-alkanol piperidine and a carboxylic acid bearing 7-12 carbon atoms, and N-cyclohexyl-N,N-dialkyl amine and a carboxylic acid bearing 7-12 carbon atoms.

Abstract: Liquid epoxy curing agents that have improved latency over conventional liquid curing agents while retaining the physical properties of the cured material are disclosed. These liquid curing agents can be used for curing epoxy resins, or in combination with dicyandiamide (DICY) based curing agents in order to accelerate DICY curing.

Abstract: Liquid epoxy curing agents that have improved latency over conventional liquid curing agents while retaining the physical properties of the cured material are disclosed. These liquid curing agents can be used for curing epoxy resins, or in combination with dicyandiamide (DICY) based curing agents in order to accelerate DICY curing.

Abstract: Liquid epoxy curing agents that have improved latency over conventional liquid curing agents while retaining the physical properties of the cured material are disclosed. These liquid curing agents can be used for curing epoxy resins, or in combination with dicyandiamide (DICY) based curing agents in order to accelerate DICY curing.

Abstract: The disclosure relates to solving problems associated with conventional latent epoxy curing agents by providing a new class of latent epoxy curing agents. In particular, the disclosure relates to epoxy curing agents with improved storage stability and low use level (e.g., less than about 10 wt % relative to the epoxy compound) by forming solid solutions of certain classes of amines in polyphenolic resins.

Abstract: An epoxide based composition that can be cured at a temperature of less than about 70 C is disclosed. The composition is a liquid at ambient conditions and, therefore, can be used to rehabilitate the interior surfaces of pipelines. The epoxide-based composition comprises at least one epoxide component (component A) and at least one curing agent component (component B) wherein (A) the epoxide component comprises a phenyl glycidyl ether polyepoxide; and (B) the curing agent component comprises a mixture of two salt compounds formed, respectively, from an N-alkanol piperidine and a carboxylic acid bearing 7-12 carbon atoms, and N-cyclohexyl-N,N-dialkyl amine and a carboxylic acid bearing 7-12 carbon atoms.

Abstract: Carboxylic acid salts of tertiary amines for use as an accelerator for an anhydride based epoxy curing agents are disclosed. The disclosed carboxylic acid salts of certain tertiary amines are latent anhydride accelerators and enable epoxy resin curing when heated to an elevated temperature (e.g., an onset temperature of greater than about 50° C.).

Abstract: The disclosure relates to solving problems associated with conventional latent epoxy curing agents by providing a new class of latent epoxy curing agents. In particular, the disclosure relates to epoxy curing agents with improved storage stability and low use level (e.g., less than about 10 wt % relative to the epoxy compound) by forming solid solutions of certain classes of amines in polyphenolic resins.

Abstract: Liquid epoxy curing agents that have improved latency over conventional liquid curing agents while retaining the physical properties of the cured material are disclosed. These liquid curing agents can be used for curing epoxy resins, or in combination with dicyandiamide (DICY) based curing agents in order to accelerate DICY curing.

Abstract: Carboxylic acid salts of tertiary amines for use as an accelerator for an anhydride based epoxy curing agents are disclosed. The disclosed carboxylic acid salts of certain tertiary amines are latent anhydride accelerators and enable epoxy resin curing when heated to an elevated temperature (e.g., an onset temperature of greater than about 50° C.).

Abstract: An epoxy composition comprising the contact product of a filler, an epoxy resin and an amine component comprising a mixture of mono-, di-, tri- and tetra-substituted amines of structure 1 where R1 is CH2CH2CH2NH2; R2, R3 and R4 independently are H or CH2CH2CH2NH2; and X is CH2CH2 or CH2CH2CH2, in parts by weight (pbw) of 0-20 pbw mono-substituted amine, 60-95 pbw di-substituted amine, 0-20 pbw tri-substituted amine, and 0-10% tetra-substituted amine. The compositions are useful to produce coatings, adhesives, floorings, composites and other articles.

Abstract: A heat curable, a one-component epoxy protective or decorative coating or adhesive composition comprising an epoxy resin, acid anhydride latent heat activated curing agent and an accelerator for the acid anhydride curing agent characterized in that 2-phenylimidazole phosphate salt is the accelerator.

Abstract: A heat curable, a one-component epoxy protective or decorative coating or adhesive composition comprising an epoxy resin, dicyandiamide latent heat activated curing agent and an accelerator for the dicyandiamide curing agent characterized in that an imidazole phosphate salt is the accelerator.

Abstract: Curative compositions of amine terminated polyamide resins blended with a deaminated bis-(p-aminocyclohexyl)methane composition (DeAms) are useful for curing adhesive epoxy resin compositions. The polyamides comprise combinations of fatty mono-acids, dimer acids, polyethyleneamines, and piperazine ring containing polyamines which are piperazine or N-aminoalkylpiperazine, where the alkyl chain is a C2 to C6 alkyl chain, wherein the ratio of equivalents of fatty mono-acid to dimer acid can range from about 0.001:1 to about 1:1, the ratio of moles of piperazine ring containing polyamine to polyethylene amine can range from about 0.1:1 to about 1:1, and the ratio of moles of polyamine to equivalents of acid can range from about 0.6:1 to about 1.2:1. DeAms is blended at 2 to 40 wt % based on polyamide. Adhesive compositions comprising these curatives are also disclosed.