Abstract: Voids are introduced in a copper shape to reduce warpage experienced by a printed circuit board during a reflow process. Copper shapes on an outer layer of a printed circuit board may be used to connect large packages that include ball grid arrays to the printed circuit board. The copper shapes may induce warpage in the printed circuit board during the reflow process. Routing a mesh pattern of voids in the copper shapes may reduce solder ball joint cracking and pad cratering during reflow and make solder joints more reliable. The voids may make the copper shapes less ridged and change the copper heat dissipation profile to remove sharp warpage forces that cause solder joints to experience pad cratering. The voids may be 8 mil x 8 mil cuts or indentations in the copper shape.

Abstract: Voids are introduced in a copper shape to reduce warpage experienced by a printed circuit board during a reflow process. Copper shapes on an outer layer of a printed circuit board may be used to connect large packages that include ball grid arrays to the printed circuit board. The copper shapes may induce warpage in the printed circuit board during the reflow process. Routing a mesh pattern of voids in the copper shapes may reduce solder ball joint cracking and pad cratering during reflow and make solder joints more reliable. The voids may make the copper shapes less ridged and change the copper heat dissipation profile to remove sharp warpage forces that cause solder joints to experience pad cratering. The voids may be 8 mil×8 mil cuts or indentations in the copper shape.

Abstract: Voids are introduced in a copper shape to reduce warpage experienced by a printed circuit board during a reflow process. Copper shapes on an outer layer of a printed circuit board may be used to connect large packages that include ball grid arrays to the printed circuit board. The copper shapes may induce warpage in the printed circuit board during the reflow process. Routing a mesh pattern of voids in the copper shapes may reduce solder ball joint cracking and pad cratering during reflow and make solder joints more reliable. The voids may make the copper shapes less ridged and change the copper heat dissipation profile to remove sharp warpage forces that cause solder joints to experience pad cratering. The voids may be 8 mil×8 mil cuts or indentations in the copper shape.

Abstract: Systems, methods, and software are disclosed herein that enhance data storage operations. In various implementations, a preserve write process identifies one or more regions of the solid-state memory components that qualify to be relocated prior to a data storage device entering a data retention state. Prior to the data retention state, the process changes one or more values, of one or more write settings, to one or more new values. With the write settings changed to the one or more new values, the process relocates data from the one or more regions to one or more new regions. After having relocated the data, the process returns the one or more new values, of the one or more write settings, to one or more earlier values.

Abstract: Systems, methods, and software are disclosed herein that enhance data storage operations. In various implementations, a preserve write process identifies one or more regions of the solid-state memory components that qualify to be relocated prior to a data storage device entering a data retention state. Prior to the data retention state, the process changes one or more values, of one or more write settings, to one or more new values. With the write settings changed to the one or more new values, the process relocates data from the one or more regions to one or more new regions. After having relocated the data, the process returns the one or more new values, of the one or more write settings, to one or more earlier values.