Abstract: A substrate handling system, that includes (i) a vacuum booster for generating a pulse of first vacuum flow; (ii) a reference vacuum source for producing a reference vacuum flow; and (iii) an vacuum flow control unit that is configured to: (a) combine, during a boost period, the first and reference vacuum flows to provide a combined vacuum flow that is provided, via conduits, to upper vacuum openings of a chuck, and (b) provide the reference vacuum flow to the upper vacuum openings during a substrate fastening period, wherein the chuck and the vacuum booster are spaced apart from each other and are mechanically coupled to a stage.

Abstract: A substrate handling system, that includes (i) a vacuum booster for generating a pulse of first vacuum flow; (ii) a reference vacuum source for producing a reference vacuum flow; and (iii) an vacuum flow control unit that is configured to: (a) combine, during a boost period, the first and reference vacuum flows to provide a combined vacuum flow that is provided, via conduits, to upper vacuum openings of a chuck, and (b) provide the reference vacuum flow to the upper vacuum openings during a substrate fastening period, wherein the chuck and the vacuum booster are spaced apart from each other and are mechanically coupled to a stage.

Abstract: A kinematic coupling for providing a preloading force without inducing deformation of the members being coupled, including a first member of a kinematic coupling, a second member of the kinematic coupling, and an attractive force component attached to at least one of the members of the kinematic coupling to attract the other member, wherein the attractive force component is located at a location coaxial with an axis of the kinematic coupling, thereby providing an attraction force between the first member and the second member directed along the axis of the kinematic coupling. Related apparatus and methods are also described.