Patents by Inventor Dima Simonian

Dima Simonian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Underfill process for flip-chip LEDs
    Patent number: 8273587
    Abstract: An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: September 25, 2012
    Assignee: Lumileds Lighting Company LLC
    Inventors: Grigoriy Basin, Frederic Diana, Paul S. Martin, Dima Simonian
  • UNDERFILL PROCESS FOR FLIP-CHIP LEDS
    Publication number: 20110223696
    Abstract: An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.
    Type: Application
    Filed: May 25, 2011
    Publication date: September 15, 2011
    Applicants: KONINKLIJKE PHILIPS ELECTRONICS N.V., PHILIPS LUMILEDS LIGHTING COMPANY, LLC
    Inventors: Grigoriy Basin, Frederic Diana, Paul S. Martin, Dima Simonian
  • UNDERFILL PROCESS FOR FLIP-CHIP LEDS
    Publication number: 20090230409
    Abstract: An underfill technique for LEDs uses compression molding to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer. The molding process causes liquid underfill material (or a softened underfill material) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top and sides of the LED dies is removed using microbead blasting. The exposed growth substrate is then removed from all the LED dies by laser lift-off, and the underfill supports the brittle epitaxial layers of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.
    Type: Application
    Filed: March 17, 2008
    Publication date: September 17, 2009
    Applicant: PHILIPS LUMILEDS LIGHTING COMPANY, LLC
    Inventors: Grigoriy Basin, Frederic Diana, Paul S. Martin, Dima Simonian