Patents by Inventor Dimitri Soccoi

Dimitri Soccoi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE HAVING AU-CU ELECTRODES, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20140159173
    Abstract: A method of manufacturing a biosensor semiconductor device in which copper electrodes at a major surface of the device are modified to form Au—Cu alloy electrodes. Such modification is effected by depositing a gold layer over the device, and then thermally treating the device to promote interdiffusion between the gold and the electrode copper. Alloyed gold-copper is removed from the surface of the device, leaving the exposed electrodes. The electrodes are better compatible with further processing into a biosensor device than is the case with conventional copper electrodes, and the process windows are wider than for gold capped copper electrodes. A biosensor semiconductor device having Au—Cu alloy electrodes is also disclosed.
    Type: Application
    Filed: February 4, 2014
    Publication date: June 12, 2014
    Applicant: NXP B.V.
    Inventors: David van Steenwinckel, Thomas Merelle, Franciscus Petrus Widdershoven, Viet Hoang Nguyen, Dimitri Soccoi, Jan Leo Dominique Fransaer
  • Semiconductor device having Au-Cu electrodes, and method of manufacturing semiconductor device
    Patent number: 8679966
    Abstract: A method of manufacturing a biosensor semiconductor device in which copper electrodes at a major surface of the device are modified to form Au—Cu alloy electrodes. Such modification is effected by depositing a gold layer over the device, and then thermally treating the device to promote interdiffusion between the gold and the electrode copper. Alloyed gold-copper is removed from the surface of the device, leaving the exposed electrodes. The electrodes are better compatible with further processing into a biosensor device than is the case with conventional copper electrodes, and the process windows are wider than for gold capped copper electrodes. A biosensor semiconductor device having Au—Cu alloy electrodes is also disclosed.
    Type: Grant
    Filed: August 7, 2012
    Date of Patent: March 25, 2014
    Assignee: NXP, B.V.
    Inventors: David Van Steenwinckel, Thomas Merelle, Franciscus Petrus Widdershoven, Viet Hoang Nguyen, Dimitri Soccoi, Jan Leo Dominique Fransaer