Abstract: Embodiments may be generally direct to apparatuses, systems, method, and techniques to determine a configuration for a plurality of connectors, the configuration to associate a first interconnect protocol with a first subset of the plurality of connectors and a second interconnect protocol with a second subset of the plurality of connectors, the first interconnect protocol and the second interconnect protocol are different interconnect protocols and each comprising one of a serial link protocol, a coherent link protocol, and an accelerator link protocol, cause processing of data for communication via the first subset of the plurality of connectors in accordance with the first interconnect protocol, and cause processing of data for communication via the second subset of the plurality of connector in accordance with the second interconnect protocol.

Abstract: A translation cache and configurable error checking and correction (“ECC”) memory reduces ECC memory overhead. The translation cache supports a configurable ECC memory capable of storing a portion of a cache line, along with any ECC data, in corresponding parts of memory devices to reduce the ECC memory overhead in a memory subsystem. The corresponding parts include any same one of an upper, lower, left or right part of memory devices in a memory module, including dynamic random access memory (“DRAM”) devices in a dual inline memory module (“DIMM”).

Abstract: An embodiment of an electronic apparatus may comprise one or more substrates, and a controller coupled to the one or more substrates, the controller to allocate a first secure portion of a pooled memory to a first instantiation of an application on a first node, and circuitry coupled to the one or more substrates and the controller, the circuitry to provide a failover interface for a second instantiation of the application on a second node to access the first secure portion of the pooled memory in the event of a failure of the first node. Other embodiments are disclosed and claimed.

Abstract: In one embodiment, an apparatus includes an interface to couple a plurality of devices of a system, the interface to enable communication according to a Compute Express Link (CXL) protocol, and a power management circuit coupled to the interface. The power management circuit may: receive, from a first device of the plurality of devices, a request according to the CXL protocol for updated power credits; identify at least one other device of the plurality of devices to provide at least some of the updated power credits; and communicate with the first device and the at least one other device to enable the first device to increase power consumption according to the at least some of the updated power credits. Other embodiments are described and claimed.

Abstract: An apparatus is described. The apparatus includes a logic chip upon which a stack of memory chips is to be placed. The stack of memory chips and the logic chip to be placed within a same package, wherein, multiple memory chips of the stack of memory chips are divided into fractions, and, multiple internal channels within the package that emanate from the logic chip are to be coupled to respective ones of the fractions. The logic chip has a multiplexer. The multiplexer is to multiplex a single input/output (I/O) channel of the package to the multiple internal channels.

Abstract: A semiconductor chip is described. The semiconductor chip includes memory address decoder logic circuitry comprising different memory address bit manipulation paths to respectively impose different memory interleaving schemes for memory accesses directed to artificial intelligence information in a memory and non artificial intelligence information in the memory. The artificial intelligence information is to be processed with artificial intelligence logic circuitry disposed locally to the memory.

Abstract: Embodiments may be generally direct to apparatuses, systems, method, and techniques to determine a configuration for a plurality of connectors, the configuration to associate a first interconnect protocol with a first subset of the plurality of connectors and a second interconnect protocol with a second subset of the plurality of connectors, the first interconnect protocol and the second interconnect protocol are different interconnect protocols and each comprising one of a serial link protocol, a coherent link protocol, and an accelerator link protocol, cause processing of data for communication via the first subset of the plurality of connectors in accordance with the first interconnect protocol, and cause processing of data for communication via the second subset of the plurality of connector in accordance with the second interconnect protocol.

Abstract: Embodiments may be generally direct to apparatuses, systems, method, and techniques to determine a configuration for a plurality of connectors, the configuration to associate a first interconnect protocol with a first subset of the plurality of connectors and a second interconnect protocol with a second subset of the plurality of connectors, the first interconnect protocol and the second interconnect protocol are different interconnect protocols and each comprising one of a serial link protocol, a coherent link protocol, and an accelerator link protocol, cause processing of data for communication via the first subset of the plurality of connectors in accordance with the first interconnect protocol, and cause processing of data for communication via the second subset of the plurality of connector in accordance with the second interconnect protocol.

Abstract: A system and method are described for integrating a memory and storage hierarchy including a non-volatile memory tier within a computer system. In one embodiment, PCMS memory devices are used as one tier in the hierarchy, sometimes referred to as “far memory.” Higher performance memory devices such as DRAM placed in front of the far memory and are used to mask some of the performance limitations of the far memory. These higher performance memory devices are referred to as “near memory.

Abstract: A persistence service for edge architected computing systems extends current storage and memory schemes of edge resources to expose interfaces to allow an endpoint, such as an IoT device or client device, to specify criteria for achieving persistence for data stored in an edge resource. The persistence interface extends the storage and memory controllers to store data in accordance with the criteria, including determining whether a local or remote edge resource is best able to store data persistently in a manner that satisfies the criteria. The criteria include a persistence service level agreement, including a required time to persistence, cost of persistence and reliability level of persistence. Only edge resources that contain media, including storage subsystems and/or memory, capable of storing data persistently while satisfying the criteria will be permitted to service the request.

Abstract: Semiconductor packages with programmable routing pathways are disclosed. The semiconductor package may have a source trace that may be electrically coupled to two or more different electrical pathways, where any of the electrical pathways may be activated to provide an electrical connection between the source trace and one or more destination nodes. Each of the electrical pathways may have a corresponding metal well with a correspond airgap overlying the metal well, as well as corresponding heating elements. If a particular heating element is energized, the heating element may melt metal in a corresponding metal well and the molten metal may migrate by capillary action into the overlying airgap to complete an electrical connection between the source trace and a destination node.

Abstract: Technologies for managing errors in a remotely accessible memory pool include a memory sled. The memory sled includes a memory pool having one or more byte-addressable memory devices and a memory pool controller coupled to the memory pool. The memory sled is to write test data to a byte-addressable memory region in the memory pool. The memory region is to be accessed by a remote compute sled. The memory sled is also to read data from the memory region to which the test data was written, compare the read data to the test data to determine whether a threshold number of errors are present in the read data, and send, in response to a determination that the threshold number of errors are present in the read data, a notification to the remote compute sled that the memory region is faulty.

Abstract: Technologies for providing remote access to a shared memory pool include a memory sled. The memory sled includes a memory pool having one or more byte-addressable memory devices and a memory pool controller coupled to the memory pool. The memory pool controller is to produce, for each of a plurality of compute sleds, address space data indicative of addresses of byte-addressable memory in the memory pool accessible to the compute sled, and corresponding permissions associated with the addresses. The memory pool controller is also to provide the address space data to each corresponding compute sled and receive, from a requesting compute sled of the plurality of compute sleds, a memory access request. The memory access request includes an address from the address space data to be accessed. The memory pool controller is also to perform, in response to receiving the memory access request, a memory access operation on the memory pool. Other embodiments are also described and claimed.

Abstract: Technologies for efficiently managing the allocation of memory in a shared memory pool include a memory sled. The memory sled includes a memory pool of byte-addressable memory devices. The memory sled also includes a memory pool controller coupled to the memory pool. The memory pool controller receives a request to provision memory to a compute sled. Further, the memory pool controller maps, in response to the request, each of the memory devices of the memory pool to the compute sled. The memory pool controller additionally assigns access rights to the compute sled as a function of one or more memory characteristics of the compute sled. The memory characteristics are indicative of an amount of memory in the memory pool to be used by the compute sled and the access rights are indicative of access permissions to one or more memory address ranges associated with the one or more memory devices.

Abstract: A semiconductor chip is described. The semiconductor chip includes memory address decoder logic circuitry comprising different memory address bit manipulation paths to respectively impose different memory interleaving schemes for memory accesses directed to artificial intelligence information in a memory and non artificial intelligence information in the memory. The artificial intelligence information is to be processed with artificial intelligence logic circuitry disposed locally to the memory.

Abstract: A system and method are described for integrating a memory and storage hierarchy including a non-volatile memory tier within a computer system. In one embodiment, PCMS memory devices are used as one tier in the hierarchy, sometimes referred to as “far memory.” Higher performance memory devices such as DRAM placed in front of the far memory and are used to mask some of the performance limitations of the far memory. These higher performance memory devices are referred to as “near memory.

Abstract: Systems and methods of implementing server architectures that can facilitate the servicing of memory components in computer systems. The systems and methods employ nonvolatile memory/storage modules that include nonvolatile memory (NVM) that can be used for system memory and mass storage, as well as firmware memory. The respective NVM/storage modules can be received in front or rear-loading bays of the computer systems. The systems and methods further employ single, dual, or quad socket processors, in which each processor is communicably coupled to at least some of the NVM/storage modules disposed in the front or rear-loading bays by one or more memory and/or input/output (I/O) channels. By employing NVM/storage modules that can be received in front or rear-loading bays of computer systems, the systems and methods provide memory component serviceability heretofore unachievable in computer systems implementing conventional server architectures.

Abstract: A system and method are described for integrating a memory and storage hierarchy including a non-volatile memory tier within a computer system. In one embodiment, PCMS memory devices are used as one tier in the hierarchy, sometimes referred to as “far memory.” Higher performance memory devices such as DRAM placed in front of the far memory and are used to mask some of the performance limitations of the far memory. These higher performance memory devices are referred to as “near memory.

Abstract: Technologies for migrating virtual machines (VMs) includes a plurality of compute sleds and a memory sled each communicatively coupled to a resource manager server. The resource manager server is configured to identify a compute sled of a for a virtual machine instance, allocate a first set of resources of the identified compute sled for the VM instance, associate a region of memory in a memory pool of a memory sled with the compute sled, and create the VM instance on the compute sled. The resource manager server is further configured to migrate the VM instance to another compute sled, associate the region of memory in the memory pool with the other compute sled, and start-up the VM instance on the other compute sled. Other embodiments are described herein.

Abstract: A rework grid array interposer with direct power is described. The interposer has a foundation layer mountable between a motherboard and a package. A heater is embedded in the foundation layer to provide local heat to reflow solder to enable at least one of attachment or detachment of the package. A connector is mounted on the foundation layer and coupled to the heater and to the package to provide a connection path directly with the power supply and not via the motherboard. One type of interposer interfaces with a package having a solderable extension. Another interposer has a plurality of heater zones embedded in the foundation layer.