Patents by Inventor Dimitris DROGOUDIS

Dimitris DROGOUDIS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging for MEMS transducers
    Patent number: 11299392
    Abstract: The Application describes a substrate design for a MEMS transducer package. The substrate is defined by a conductive layer which forms the upper and lower surfaces of the substrate. The substrate is also provided with a conductive portion which is electrically isolated from the rest of the conductive layer. The conductive portion is supported between a first plane defined by the upper surface of the substrate and a second plane defined by the lower surface of the substrate by an electrically insulating moulding substance.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: April 12, 2022
    Assignee: Cirrus Logic, Inc.
    Inventors: Rkia Achehboune, Roberto Brioschi, Dimitris Drogoudis, David Patten
  • PACKAGING FOR MEMS TRANSDUCERS
    Publication number: 20200377363
    Abstract: The Application describes a substrate design for a MEMS transducer package. The substrate is defined by a conductive layer which forms the upper and lower surfaces of the substrate. The substrate is also provided with a conductive portion which is electrically isolated from the rest of the conductive layer. The conductive portion is supported between a first plane defined by the upper surface of the substrate and a second plane defined by the lower surface of the substrate by an electrically insulating moulding substance.
    Type: Application
    Filed: May 7, 2020
    Publication date: December 3, 2020
    Applicant: Cirrus Logic International Semiconductor Ltd.
    Inventors: Rkia ACHEHBOUNE, Roberto BRIOSCHI, Dimitris DROGOUDIS, David PATTEN
  • MEMS packaging
    Patent number: 10735868
    Abstract: A package for a MEMS device, the package comprising a MEMS transducer within a chamber of the package; and a package substrate, wherein an upper surface of the package substrate defines at least part of a surface of the chamber; wherein the package substrate comprises a plurality of metal layers, the package substrate further comprising at least a part of a filter circuit for filtering RF signals, wherein a first metal layer is provided in a first plane of the substrate and wherein a resistor of the filter circuit is provided in a plane below the first plane.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: August 4, 2020
    Assignee: Cirrus Logic, Inc.
    Inventors: Rkia Achehboune, Dimitris Drogoudis, Roberto Brioschi, Aleksey Sergeyevich Khenkin, David Patten
  • MEMS transducer package
    Patent number: 10469956
    Abstract: A MEMS transducer package comprising a substrate; a filter circuit for filtering RF signals, the filter circuit comprising a resistor and a capacitor; and an IPD chip; wherein at least a portion of the filter circuit is provided within the IPD chip.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: November 5, 2019
    Assignee: Cirrus Logic, Inc
    Inventors: Aleksey Sergeyevich Khenkin, David Patten, Dimitris Drogoudis
  • MEMS PACKAGING
    Publication number: 20190158962
    Abstract: A package for a MEMS device, the package comprising a MEMS transducer within a chamber of the package; and a package substrate, wherein an upper surface of the package substrate defines at least part of a surface of the chamber; wherein the package substrate comprises a plurality of metal layers, the package substrate further comprising at least a part of a filter circuit for filtering RF signals, wherein a first metal layer is provided in a first plane of the substrate and wherein a resistor of the filter circuit is provided in a plane below the first plane.
    Type: Application
    Filed: November 2, 2018
    Publication date: May 23, 2019
    Applicant: Cirrus Logic International Semiconductor Ltd.
    Inventors: Rkia ACHEHBOUNE, Dimitris DROGOUDIS, Roberto BRIOSCHI, Aleksey Sergeyevich KHENKIN, David PATTEN
  • MEMS Transducer Package
    Publication number: 20180279057
    Abstract: A MEMS transducer package comprising a substrate; a filter circuit for filtering RF signals, the filter circuit comprising a resistor and a capacitor; and an IPD chip; wherein at least a portion of the filter circuit is provided within the IPD chip.
    Type: Application
    Filed: December 22, 2017
    Publication date: September 27, 2018
    Applicant: Cirrus Logic International Semiconductor Ltd.
    Inventors: Aleksey Sergeyevich KHENKIN, David PATTEN, Dimitris DROGOUDIS