Abstract: An electrical connector assembly 2 for use in connecting parallel printed circuit boards includes a receptacle connector 4 and a plug connector 6. The receptacle connector 4 includes receptacle contacts 8, each of which includes a surface mount solder tail 16 and a mating contact section in the form of a resilient arm 26 on opposite sides of a sealing pad 18 that seals a contact insertion opening 38 when the receptacle contact 8 is fully inserted. The mating contact portion is therefore isolated from contaminating materials, such as solder flux during surface mount solder operations. The height of the connector assembly 2 can be adjusted by using plug connectors 6 of different heights with a universal receptacle connector 4. The height of the side walls 60 on the plug housing 12, between a plug mating section and contact retention section is changed for different plug connector heights.

Abstract: A method of forming relatively hard materials is disclosed. The method includes providing tooling for performing the forming operation on a strip (10) of relatively hard material. The tooling includes a forming tool (22) and a mating die (24) coupled to a high speed stamping and forming machine (70). The tooling and machine are arranged so that the forming operation is performed within a time period that is less than the stress relaxation time constant for the material being formed.

Abstract: A connector for electrically connecting circuit members having a high density of contact pads located in an area array, the connector having an area array specific holder that is simple to produce for retainably positioning mass-produced standardized contact modules containing a deformable contact within a module body for interconnecting the contact pads, where the contact is constructed to be supportingly engaged by the module body to provide sufficient opposing spring force to effect a wiping interconnection between the contact and the contact pads.

Abstract: An improved contact for use in a high density chip carrier socket mounted on a circuit member which utilizes a cover which to wedge the leads of the chip carrier into electrical engagement with a respective contact. A tool receiving recess is incorporated into the contact so that the forces exerted on the socket while pressing the cover into place can be opposed, minimizing the forces exerted on the connection between the socket and the circuit member, typically a solder joint. Providing a tool, that operates from one side of the circuit member, in order to press the cover into place while engaging the contact recess to oppose the insertion related forces, which can also pull the cover from the contacts, without exerting significant forces on the connection, by engaging a lip in the cover while pressing on the carrier.

Abstract: A wire length having a very small diameter is terminated to a contact member by forming a groove in the contact member, disposing the wire length entirely within and along the groove, and striking the surface of the contact on both sides of the groove deforming the sides of the groove downwardly and inwardly into the groove firmly against the wire therein. The contact members can be made in lead frames on a carrier strip and have grooves formed therein, the wire can be placed in the grooves and terminated to the contact members in an automated assembly to make, for example, fuse components where wire segments bridge gaps between associated contact sections of pairs of the contact members, and the lead frames can have housings molded thereto while on the carrier strip.

Abstract: A connector, method and alignment device for connecting single-mode optical fibers are provided. The connector is characterized by a deformable, elongated base for supporting two coaxial fibers and a meltable slug which secures the fibers to the base in a nondamageable manner upon melting and resolidification. The method addresses employing the connector to affix the fibers. The device, employed in combination with the connector, includes two translatable clamps to distort the connector base thereby aligning the fibers optical cores in a substantially coaxial relationship.

Abstract: A multicontact electrical connector comprises an insulating housing having a substrate-receiving face. A trough-like opening extends into the face for reception of a substrate. In the housing are spaced-apart terminals having free ends which are proximate to the substrate-receiving face and fixed ends which are proximate to an inner end of the opening. Contact surfaces are on the free ends for contacting spaced-apart terminal pads on the substrate. Contact engagement camming means are provided for flexing the terminals and moving the free ends from the opening allowing the substrate to be placed in the opening under reduced insertion force conditions. As the free ends of the terminals are subsequently moved, the contact surfaces of the free ends will be resiliently biased against the terminal pads. Contact wipe camming means are provided to move the contact surfaces across the terminal pads as normal force occurs permitting a wiping action to take place.

Abstract: A contact socket having ends and an intermediate portion for receiving a contact pin. The intermediate portion has a plurality of resilient beams which are designed to provide the necessary contact force while maintaining the insertion force at a low level. The beams are also designed to allow for improper insertion of the pin into the contact socket without damaging the resilient beams so that no permanent set of the beams takes place.

Abstract: Apparatus for accurately and automatically aligning a pair of optical fibers in abutting end-to-end relationship. The apparatus includes an optical fiber holder having an opening in substantially the exact center of one end thereof for supporting the end of an optical fiber therein. The holder comprises a one-piece, cylindrical-shaped housing having integral centering elements around the periphery thereof. The centering elements cooperate with the wall of a bore in a connector member within which the holder is adapted to be inserted to automatically center the housing within the bore, and hence, to automatically align the end of the optical fiber with the bore axis.When a second, similarly constructed holder supporting the end of a second optical fiber is also inserted into the bore of the connector member with their respective one ends in abutting end-to-end relationship, the ends of the two optical fibers will automatically be aligned with the bore axis and, hence, with each other.

Abstract: Chip carrier socket 2 comprises a socket body 24 having a rectangular base 30 and walls 34 extending normally from the edges 32 of the base. The walls can be pivotally moved inwardly of the recess which is defined by the walls after a chip carrier 12 has been placed in the recess. A frame 28 is provided in surrounding relationship to the walls 34 and is movable relative thereto between a first position and a second position. When the frame 28 is moved to the second position, the walls 34 are moved inwardly thereby to move the contact terminals 26 in the walls against terminal pads 20 on the leadless chip carrier 12. The frame 28 also may have an ejector means integral therewith which will eject the chip carrier from the socket when the frame is moved from a second position to the first position. The frame may also cam the walls outwardly to permit placement of the chip carrier in the recess under ZIF conditions.

Abstract: A device for optically coupling a fiber to a solid state laser is taught. Briefly stated, a fiber is held by a pedestal or holder and, after alignment between the fiber and the laser, the holder is attached to the same mounting platform upon which the laser is also mounted. The holding or attachment material exhibits the same thermal properties as the base material, thereby minimizing any thermal expansion or contraction which would cause misalignment between the fiber and the laser.

Abstract: A device for producing a hermetically sealed chip carrier is taught. Briefly stated, a sealing or perimeter ring is formed on a substrate with an appropriate lead pattern and IC chip contained within this ring. Vias or ducts are disposed in the substrate with metal lead pedestals contained therein which provide electrical connection through the substrate and therefore between the lead pattern contained inside the sealing ring and the lead patterns on the outside of the sealing ring. This therefore allows for a continuous sealing ring such that a cap may be placed on top of the sealing ring and bonded by methods such as welding so as to form a hermetically sealed enclosure.

Abstract: A miniature circuit board edge connector assembly includes an insulative housing 2, electrical spring blades 12A in the housing, conductor portions 12B pivotally interlocked with the spring blades 12A and pivotally impinged against corresponding conductive post portions 11, a cam 30 resiliently flexes the spring blades 12A, causing the conductor portions to pivot and engage circuit conductors 37 of a circuit board 38, and to provide circuit paths, from this circuit conductors 37 to the post portions 11, that are shorter than the lengths of the spring blades 12A.

Abstract: A miniature circuit board edge connector assembly includes an insulative housing 2, electrical spring blades 12A in the housing, conductor portions 12B pivotally interlocked with the spring blades 12A and pivotally impinged against corresponding conductive post portions 11, a cam 30 resiliently flexes the spring blades 12A, causing the conductor portions to pivot and engage circuit conductors 37 of a circuit board 38, and to provide circuit paths, from the circuit conductors 37 to the post portions 11, that are shorter than the lengths of the spring blades 12A.

Abstract: A lead frame and chip carrier housing are disclosed which can be used in packaging integrated circuit chips of a range of sizes and requiring varying numbers of leads in the lead frame. The lead frame comprises a centrally located square support portion having simple leads extending from its side edges and having composite leads extending from its corners. Each of the composite leads comprises a trunk lead and branch leads which extend from the side edges of the trunk lead. A relatively small integrated circuit chip can be used with the lead frame by removing only the support portion, locating the chip adjacent to the opening and connecting the simple leads only to the terminal areas of the chip.