Patents by Inventor Din-Ghee Neoh

Din-Ghee Neoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210375787
    Abstract: The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.
    Type: Application
    Filed: May 17, 2021
    Publication date: December 2, 2021
    Applicants: STMICROELECTRONICS S.R.L., STMICROELECTRONICS INTERNATIONAL N.V.
    Inventors: Paolo CREMA, Jürgen BARTHELMES, Din-Ghee NEOH
  • Patent number: 11011476
    Abstract: The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: May 18, 2021
    Assignees: STMICROELECTRONICS INTERNATIONAL N.V., STMICROELECTRONICS S.R.L.
    Inventors: Paolo Crema, Jürgen Barthelmes, Din-Ghee Neoh
  • Patent number: 10867895
    Abstract: A lead-frame structure having two faces and exposing a treated silver surface on at least one of said two faces, the treated silver surface(s) serving the wire bonding, which lead-frame structure has a surface which, after applying resin to it, has excellent adhesion even under severe testing conditions, such as the IPC/JEDEC J-STD-20 MSL standard, and a surface mount electronic device comprising a lead-frame or lead-frame entity and at least one semiconductor device mounted thereon, wherein the lead-frame or lead-frame entity exposes a treated silver surface on at least one of the two faces thereof, wherein the treated silver surface(s) serve(s) the wire bonding, and wherein a resin is applied to the lead-frame or lead-frame entity, and which surface mount electronic device has excellent adhesion of the surface of the lead-frame or lead-frame entity even under severe testing conditions.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: December 15, 2020
    Assignee: Atotech Deutschland GmbH
    Inventors: Din-Ghee Neoh, Jürgen Barthelmes
  • Patent number: 10832997
    Abstract: A method of producing a lead-frame structure having two faces and exposing a treated silver surface on at least one of the two faces, the treated silver surface(s) serving the wire bonding, which yields a surface which, after applying resin to it, has excellent adhesion even under severe testing conditions, such as the IPC/JEDEC J-STD-20 MSL standard, and a method of producing a surface mount electronic device including a lead-frame or lead-frame entity and at least one semiconductor device mounted thereon, wherein the lead-frame or lead-frame entity exposes a treated silver surface on at least one of the two faces, wherein the treated silver surface(s) serve(s) the wire bonding, and wherein a resin is applied to the lead-frame or lead-frame entity, which method yields excellent adhesion of the surface of the lead-frame or lead-frame entity even under severe testing conditions.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: November 10, 2020
    Assignee: Atotech Deutschland GmbH
    Inventors: Din-Ghee Neoh, Jürgen Barthelmes
  • Publication number: 20190279942
    Abstract: The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.
    Type: Application
    Filed: March 11, 2019
    Publication date: September 12, 2019
    Inventors: Paolo Crema, Jürgen Barthelmes, Din-Ghee Neoh
  • Publication number: 20190271093
    Abstract: To achieve tin deposits being largely free of pressure induced whiskers, a method of depositing a tin layer on a metal substrate is devised, wherein said method comprises: (a) providing said metal substrate; (b) depositing a nickel/phosphorous alloy underlayer on at least one surface of said metal substrate; and (c) depositing said tin layer on said nickel/phosphorous alloy underlayer by depositing said tin layer comprising using a pulse plating method.
    Type: Application
    Filed: October 24, 2017
    Publication date: September 5, 2019
    Applicant: Atotech Deutschland GmbH
    Inventors: Din-Ghee NEOH, Chee-Chow TAN, Jen Joo LIM, Robert RÜTHER, Jürgen BARTHELMES, Olaf KURTZ
  • Publication number: 20190172777
    Abstract: A lead-frame structure having two faces and exposing a treated silver surface on at least one of said two faces, the treated silver surface(s) serving the wire bonding, which lead-frame structure has a surface which, after applying resin to it, has excellent adhesion even under severe testing conditions, such as the IPC/JEDEC J-STD-20 MSL standard, and a surface mount electronic device comprising a lead-frame or lead-frame entity and at least one semiconductor device mounted thereon, wherein the lead-frame or lead-frame entity exposes a treated silver surface on at least one of the two faces thereof, wherein the treated silver surface(s) serve(s) the wire bonding, and wherein a resin is applied to the lead-frame or lead-frame entity, and which surface mount electronic device has excellent adhesion of the surface of the lead-frame or lead-frame entity even under severe testing conditions.
    Type: Application
    Filed: September 10, 2018
    Publication date: June 6, 2019
    Inventors: Din-Ghee NEOH, Jürgen BARTHELMES
  • Publication number: 20190080930
    Abstract: A method of producing a lead-frame structure having two faces and exposing a treated silver surface on at least one of the two faces, the treated silver surface(s) serving the wire bonding, which yields a surface which, after applying resin to it, has excellent adhesion even under severe testing conditions, such as the IPC/JEDEC J-STD-20 MSL standard, and a method of producing a surface mount electronic device including a lead-frame or lead-frame entity and at least one semiconductor device mounted thereon, wherein the lead-frame or lead-frame entity exposes a treated silver surface on at least one of the two faces, wherein the treated silver surface(s) serve(s) the wire bonding, and wherein a resin is applied to the lead-frame or lead-frame entity, which method yields excellent adhesion of the surface of the lead-frame or lead-frame entity even under severe testing conditions.
    Type: Application
    Filed: March 10, 2017
    Publication date: March 14, 2019
    Inventors: Din-Ghee NEOH, Jürgen BARTHELMES
  • Publication number: 20160222523
    Abstract: The invention concerns processes and solutions for the treatment of copper alloy surfaces, which are subsequently to be firmly bonded to polymeric material. The solution is used, in particular for firmly bonding lead frames to encapsulating molding compounds (polymeric material). The solution contains an oxidant, at least one acid, at least one adhesion-enhancing compound characterized in that the solution additionally contains fluoride ions in an amount of at least 100 mg per litre and chloride ions in an amount of 5 to 40 mg per litre. The solution is particularly useful for treatment of copper alloy surfaces, containing alloying elements selected from the group consisting of Si, Ni, Fe, Zr, P, Sn and Zn.
    Type: Application
    Filed: April 11, 2016
    Publication date: August 4, 2016
    Inventors: Christian Wunderlich, Jurgen Barthelmes, Kiyoshi Watanabe, Din-Ghee Neoh, Patrick Lam
  • Publication number: 20160168722
    Abstract: The invention concerns processes and solutions for the treatment of copper alloy surfaces, which are subsequently to be firmly bonded to polymeric material. The solution is used, in particular for firmly bonding lead frames to encapsulating molding compounds (polymeric material). The solution contains an oxidant, at least one acid, at least one adhesion-enhancing compound characterized in that the solution additionally contains fluoride ions in an amount of at least 100 mg per litre and chloride ions in an amount of 5 to 40 mg per litre. The solution is particularly useful for treatment of copper alloy surfaces, containing alloying elements selected from the group consisting of Si, Ni, Fe, Zr, P, Sn and Zn.
    Type: Application
    Filed: February 11, 2016
    Publication date: June 16, 2016
    Inventors: Christian Wunderlich, Jurgen Barthelmes, Kiyoshi Watanabe, Din-Ghee Neoh, Patrick Lam
  • Publication number: 20100288731
    Abstract: The invention concerns processes and solutions for the treatment of copper alloy surfaces, which are subsequently to be firmly bonded to polymeric material. The solution is used, in particular for firmly bonding lead frames to encapsulating molding compounds (polymeric material). The solution contains an oxidant, at least one acid, at least one adhesion-enhancing compound characterized in that the solution additionally contains fluoride ions in an amount of at least 100 mg per litre and chloride ions in an amount of 5 to 40 mg per litre. The solution is particularly useful for treatment of copper alloy surfaces, containing alloying elements selected from the group consisting of Si, Ni, Fe, Zr, P, Sn and Zn.
    Type: Application
    Filed: January 31, 2007
    Publication date: November 18, 2010
    Inventors: Christian Wunderlich, Jürgen Barthelmes, Kiyoshi Watanabe, Din-Ghee Neoh, Patrick Lam