Patents by Inventor Din-Ru YANG

Din-Ru YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230024109
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a first doped region formed in the substrate, a second doped region formed in the substrate and surrounding the first doped region, and a plurality of strip third doped regions formed in the substrate and located underneath the first doped region and the second doped region. In addition, the first doped region has a doping type which is the opposite of that of the second doped region. The strip third doped region has a doping type which is the same as that of the second doped region.
    Type: Application
    Filed: October 6, 2022
    Publication date: January 26, 2023
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Shih-Chieh CHIEN, Chia-Hao LEE, Din-Ru YANG, Chia-Shen LIU
  • Publication number: 20210343837
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a plurality of strip first doped regions formed in the substrate, a plurality of strip second doped regions formed in the substrate and respectively located between the strip first doped regions, a third doped region formed in the substrate and surrounding the strip first doped regions and the strip second doped regions, and a fourth doped region formed in the substrate and located underneath the strip first doped regions, the strip second doped regions and the third doped region. The doping type of the strip first doped region is the opposite of that of the strip second doped region. The doping type of the third doped region is the same as that of the strip second doped region. The doping type of the fourth doped region is the same as that of the strip second doped region.
    Type: Application
    Filed: May 1, 2020
    Publication date: November 4, 2021
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Shih-Chieh CHIEN, Chia-Hao LEE, Din-Ru YANG, Chia-Shen LIU