Patents by Inventor Dinesh Kanawade
Dinesh Kanawade has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190375105Abstract: Electronic device processing systems may include a mainframe housing having a transfer chamber, a first carousel assembly, a second carousel assembly, a first load lock, a second load lock, and a robot adapted to operate in the transfer chamber to exchange substrates between the first and second carousels and the first and second load locks. The robot may include first and second end effectors operable to extend and/or retract simultaneously or sequentially along substantially co-parallel lines of action. Methods and multi-axis robots for transporting substrates are described, as are numerous other aspects.Type: ApplicationFiled: August 21, 2019Publication date: December 12, 2019Inventors: William T. Weaver, Malcolm N. Daniel, JR., Robert B. Vopat, Jason M. Schaller, Jacob Newman, Dinesh Kanawade, Andrew J. Constant, Stephen C. Hickerson, Jeffrey C. Hudgens, Marvin L. Freeman
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Patent number: 10427303Abstract: Electronic device processing systems may include a mainframe housing having a transfer chamber, a first carousel assembly, a second carousel assembly, a first load lock, a second load lock, and a robot adapted to operate in the transfer chamber to exchange substrates between the first and second carousels and the first and second load locks. The robot may include first and second end effectors operable to extend and/or retract simultaneously or sequentially along substantially co-parallel lines of action. Methods and multi-axis robots for transporting substrates are described, as are numerous other aspects.Type: GrantFiled: March 14, 2014Date of Patent: October 1, 2019Assignee: Applied Materials, Inc.Inventors: William T. Weaver, Malcolm N. Daniel, Jr., Robert B. Vopat, Jason M. Schaller, Jacob Newman, Dinesh Kanawade, Andrew J. Constant, Stephen C. Hickerson, Jeffrey C. Hudgens, Marvin L. Freeman
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Patent number: 10109514Abstract: Embodiments of the present disclosure generally relate to methods and apparatus for visual lamp failure detection in a processing chamber, such as an RTP chamber. Visual feedback is facilitated through the use of a wide-angle lens positioned to view lamps within the process chamber. The wide-angle lens is positioned within a probe and secured using a spring in order to withstand high temperature processing. A camera coupled to the lens is adapted to capture an image of the lamps within the process chamber. The captured image of the lamps is then compared to a reference image to determine if the lamps are functioning as desired.Type: GrantFiled: August 14, 2017Date of Patent: October 23, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Kim Vellore, Dinesh Kanawade, Stephen Moffatt, Aaron Miller, Leonid M. Tertitski, Norman L. Tam, Michael Liu, Colin Fox
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Publication number: 20170345693Abstract: Embodiments of the present disclosure generally relate to methods and apparatus for visual lamp failure detection in a processing chamber, such as an RTP chamber. Visual feedback is facilitated through the use of a wide-angle lens positioned to view lamps within the process chamber. The wide-angle lens is positioned within a probe and secured using a spring in order to withstand high temperature processing. A camera coupled to the lens is adapted to capture an image of the lamps within the process chamber. The captured image of the lamps is then compared to a reference image to determine if the lamps are functioning as desired.Type: ApplicationFiled: August 14, 2017Publication date: November 30, 2017Inventors: Kim VELLORE, Dinesh KANAWADE, Stephen MOFFATT, Aaron MILLER, Leonid M. TERTITSKI, Norman L. TAM, Michael LIU, Colin FOX
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Patent number: 9735034Abstract: Embodiments of the present disclosure generally relate to methods and apparatus for visual lamp failure detection in a processing chamber, such as an RTP chamber. Visual feedback is facilitated through the use of a wide-angle lens positioned to view lamps within the process chamber. The wide-angle lens is positioned within a probe and secured using a spring in order to withstand high temperature processing. A camera coupled to the lens is adapted to capture an image of the lamps within the process chamber. The captured image of the lamps is then compared to a reference image to determine if the lamps are functioning as desired.Type: GrantFiled: August 11, 2014Date of Patent: August 15, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Kim Vellore, Dinesh Kanawade, Stephen Moffatt, Aaron Miller, Leonid M. Tertitski, Norman L. Tam, Michael Liu, Colin Fox
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Patent number: 9508576Abstract: Embodiments of the present invention relate to improvements to single-substrate, multi-chamber processing platform architecture for minimizing fabrication facility floor space requirements. Prior art systems require significant floor space around all sides to allow for adequate installation and servicing. Embodiments of the present invention provide platforms that allow for servicing the chambers and supporting systems via a front and rear of the platform allowing multiple, side-by-side platform placement within a fabrication facility, while providing improved serviceability of the platform components.Type: GrantFiled: June 1, 2012Date of Patent: November 29, 2016Assignee: Applied Materials, Inc.Inventors: Jacob Newman, Dinesh Kanawade, Miriam Schwartz, Nir Merry, Michael Thomas Haag
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Patent number: 9281222Abstract: A wafer handling system may include upper and lower linked robot arms that may move a wafer along a nonlinear trajectory between chambers of a semiconductor processing system. These features may result in a smaller footprint in which the semiconductor processing system may operate, smaller transfer chambers, smaller openings in process chambers, and smaller slit valves, while maintaining high wafer throughput. In some embodiments, simultaneous fast wafer swaps between two separate chambers, such as load locks and ALD (atomic layer deposition) carousels, may be provided. Methods of wafer handling are also provided, as are other aspects.Type: GrantFiled: March 10, 2014Date of Patent: March 8, 2016Assignee: Applied Materials, Inc.Inventors: William Tyler Weaver, Malcolm N. Daniel, Jr., Robert B. Vopat, Jason M. Schaller, Jacob Newman, Dinesh Kanawade, Andrew J. Constant, Stephen C. Hickerson, Jeffrey C. Hudgens, Marvin L. Freeman
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Publication number: 20150131698Abstract: Embodiments of the present invention generally relate to methods and apparatus for monitoring substrate temperature uniformity in a processing chamber, such as an RTP chamber. Substrate temperature is monitored using an infrared camera coupled to a probe having a wide-angle lens. The wide-angle lens is positioned within the probe and secured using a spring, and is capable of withstanding high temperature processing. The wide angle lens facilities viewing of substantially the entire surface of the substrate in a single image. The image of the substrate can be compared to a reference image to facilitate lamp adjustments, if necessary, to effect uniform heating of the substrate.Type: ApplicationFiled: October 17, 2014Publication date: May 14, 2015Inventors: Kim VELLORE, Dinesh KANAWADE, Leonid M. TERTITSKI, Norman L. TAM, Aaron Muir HUNTER
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Publication number: 20150041453Abstract: Embodiments of the present disclosure generally relate to methods and apparatus for visual lamp failure detection in a processing chamber, such as an RTP chamber. Visual feedback is facilitated through the use of a wide-angle lens positioned to view lamps within the process chamber. The wide-angle lens is positioned within a probe and secured using a spring in order to withstand high temperature processing. A camera coupled to the lens is adapted to capture an image of the lamps within the process chamber. The captured image of the lamps is then compared to a reference image to determine if the lamps are functioning as desired.Type: ApplicationFiled: August 11, 2014Publication date: February 12, 2015Inventors: Kim VELLORE, Dinesh KANAWADE, Stephen MOFFATT, Aaron MILLER, Leonid M. TERTITSKI, Norman L. TAM, Michael LIU, Colin FOX
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Publication number: 20140271050Abstract: A wafer handling system may include upper and lower linked robot arms that may move a wafer along a nonlinear trajectory between chambers of a semiconductor processing system. These features may result in a smaller footprint in which the semiconductor processing system may operate, smaller transfer chambers, smaller openings in process chambers, and smaller slit valves, while maintaining high wafer throughput. In some embodiments, simultaneous fast wafer swaps between two separate chambers, such as load locks and ALD (atomic layer deposition) carousels, may be provided. Methods of wafer handling are also provided, as are other aspects.Type: ApplicationFiled: March 10, 2014Publication date: September 18, 2014Inventors: William Tyler Weaver, Malcolm N. Daniel, JR., Robert B. Vopat, Jason M. Schaller, Jacob Newman, Dinesh Kanawade, Andrew J. Constant, Stephen C. Hickerson, Jeffrey C. Hudgens, Marvin L. Freeman
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Publication number: 20140271055Abstract: Electronic device processing systems are described. The system includes a mainframe housing having a transfer chamber, a first facet, a second facet opposite the first facet, a third facet, and a fourth facet opposite the third facet, a first carousel assembly coupled to a first facet, a second carousel assembly coupled to the third facet, a first load lock coupled to the second facet, a second load lock coupled to the fourth facet, and a robot adapted to operate in the transfer chamber to exchange substrates from the first and second carousels. Methods and multi-axis robots for transporting substrates are described, as are numerous other aspects.Type: ApplicationFiled: March 14, 2014Publication date: September 18, 2014Inventors: William T. Weaver, Malcolm N. Daniel, JR., Robert B. Vopat, Jason M. Schaller, Jacob Newman, Dinesh Kanawade, Andrew J. Constant, Stephen C. Hickerson, Jeffrey C. Hudgens, Marvin L. Freeman
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Patent number: 8382180Abstract: An apparatus for transferring substrates in a processing system where the substrate is exposed to high temperatures is provided. In one embodiment a blade for transporting a substrate is provided. The blade comprises a base having an arcuate lateral shoulder, a first finger extending outward from and perpendicular to the base, a second finger extending outward from the base and parallel to and spaced-apart from the first finger, a first support tab configured to support the substrate and positioned along the arcuate lateral shoulder, a second support tab configured to support the substrate and coupled with the first finger, and a third support tab configured to support the substrate coupled with the second finger, wherein the arcuate lateral shoulder extends from an outer edge of the first finger to an outer edge of the second finger.Type: GrantFiled: October 30, 2008Date of Patent: February 26, 2013Assignee: Applied Material, Inc.Inventors: Dinesh Kanawade, Craig R. Metzner, Chandrasekhar Balasubramanyam
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Patent number: 8317449Abstract: Embodiments of multiple substrate transfer robots and substrate processing systems have been disclosed herein. In some embodiments, a multiple substrate transfer robot is provided and may include an arm capable of extending along a horizontal direction; and a wrist coupled to the arm and having a plurality of blades coupled thereto, each blade configured to horizontally support a substrate thereupon and vertically disposed with respect to each of the other blades. In some embodiments, a substrate processing system is provided and may include a substrate processing chamber having a plurality of susceptors, wherein each susceptor is vertically disposed and capable of holding a semiconductor substrate; and a substrate transfer robot having a plurality of blades for transferring a plurality of substrates to and from the processing chamber, each blade configured to horizontally support a substrate thereupon and vertically disposed with respect to each of the other blades.Type: GrantFiled: March 14, 2008Date of Patent: November 27, 2012Assignee: Applied Materials, Inc.Inventors: Jacob Newman, Dinesh Kanawade, Nir Merry
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Publication number: 20120235339Abstract: Embodiments of the present invention relate to improvements to single-substrate, multi-chamber processing platform architecture for minimizing fabrication facility floor space requirements. Prior art systems require significant floor space around all sides to allow for adequate installation and servicing. Embodiments of the present invention provide platforms that allow for servicing the chambers and supporting systems via a front and rear of the platform allowing multiple, side-by-side platform placement within a fabrication facility, while providing improved serviceability of the platform components.Type: ApplicationFiled: June 1, 2012Publication date: September 20, 2012Applicant: Applied Materials, Inc.Inventors: Jacob Newman, Dinesh Kanawade, Miriam Schwartz, Nir Merry, Michael Thomas Haag
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Publication number: 20100265988Abstract: Methods and apparatus for precise substrate cool down control are provided. Apparatus for measuring temperature of substrates may include a cool down plate to support a substrate; a sensor to provide data corresponding to a temperature of the substrate when disposed on the cool down plate; and a computer coupled to the sensor to determine the temperature of the substrate from the sensor data. A method for measuring the temperature of a substrate may include providing a substrate to be cooled to a chamber having a cool down plate disposed therein, a sensor to provide data corresponding to a temperature of the substrate, and a computer coupled to the sensor; sensing a first temperature of the substrate after a predetermined first time interval has elapsed; comparing the first temperature to a predetermined temperature; and determining whether the first temperature is greater than, equal to, or less than the predetermined temperature.Type: ApplicationFiled: April 12, 2010Publication date: October 21, 2010Applicant: APPLIED MATERIALS, INC.Inventors: JACOB NEWMAN, DINESH KANAWADE, HENRY BARANDICA, NIR MERRY
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Publication number: 20100116205Abstract: Embodiments of the present invention relate to improvements to single-substrate, multi-chamber processing platform architecture for minimizing fabrication facility floor space requirements. Prior art systems require significant floor space around all sides to allow for adequate installation and servicing. Embodiments of the present invention provide platforms that allow for servicing the chambers and supporting systems via a front and rear of the platform allowing multiple, side-by-side platform placement within a fabrication facility, while providing improved serviceability of the platform components.Type: ApplicationFiled: November 7, 2008Publication date: May 13, 2010Inventors: Jacob Newman, Dinesh Kanawade, Miriam Schwartz, Nir Merry, Michael Thomas Haag
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Publication number: 20090110520Abstract: Embodiments of the present invention as recited in the claims generally provide an apparatus for transferring substrates in a processing system where the substrate is exposed to high temperatures. In one embodiment a blade for transporting a substrate is provided. The blade comprises a base having an arcuate lateral shoulder, a first finger extending outward from and perpendicular to the base, a second finger extending outward from the base and parallel to and spaced-apart from the first finger, a first support tab configured to support the substrate and positioned along the arcuate lateral shoulder, a second support tab configured to support the substrate and coupled with the first finger, and a third support tab configured to support the substrate coupled with the second finger, wherein the arcuate lateral shoulder extends from an outer edge of the first finger to an outer edge of the second finger.Type: ApplicationFiled: October 30, 2008Publication date: April 30, 2009Inventors: Dinesh Kanawade, Craig R. Metzner, Chandrasekhar Balasubramanyam
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Publication number: 20080219824Abstract: Embodiments of multiple substrate transfer robots and substrate processing systems have been disclosed herein. In some embodiments, a multiple substrate transfer robot is provided and may include an arm capable of extending along a horizontal direction; and a wrist coupled to the arm and having a plurality of blades coupled thereto, each blade configured to horizontally support a substrate thereupon and vertically disposed with respect to each of the other blades. In some embodiments, a substrate processing system is provided and may include a substrate processing chamber having a plurality of susceptors, wherein each susceptor is vertically disposed and capable of holding a semiconductor substrate; and a substrate transfer robot having a plurality of blades for transferring a plurality of substrates to and from the processing chamber, each blade configured to horizontally support a substrate thereupon and vertically disposed with respect to each of the other blades.Type: ApplicationFiled: March 14, 2008Publication date: September 11, 2008Applicant: APPLIED MATERIALS, INC.Inventors: JACOB NEWMAN, Dinesh Kanawade, Nir Merry