Patents by Inventor Dinesh P. R. Thanu

Dinesh P. R. Thanu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat spreader edge standoffs for managing bondline thickness in microelectronic packages
    Patent number: 11652018
    Abstract: A microelectronic package may be fabricated to include a microelectronic substrate, at least one microelectronic device attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one microelectronic device and having at least one projection attached to the microelectronic substrate, and at least one standoff extending from the at least one projection, wherein the at least one standoff contacts the microelectronic substrate to control the bond line thickness between the heat dissipation device and at least one microelectronic device and/or to control the bond line thickness of a sealant which may be used to attached the at least one projection to the microelectronic substrate.
    Type: Grant
    Filed: June 9, 2021
    Date of Patent: May 16, 2023
    Assignee: Intel Corporation
    Inventors: Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, John J. Beatty, Syadwad Jain, Nachiket R. Raravikar
  • HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC PACKAGES
    Publication number: 20210305118
    Abstract: A microelectronic package may be fabricated to include a microelectronic substrate, at least one microelectronic device attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one microelectronic device and having at least one projection attached to the microelectronic substrate, and at least one standoff extending from the at least one projection, wherein the at least one standoff contacts the microelectronic substrate to control the bond line thickness between the heat dissipation device and at least one microelectronic device and/or to control the bond line thickness of a sealant which may be used to attached the at least one projection to the microelectronic substrate.
    Type: Application
    Filed: June 9, 2021
    Publication date: September 30, 2021
    Applicant: Intel Corporation
    Inventors: Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, John J. Beatty, Syadwad Jain, Nachiket R. Raravikar
  • Heat spreader edge standoffs for managing bondline thickness in microelectronic packages
    Patent number: 11062970
    Abstract: A microelectronic package may be fabricated to include a microelectronic substrate, at least one microelectronic device attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one microelectronic device and having at least one projection attached to the microelectronic substrate, and at least one standoff extending from the at least one projection, wherein the at least one standoff contacts the microelectronic substrate to control the bond line thickness between the heat dissipation device and at least one microelectronic device and/or to control the bond line thickness of a sealant which may be used to attached the at least one projection to the microelectronic substrate.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: July 13, 2021
    Assignee: Intel Corporation
    Inventors: Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, John J. Beatty, Syadwad Jain, Nachiket R. Raravikar
  • Standoff spacers for managing bondline thickness in microelectronic packages
    Patent number: 10643938
    Abstract: A microelectronic package may be fabricated to include a microelectronic substrate, a plurality of microelectronic devices attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one of the plurality of microelectronic devices and attached to the microelectronic substrate, and at least one offset spacer attached between the microelectronic substrate and the heat dissipation device to control the bondline thickness between the heat dissipation device and at least one of the plurality of microelectronic devices.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: May 5, 2020
    Assignee: Intel Corporation
    Inventors: Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, John J. Beatty, Sachin Deshmukh
  • HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC PACKAGES
    Publication number: 20190067153
    Abstract: A microelectronic package may be fabricated to include a microelectronic substrate, at least one microelectronic device attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one microelectronic device and having at least one projection attached to the microelectronic substrate, and at least one standoff extending from the at least one projection, wherein the at least one standoff contacts the microelectronic substrate to control the bond line thickness between the heat dissipation device and at least one microelectronic device and/or to control the bond line thickness of a sealant which may be used to attached the at least one projection to the microelectronic substrate.
    Type: Application
    Filed: August 29, 2017
    Publication date: February 28, 2019
    Applicant: Intel Corporation
    Inventors: Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, John J. Beatty, Syadwad Jain, Nachiket R. Raravikar
  • STANDOFF SPACERS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC PACKAGES
    Publication number: 20180350712
    Abstract: A microelectronic package may be fabricated to include a microelectronic substrate, a plurality of microelectronic devices attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one of the plurality of microelectronic devices and attached to the microelectronic substrate, and at least one offset spacer attached between the microelectronic substrate and the heat dissipation device to control the bondline thickness between the heat dissipation device and at least one of the plurality of microelectronic devices.
    Type: Application
    Filed: May 31, 2017
    Publication date: December 6, 2018
    Applicant: INTEL CORPORATION
    Inventors: Dinesh P. R. Thanu, Hemanth K. Dhavaleswarapu, John J. Beatty, Sachin Deshmukh