Patents by Inventor Dinesh Solanki

Dinesh Solanki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6559379
    Abstract: A three piece housing, designed to house semiconductor chips is molded using a polymer material. The chip sits on a metal base. Electrical leads pass through a molded housing to provide electrical contact between the semiconductor chip and external circuitry.
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: May 6, 2003
    Assignee: NovaSensor, Inc.
    Inventors: Dinesh Solanki, Janusz Bryzek
  • Publication number: 20010009195
    Abstract: A three piece housing, designed to house semiconductor chips is molded using a polymer material. The chip sits on a metal base. Electrical leads pass through a molded housing to provide electrical contact between the semiconductor chip and external circuitry.
    Type: Application
    Filed: March 22, 2001
    Publication date: July 26, 2001
    Inventors: Dinesh Solanki, Janusz Bryzek