Abstract: A magneto-electric dipole antenna array includes a substrate and at least one antenna unit. Each of the at least one antenna unit includes an electric-dipole component, a magnetic-dipole component, a first feeding probe, a second feeding probe and a stripline. The electric-dipole component is disposed on an upper surface of the substrate. The magnetic-dipole component is disposed in the substrate and between the upper surface and a lower surface of the substrate, and is electrically connected to the electric-dipole component. The first feeding probe is disposed on the upper surface of the substrate for vertical polarization. The second feeding probe is disposed in the substrate and between the upper surface and the lower surface of the substrate for horizontal polarization. The stripline is disposed in the substrate and between the first feeding probe and the second feeding probe for capacitive coupling.

Abstract: A magneto-electric dipole antenna array includes a substrate and at least one antenna unit. Each of the at least one antenna unit includes an electric-dipole component, a magnetic-dipole component, a first feeding probe, a second feeding probe and a stripline. The electric-dipole component is disposed on an upper surface of the substrate. The magnetic-dipole component is disposed in the substrate and between the upper surface and a lower surface of the substrate, and is electrically connected to the electric-dipole component. The first feeding probe is disposed on the upper surface of the substrate for vertical polarization. The second feeding probe is disposed in the substrate and between the upper surface and the lower surface of the substrate for horizontal polarization. The stripline is disposed in the substrate and between the first feeding probe and the second feeding probe for capacitive coupling.

Abstract: A substrate integrated waveguide having multiple substrate comprises a first substrate and a second substrate stacked with the first substrate, wherein metal layers are formed on opposite sides of the first substrate and opposite sides of the second substrate, a plurality of metal holes are formed between two metal layers of the same substrate to limit transmission paths of electromagnetic waves transmitted in the substrate, and areas having no metal therein are formed between the first and second substrates so that the electromagnetic waves could be transmitted between the first and second substrates thereby.

Abstract: A magneto-electric dipole antenna includes a substrate module, a director, a reflector and a feeding module. The substrate module has an upper surface and a lower surface. The director is disposed on the upper surface of the substrate module. The reflector is disposed on the lower surface of the substrate module. The feeding module is disposed in the substrate module between the director and the reflector. When a to-be-outputted signal is fed to the feeding module, a forward radiation that transmits in a forward direction pointing from bottom to top is generated, a backward radiation that transmits in a backward direction reverse to the forward direction is generated and is reflected by the reflector, and the forward radiation and the backward radiation thus reflected are directed by the director so as to generate the electromagnetic wave.

Abstract: A patch antenna includes a first substrate, a second substrate and a substrate module that are stacked from top to bottom, a driving radiative element that is disposed below the second substrate, and a parasitic radiative element that is disposed above the first substrate. The patch antenna further includes a first feed-in line and a second feed-in line that are disposed below the substrate module. The patch antenna further includes a first feed-out probe and a second feed-out probe, each of which extends from below the driving radiative element from top to bottom, and penetrates the substrate module. When the driving radiative element receives an electromagnetic wave, a portion of the electromagnetic wave is sequentially and electromagnetically coupled to the first feed-out probe and the first feed-in line, and another portion of the electromagnetic wave is sequentially and electromagnetically coupled to the second feed-out probe and the second feed-in line.

Abstract: In a magneto-electric dipole antenna, first to third substrates are stacked from top to bottom. A ground layer is disposed between the second and third substrates. Four sector patches and a first feed-out line are disposed on the first substrate. Four ground plates and first and second feed-in lines are disposed below the third substrate. Each of four vias penetrates the second and third substrates and the ground layer. A second feed-out line is disposed between the first and second substrates. Each of first and second feed-out probes penetrates the first to third substrates and the ground layer. The nth feed-out probe is connected to the nth feed-in line and the nth feed-out line, where 1?n?2. When two signals are fed to the feed-in lines, the signals are transmitted to the feed-out lines through the feed-out probes, and two electromagnetic waves are radiated.

Abstract: A substrate integrated waveguide having multiple substrate comprises a first substrate and a second substrate stacked with the first substrate, wherein metal layers are formed on opposite sides of the first substrate and opposite sides of the second substrate, a plurality of metal holes are formed between two metal layers of the same substrate to limit transmission paths of electromagnetic waves transmitted in the substrate, and areas having no metal therein are formed between the first and second substrates so that the electromagnetic waves could be transmitted between the first and second substrates thereby.

Abstract: A method for flattening an impedance of a power delivery network includes capturing a set of impedance parameters, obtaining an impedance of the power delivery network according to the set of impedance parameters, defining a target impedance, performing an importance calculation to determine a port, obtaining an intersection frequency according to the target impedance and the impedance of the power delivery network, selecting a decoupling capacitor according to the intersection frequency, and disposing the decoupling capacitor at the port. The method can reduce the impedance of the power delivery network to the target impedance and flatten the impedance to avoid the rogue wave phenomenon.

Abstract: An antenna cover is used with an antenna for passing therethrough a radiation of the antenna in order to modify an antenna pattern of the antenna. The antenna cover includes a housing having a first surface and a second surface; and a plurality of through holes penetrating through the housing and extending from the first surface to the second surface. By way of adjusting distances between the plurality of through holes and/or adjusting sizes of the plurality of through holes, the antenna cover functions to adjust the radiation of the antenna from a first antenna pattern to a second antenna pattern.

Abstract: A method for flattening an impedance of a power delivery network includes capturing a set of impedance parameters, obtaining an impedance of the power delivery network according to the set of impedance parameters, defining a target impedance, performing an importance calculation to determine a port, obtaining an intersection frequency according to the target impedance and the impedance of the power delivery network, selecting a decoupling capacitor according to the intersection frequency, and disposing the decoupling capacitor at the port. The method can reduce the impedance of the power delivery network to the target impedance and flatten the impedance to avoid the rogue wave phenomenon.

Abstract: An antenna cover is used with an antenna for passing therethrough a radiation of the antenna in order to modify an antenna pattern of the antenna. The antenna cover includes a housing having a first surface and a second surface; and a plurality of through holes penetrating through the housing and extending from the first surface to the second surface. By way of adjusting distances between the plurality of through holes and/or adjusting sizes of the plurality of through holes, the antenna cover functions to adjust the radiation of the antenna from a first antenna pattern to a second antenna pattern.

Abstract: A noise suppression filter includes a resonator, a ground plane, and a set of differential transmission lines. The set of differential transmission lines includes a first meander line and a second meander line formed in a first circuit layer. The resonator is formed in a second circuit layer and includes a first long arm, a second long arm, and a short arm extended form a same point to form a T-shape. The ground plane is formed in a third circuit layer and is coupled to the first long arm and the second long arm through vias. The first meander line is detoured along the inner sides of the first long arm and the short arm, and the second meander line is detoured along the inner sides of the second long arm and the short arm.

Abstract: A noise suppression filter includes a resonator, a ground plane, and a set of differential transmission lines. The set of differential transmission lines includes a first meander line and a second meander line formed in a first circuit layer. The resonator is formed in a second circuit layer and includes a first long arm, a second long arm, and a short arm extended form a same point to form a T-shape. The ground plane is formed in a third circuit layer and is coupled to the first long arm and the second long arm through vias. The first meander line is detoured along the inner sides of the first long arm and the short arm, and the second meander line is detoured along the inner sides of the second long arm and the short arm.

Abstract: A noise suppression circuit device includes a baseboard, a decoupling capacitor set, a power bus structure, a band-stop filter unit and an electromagnetic band-gap structure. The decoupling capacitor set is disposed on the baseboard for isolating noise of a first frequency band. The power bus structure is disposed on the baseboard for isolating noise of a second frequency band. The band-stop filter unit is disposed on the baseboard for isolating at least a portion of noise of a third frequency band. The electromagnetic band-gap structure is disposed on the baseboard for isolating noise of a fourth frequency band.

Abstract: An antenna structure includes a board unit and a coil unit. The board unit includes a metal board and an insulating board connected with or adjacent to the metal board, and the coil unit is disposed beside the same side of the metal board and the insulating board. In one embodiment, when one narrow side of the metal board and one narrow side of the insulating board connects with each other, the coil unit is disposed right under the commissure of the metal board and the insulating board. In addition, more than half or half of the area of the coil unit is covered by the insulating board, and less than half or half of the area of the coil unit is covered by the metal board. The current direction on the metal board and the current direction on the coil unit are the same as clockwise or counterclockwise.

Abstract: The present invention provides an antenna structure, using a metal radiation plate having at least one bending slot and a metal grounding plate, where a starting end of the metal radiation plate is located on an edge of the metal radiation plate. A feed plate and a connecting grounding plate are separately connected to two sides of a starting end of the slot, and two ends of the connecting grounding plate may be separately connected to the metal radiation plate and the metal grounding plate. The feed plate may be connected to a core wire of a coaxial cable, and a peripheral conductor of the coaxial cable is connected to the metal grounding plate, so that different resonant modes can be controlled. The antenna can achieve a broadband effect, thereby solving the problem of the metal shielding effect in a wireless communication product using a full-metal back cover.

Abstract: An antenna structure includes a board unit and a coil unit. The board unit includes a metal board and an insulating board connected with or adjacent to the metal board, and the coil unit is disposed beside the same side of the metal board and the insulating board. In one embodiment, when one narrow side of the metal board and one narrow side of the insulating board connects with each other, the coil unit is disposed right under the commissure of the metal board and the insulating board. In addition, more than half or half of the area of the coil unit is covered by the insulating board, and less than half or half of the area of the coil unit is covered by the metal board. The current direction on the metal board and the current direction on the coil unit are the same as clockwise or counterclockwise.

Abstract: Rectangular-shape resonators as guard traces formed in a region between the victim and aggressor lines are disclosed. No shorting-vias or resistors are required. The rectangular resonators are found to have functions of improving far-end crosstalk (FEXT) and timing jitter in both frequency domain and time domain if the parameters are appropriated selected.

Abstract: An UHF RFID antenna for attached on any high conductive object is disclosed. The antenna radiation body has a first copper foil mounted thereon a backside surface of a FR4 glass fiber served as a ground plane, a second copper foil mounted thereon a front surface of the FR4 glass fiber as a main radiation plane. The main radiation plane contains two etched slits spaced each other. Each etched slit has a shape like a blade with a long handle. The two etched slits are mirror symmetry and a trench formed to connect the two etched slits for a RFID tag seated thereon so that There are short circuit microstrip and a feed-in microstrip are generated.

Abstract: A interconnect structure includes a substrate, a pair of interconnect pads, a pair of transmission lines. The substrate is stacked with at least one layer, and each of the layers has a first surface plane and a second surface plane. The pair of interconnect pads are formed on a first surface plane of a first layer of the substrate. The pair of transmission lines is formed on the first surface plane of the first layer, and the pair of transmission lines have a Y-type close trace portion for connection to the pair of interconnect pads. Further, the first surface plane of the layer is formed with a via hole which is formed within a groin region defined by the Y-type close trace portion and extends to a second surface plane of the first layer, wherein the second surface of the first layer is a power plane or a ground plane.