Patents by Inventor Ding-Bing Lin

Ding-Bing Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250079678
    Abstract: A substrate integrated waveguide having multiple substrate comprises a first substrate and a second substrate stacked with the first substrate, wherein metal layers are formed on opposite sides of the first substrate and opposite sides of the second substrate, a plurality of metal holes are formed between two metal layers of the same substrate to limit transmission paths of electromagnetic waves transmitted in the substrate, and areas having no metal therein are formed between the first and second substrates so that the electromagnetic waves could be transmitted between the first and second substrates thereby.
    Type: Application
    Filed: May 10, 2024
    Publication date: March 6, 2025
    Inventors: YI-JU LEE, DING-BING LIN, YI-HAN WU
  • Patent number: 11735921
    Abstract: A method for flattening an impedance of a power delivery network includes capturing a set of impedance parameters, obtaining an impedance of the power delivery network according to the set of impedance parameters, defining a target impedance, performing an importance calculation to determine a port, obtaining an intersection frequency according to the target impedance and the impedance of the power delivery network, selecting a decoupling capacitor according to the intersection frequency, and disposing the decoupling capacitor at the port. The method can reduce the impedance of the power delivery network to the target impedance and flatten the impedance to avoid the rogue wave phenomenon.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: August 22, 2023
    Assignees: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Yen-Hao Chen, Ding-Bing Lin, Jhih-Yu Yu
  • Patent number: 11600917
    Abstract: An antenna cover is used with an antenna for passing therethrough a radiation of the antenna in order to modify an antenna pattern of the antenna. The antenna cover includes a housing having a first surface and a second surface; and a plurality of through holes penetrating through the housing and extending from the first surface to the second surface. By way of adjusting distances between the plurality of through holes and/or adjusting sizes of the plurality of through holes, the antenna cover functions to adjust the radiation of the antenna from a first antenna pattern to a second antenna pattern.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: March 7, 2023
    Assignee: ALPHA NETWORKS INC.
    Inventors: Yi Ju Lee, Ding-Bing Lin, Nien-Chih Tsai
  • Publication number: 20220320864
    Abstract: A method for flattening an impedance of a power delivery network includes capturing a set of impedance parameters, obtaining an impedance of the power delivery network according to the set of impedance parameters, defining a target impedance, performing an importance calculation to determine a port, obtaining an intersection frequency according to the target impedance and the impedance of the power delivery network, selecting a decoupling capacitor according to the intersection frequency, and disposing the decoupling capacitor at the port. The method can reduce the impedance of the power delivery network to the target impedance and flatten the impedance to avoid the rogue wave phenomenon.
    Type: Application
    Filed: June 18, 2021
    Publication date: October 6, 2022
    Applicants: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Yen-Hao Chen, Ding-Bing Lin, Jhih-Yu Yu
  • Publication number: 20220294110
    Abstract: An antenna cover is used with an antenna for passing therethrough a radiation of the antenna in order to modify an antenna pattern of the antenna. The antenna cover includes a housing having a first surface and a second surface; and a plurality of through holes penetrating through the housing and extending from the first surface to the second surface. By way of adjusting distances between the plurality of through holes and/or adjusting sizes of the plurality of through holes, the antenna cover functions to adjust the radiation of the antenna from a first antenna pattern to a second antenna pattern.
    Type: Application
    Filed: August 12, 2021
    Publication date: September 15, 2022
    Inventors: YI JU LEE, DING-BING LIN, NIEN-CHIH TSAI
  • Patent number: 11063569
    Abstract: A noise suppression filter includes a resonator, a ground plane, and a set of differential transmission lines. The set of differential transmission lines includes a first meander line and a second meander line formed in a first circuit layer. The resonator is formed in a second circuit layer and includes a first long arm, a second long arm, and a short arm extended form a same point to form a T-shape. The ground plane is formed in a third circuit layer and is coupled to the first long arm and the second long arm through vias. The first meander line is detoured along the inner sides of the first long arm and the short arm, and the second meander line is detoured along the inner sides of the second long arm and the short arm.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: July 13, 2021
    Assignees: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Yen-Hao Chen, Yo-Hao Cheng, Ding-Bing Lin
  • Publication number: 20210152152
    Abstract: A noise suppression filter includes a resonator, a ground plane, and a set of differential transmission lines. The set of differential transmission lines includes a first meander line and a second meander line formed in a first circuit layer. The resonator is formed in a second circuit layer and includes a first long arm, a second long arm, and a short arm extended form a same point to form a T-shape. The ground plane is formed in a third circuit layer and is coupled to the first long arm and the second long arm through vias. The first meander line is detoured along the inner sides of the first long arm and the short arm, and the second meander line is detoured along the inner sides of the second long arm and the short arm.
    Type: Application
    Filed: December 9, 2019
    Publication date: May 20, 2021
    Inventors: Yen-Hao Chen, Yo-Hao Cheng, Ding-Bing Lin
  • Publication number: 20200163202
    Abstract: A noise suppression circuit device includes a baseboard, a decoupling capacitor set, a power bus structure, a band-stop filter unit and an electromagnetic band-gap structure. The decoupling capacitor set is disposed on the baseboard for isolating noise of a first frequency band. The power bus structure is disposed on the baseboard for isolating noise of a second frequency band. The band-stop filter unit is disposed on the baseboard for isolating at least a portion of noise of a third frequency band. The electromagnetic band-gap structure is disposed on the baseboard for isolating noise of a fourth frequency band.
    Type: Application
    Filed: December 17, 2018
    Publication date: May 21, 2020
    Inventors: Yen-Hao Chen, Lin-Zong Zheng, Ding-Bing Lin, Min-Hung Hsieh
  • Patent number: 10109919
    Abstract: An antenna structure includes a board unit and a coil unit. The board unit includes a metal board and an insulating board connected with or adjacent to the metal board, and the coil unit is disposed beside the same side of the metal board and the insulating board. In one embodiment, when one narrow side of the metal board and one narrow side of the insulating board connects with each other, the coil unit is disposed right under the commissure of the metal board and the insulating board. In addition, more than half or half of the area of the coil unit is covered by the insulating board, and less than half or half of the area of the coil unit is covered by the metal board. The current direction on the metal board and the current direction on the coil unit are the same as clockwise or counterclockwise.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: October 23, 2018
    Assignee: INPAQ TECHNOLOGY CO., LTD.
    Inventors: Min-Sen Guo, Ding-Bing Lin, Jui-Hung Chou, Chih-Ming Su, En-Tso Yu, Ci-Jie Huang
  • Publication number: 20160301142
    Abstract: The present invention provides an antenna structure, using a metal radiation plate having at least one bending slot and a metal grounding plate, where a starting end of the metal radiation plate is located on an edge of the metal radiation plate. A feed plate and a connecting grounding plate are separately connected to two sides of a starting end of the slot, and two ends of the connecting grounding plate may be separately connected to the metal radiation plate and the metal grounding plate. The feed plate may be connected to a core wire of a coaxial cable, and a peripheral conductor of the coaxial cable is connected to the metal grounding plate, so that different resonant modes can be controlled. The antenna can achieve a broadband effect, thereby solving the problem of the metal shielding effect in a wireless communication product using a full-metal back cover.
    Type: Application
    Filed: April 8, 2015
    Publication date: October 13, 2016
    Inventors: TZONG-LIN WU, JUI-HUNG CHOU, JO-FAN CHANG, DING-BING LIN
  • Publication number: 20160079669
    Abstract: An antenna structure includes a board unit and a coil unit. The board unit includes a metal board and an insulating board connected with or adjacent to the metal board, and the coil unit is disposed beside the same side of the metal board and the insulating board. In one embodiment, when one narrow side of the metal board and one narrow side of the insulating board connects with each other, the coil unit is disposed right under the commissure of the metal board and the insulating board. In addition, more than half or half of the area of the coil unit is covered by the insulating board, and less than half or half of the area of the coil unit is covered by the metal board. The current direction on the metal board and the current direction on the coil unit are the same as clockwise or counterclockwise.
    Type: Application
    Filed: September 14, 2015
    Publication date: March 17, 2016
    Inventors: MIN-SEN GUO, Ding-Bing Lin, Jui-Hung Chou, CHIH-MING SU, EN-TSO Yu, CI-JIE HUANG
  • Patent number: 8994469
    Abstract: Rectangular-shape resonators as guard traces formed in a region between the victim and aggressor lines are disclosed. No shorting-vias or resistors are required. The rectangular resonators are found to have functions of improving far-end crosstalk (FEXT) and timing jitter in both frequency domain and time domain if the parameters are appropriated selected.
    Type: Grant
    Filed: September 24, 2012
    Date of Patent: March 31, 2015
    Assignee: National Taipei University of Technology
    Inventors: Ding-Bing Lin, Chen-Kuang Wang
  • Patent number: 8963781
    Abstract: An UHF RFID antenna for attached on any high conductive object is disclosed. The antenna radiation body has a first copper foil mounted thereon a backside surface of a FR4 glass fiber served as a ground plane, a second copper foil mounted thereon a front surface of the FR4 glass fiber as a main radiation plane. The main radiation plane contains two etched slits spaced each other. Each etched slit has a shape like a blade with a long handle. The two etched slits are mirror symmetry and a trench formed to connect the two etched slits for a RFID tag seated thereon so that There are short circuit microstrip and a feed-in microstrip are generated.
    Type: Grant
    Filed: September 24, 2012
    Date of Patent: February 24, 2015
    Assignee: National Taipei University of Technology
    Inventors: Ding-Bing Lin, Chao-Chieh Wang
  • Patent number: 8071891
    Abstract: A interconnect structure includes a substrate, a pair of interconnect pads, a pair of transmission lines. The substrate is stacked with at least one layer, and each of the layers has a first surface plane and a second surface plane. The pair of interconnect pads are formed on a first surface plane of a first layer of the substrate. The pair of transmission lines is formed on the first surface plane of the first layer, and the pair of transmission lines have a Y-type close trace portion for connection to the pair of interconnect pads. Further, the first surface plane of the layer is formed with a via hole which is formed within a groin region defined by the Y-type close trace portion and extends to a second surface plane of the first layer, wherein the second surface of the first layer is a power plane or a ground plane.
    Type: Grant
    Filed: February 25, 2009
    Date of Patent: December 6, 2011
    Assignee: Himax Media Solutions, Inc.
    Inventors: Jung-Chan Chang, Ding-Bing Lin
  • Patent number: 7944402
    Abstract: According to one embodiment of the present invention, a dipole antenna capable of supporting multi-band communications, includes a first portion of the antenna in a folded structure, a second portion of the antenna that includes a first coupling pad and a second coupling pad physically separated by a distance, and a current path along the first portion of the antenna and the second portion of the antenna, wherein a first portion of the current path that includes the first coupling pad and the second coupling pad is configured to introduce a slow wave effect if electric current flows through the first portion of the current path.
    Type: Grant
    Filed: May 7, 2008
    Date of Patent: May 17, 2011
    Assignee: Sumwintek Corp.
    Inventors: Shi-Ming Zhao, Ding-Bing Lin, Chao-Hsiung Tseng, Jui-Hsien Chien, Shiao-Ting Wu
  • Publication number: 20100212949
    Abstract: A interconnect structure includes a substrate, a pair of interconnect pads, a pair of transmission lines. The substrate is stacked with at least one layer, and each of the layers has a first surface plane and a second surface plane. The pair of interconnect pads are formed on a first surface plane of a first layer of the substrate. The pair of transmission lines are formed on the first surface plane of the first layer, and the pair of transmission lines have a Y-type close trace portion for connection to the pair of interconnect pads. Further, the first surface plane of the layer is formed with a via hole which is formed within a groin region defined by the Y-type close trace portion and extends to a second surface plane of the first layer, wherein the second surface of the first layer is a power plane or a ground plane.
    Type: Application
    Filed: February 25, 2009
    Publication date: August 26, 2010
    Applicant: Himax Media Solutions, lnc.
    Inventors: Jung-Chan Chang, Ding-Bing Lin
  • Publication number: 20100188168
    Abstract: Provided is a wide band filter structure including two coupling units and one bridge unit. Each of the coupling units has a joint. The joint is concentrically encircled by a spiral with two ends. One of the ends of the spiral is positioned at the joint. The bridge unit is connected to between the two spirals by the other ends thereof, respectively. The wide band filter structure achieves high impedance, prevents wide band Delta-I noise, improves electromagnetic interference (EMI) and electromagnetic compatibility (EMC), and reduces cost when used in related layout of printed circuit boards and IC package substrates.
    Type: Application
    Filed: January 27, 2009
    Publication date: July 29, 2010
    Inventors: Ding-Bing LIN, Kuo-Chiang HUNG
  • Publication number: 20090278758
    Abstract: According to one embodiment of the present invention, a dipole antenna capable of supporting multi-band communications, includes a first portion of the antenna in a folded structure, a second portion of the antenna that includes a first coupling pad and a second coupling pad physically separated by a distance, and a current path along the first portion of the antenna and the second portion of the antenna, wherein a first portion of the current path that includes the first coupling pad and the second coupling pad is configured to introduce a slow wave effect if electric current flows through the first portion of the current path.
    Type: Application
    Filed: May 7, 2008
    Publication date: November 12, 2009
    Applicant: SUMWINTEK CORP.
    Inventors: Shi-Ming Zhao, Ding-Bing Lin, Chao-Hsiung Tseng, Jui-Hsien Chien, Shiao-Ting Wu