Patents by Inventor Ding Ding
Ding Ding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20260318756Abstract: A pressure sensor, a manufacturing method therefor, and a pressure sensing assembly are provided. The pressure sensor includes a base substrate and at least one capacitor provided on the base substrate. One of the at least one capacitor includes a first electrode and a second electrode provided opposite to each other and insulated from each other. The second electrode is located on a side of the first electrode away from the base substrate, and a cavity is provided between the first electrode and the second electrode. An orthographic projection of the first electrode on the base substrate is at least partially overlapped with an orthographic projection of the second electrode on the base substrate, and an orthographic projection of an overlapping region of the first electrode and the second electrode on the base substrate is at least partially overlapped with an orthographic projection of the cavity on the base substrate.Type: ApplicationFiled: December 26, 2023Publication date: October 15, 2026Inventors: Weilong GUO, Yue LI, Qiuxu WEI, Lihui WANG, Nana HE, Taonan ZHANG, Jie SUN, Wenbo CHANG, Hanqing LIU, Ding DING
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Publication number: 20260318765Abstract: The present disclosure provides a pressure sensing chip and a pressure sensor, belonging to the field of sensor technologies and aiming at improving the service life of sensors and increasing application scenarios. The pressure sensing chip includes: a pressure-sensitive film; a substrate connected to the pressure-sensitive film, wherein a cavity is formed between the pressure-sensitive film and the substrate; a pressure-sensitive component located between the substrate and the pressure-sensitive film, wherein the pressure-sensitive component partially overlaps with an orthographic projection of the cavity on the substrate; and a first signal output structure arranged on a side of the substrate away from the pressure-sensitive film, wherein the first signal output structure is electrically connected to the pressure-sensitive component through a lead structure penetrating through the substrate.Type: ApplicationFiled: December 22, 2023Publication date: October 15, 2026Applicants: BEIJING BOE SENSOR TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD., BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.Inventors: Yue Li, Lihui Wang, Qiuxu Wei, Weilong Guo, Taonan Zhang, Wenbo Chang, Jie Sun, Nana He, Hanqing Liu, Ding Ding
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Patent number: 12752271Abstract: A gene detection substrate is provided, including: a substrate; a gene detection channel in the substrate, an opening of the gene detection channel is on one side of the substrate; the gene detection channel includes a sample injection groove, a sample outgoing groove and a flow channel groove sequentially connected and communicated with each other; the flow channel groove includes reaction holes and flow channel structures; the reaction holes are distributed at intervals, and any two adjacent reaction holes are communicated with each other through the flow channel structure; the flow channel structure includes a first, second, and third sub-grooves sequentially connected and communicated with each other; a width of each of the first and third sub-grooves in a first direction is smaller than that of the second sub-groove in the first direction; and the first direction is perpendicular to an arrangement direction of two adjacent reaction holes.Type: GrantFiled: May 19, 2022Date of Patent: October 6, 2026Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Yunqing Mu, Haonan Liu, Zhukai Liu, Ding Ding
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Patent number: 12748107Abstract: An immunoassay device and an immunoassay method are provided. The immunoassay device includes: a housing, a driving assembly, a detection chip and a liquid storage chamber; the housing has a first accommodating part in which the detection chip is disposed and a second accommodating part in which the liquid storage chamber is disposed, and the liquid storage chamber is configured at least to store reagent; the driving assembly is configured to communicate a liquid outlet of the liquid storage chamber with a liquid inlet of the detection chip, and drive the reagent in the liquid storage chamber to enter the detection chip.Type: GrantFiled: April 29, 2021Date of Patent: September 29, 2026Assignees: Beijing BOE Technology Development Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Haonan Liu, Xiangguo Ma, Kai Geng, Ding Ding
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Patent number: 12746546Abstract: The present disclosure provides a micro-fluidic chip and a reaction system. The micro-fluidic chip includes: a base substrate; a micro-cavity defining layer on the base substrate and defining a plurality of micro-reaction chambers; a cover plate on a side of the micro-cavity defining layer away from the base substrate; a heating layer disposed between the micro-cavity defining layer and one of the base substrate and the cover plate, and configured to heat the plurality of micro-reaction chambers. One of the base substrate and the cover plate, which is away from the heating layer, has a first surface and a second surface, the first surface faces the heating layer, the second surface faces away from the heating layer, and a area of the second surface is larger than that of the first surface.Type: GrantFiled: April 27, 2022Date of Patent: September 29, 2026Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Ji Peng, Ding Ding
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Publication number: 20260284658Abstract: A chip packaging structure and a chip packaging method, the structure including: a sample substrate with through holes; first cover plate and second cover plates respectively on opposite sides of the sample substrate; and at least one pair of a sample inlet and a sample outlet, each pair of the sample inlet and the sample outlet being in the first cover plate and the second cover plate, respectively, a flow path is between each pair of the sample inlet and the sample outlet, a first flow channel structure is on a surface of the first cover plate opposite to the sample substrate, a second flow channel structure is on a surface of the second cover plate opposite to the sample substrate, and the first flow channel structure and the second flow channel structure are connected with the through holes, to form a continuous channel corresponding to the flow path.Type: ApplicationFiled: June 3, 2026Publication date: September 24, 2026Inventors: Xiangguo MA, Zhukai LIU, Ding DING, Lin DENG
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Patent number: 12729361Abstract: A culture structure, a culture method and a culture chip are provided. The culture structure includes a culture plate and a vibration structure provided on the culture plate; the culture plate includes a plurality of accommodating structures configured to accommodate culture solution; the vibration structure includes a vibration signal generating structure and a plurality of vibration members; the vibration signal generating structure is configured to generate a vibration signal; the plurality of vibration members are connected to the vibration signal generating structure and configured to drive the culture solution in the plurality of accommodating structures to move according to the vibration signal.Type: GrantFiled: June 29, 2022Date of Patent: September 8, 2026Assignee: BOE Technology Group Co., Ltd.Inventors: Shicai Wang, Ding Ding
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Patent number: 12726644Abstract: Methods and apparatuses for neural network based image compression may be provided. The method may include receiving a compressed input image; generating a first prediction of the input image using a first combination of one or more first convolutional nets, a first activation function, and the compressed input image, the generating includes at least: upsampling an output image from the one or more first convolutional nets; and performing tensor transform based on the upsampled output image; and decoding the compressed input image using the generated first prediction.Type: GrantFiled: August 25, 2023Date of Patent: September 1, 2026Assignee: TENCENT AMERICA LLCInventors: Ding Ding, Xiaozhong Xu, Shan Liu
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Publication number: 20260230179Abstract: A detection device is configured to detect a transmission fault on an optical transmission path. The optical transmission path comprises a local optical module assembly, a plurality of local wavelength division multiplexing optical link groups, a local multiplexer/demultiplexer, and a plurality of remote wavelength division multiplexing optical link groups, that are sequentially coupled. The plurality of local wavelength division multiplexing optical link groups are coupled to a plurality of filtering ends of the local multiplexer/demultiplexer. A multiplexing end of the local multiplexer/demultiplexer is coupled to the plurality of remote wavelength division multiplexing optical link groups. The local optical module assembly integrates an optical time-domain reflectometer (OTDR) detection function. A detection accuracy of the OTDR detection function is greater than a filtering accuracy of the local multiplexer/demultiplexer.Type: ApplicationFiled: March 27, 2026Publication date: August 6, 2026Inventors: Ding Ding, Renqiang Li, Jia Feng
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Patent number: 12701234Abstract: A method and system for sample mapping in image and video coding using Low Dynamic Range (LDR) samples are provided. For example, mapping functions are implemented for conversion of samples from an original bit depth to an LDR bit depth during an encoding and decoding process of videos or images. Such mapping functions are signaled or indicated in a bitstream of the videos or images.Type: GrantFiled: June 27, 2024Date of Patent: August 4, 2026Assignee: Tencent America LLCInventors: Xin Zhao, Ding Ding, Shan Liu
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Patent number: 12691450Abstract: The present disclosure provides a microfluidic substrate, a microfluidic chip and a manufacturing method thereof. The microfluidic substrate includes: a first substrate; a conductive layer on the first substrate; and a defining layer on a side of the conductive layer facing away from the first substrate, the defining layer defining a concave portion; wherein the conductive layer comprises a plurality of conductive patterns corresponding to the concave portion, the plurality of conductive patterns are arranged along a first direction, each conductive pattern extends along a second direction and comprises a first end and a second end, the first direction is perpendicular to the second direction, and each conductive pattern has a maximum local resistance value at the first end and the second end of the conductive pattern.Type: GrantFiled: March 12, 2021Date of Patent: July 28, 2026Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Ruijun Deng, Zhukai Liu, Ding Ding, Haonan Liu
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Patent number: 12691448Abstract: A chip packaging structure and a chip packaging method, the structure including: a sample substrate with through holes; first and second cover plates on opposite sides of the sample substrate; and at least one pair of a sample inlet and a sample outlet, each pair of the sample inlet and the sample outlet is in one or both of the first cover plate and the second cover plate, a flow path is between each pair of the sample inlet and the sample outlet, a first flow channel structure is on a surface of the first cover plate opposite to the sample substrate, a second flow channel structure is on a surface of the second cover plate opposite to the sample substrate, and the first flow channel structure and the second flow channel structure are connected with the through holes, to form a continuous channel corresponding to the flow path.Type: GrantFiled: March 25, 2022Date of Patent: July 28, 2026Assignees: Beijing BOE Technology Development Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Xiangguo Ma, Zhukai Liu, Ding Ding, Lin Deng
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Publication number: 20260205629Abstract: In a method of video decoding, a coded video bitstream including coded information of a plurality of coded pictures is received. The coded information includes a supplemental enhancement information (SEI) message associated with a first picture and a second picture in the plurality of coded pictures, and the SEI message includes a syntax element indicative of a truncation function that converts the first picture of a first bit depth to a second picture of a second bit depth, the second bit depth being lower than the first bit depth. In the method, a reconstructed picture corresponding to the second picture is generated. The reconstructed picture includes corresponding reconstructed samples based on the coded information. A range of sample values of the reconstructed samples of the reconstructed picture is determined by the truncation function.Type: ApplicationFiled: March 6, 2026Publication date: July 16, 2026Applicant: Tencent America LLCInventors: Stephan WENGER, Xin ZHAO, Ding DING, Shan LIU
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Patent number: 12673322Abstract: A device and a driving method for driving a microfluidic chip are disclosed. The device for driving a microfluidic chip includes a carrying member configured to carry the microfluidic chip; a releasing member configured to electrically connected to the microfluidic chip, and control the release of the reagent of the microfluidic chip, a valve control member configured to control the opening and closing of the flow channel in the valve control area of the microfluidic chip when the valve control area is within the valve control range of the valve control member, a fluid driving member configured to drive the flow of fluid in the microfluidic chip, and a controller configured to control the driving process of the microfluidic chip.Type: GrantFiled: January 29, 2021Date of Patent: July 7, 2026Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Weifeng Xu, Beiyuan Fan, Da Li, Ding Ding
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Patent number: 12673323Abstract: The present disclosure provide a detection chip having at least one functional region, the functional region including: a reaction region and a non-reaction region surrounding the reaction region. The detection chip includes: a first substrate and a second substrate opposite to each other. In the reaction region, a side of the first substrate facing the second substrate is provided with reaction grooves arranged in an array along a first direction and a second direction; first communication grooves each between two reaction grooves adjacent in the first direction, and connected with the two reaction grooves; and second communication grooves each between two first communication grooves adjacent in the second direction, and connected with the two adjacent first communication grooves, and the first direction intersects the second direction. The embodiments of the present disclosure further provide a fabrication method and a sample introduction method of the detection chip.Type: GrantFiled: May 31, 2021Date of Patent: July 7, 2026Assignees: Beijing BOE Technology Development Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Zhukai Liu, Ding Ding
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Patent number: 12667838Abstract: A microfluidic flow channel structure and a microfluidic chip are described. The microfluidic flow channel structure includes a main chamber, wherein the main chamber includes at least two division zones and a reaction zone, and the at least two division zones are respectively connected with the reaction zone, wherein each division zone includes a first division wall, and the first division wall is provided with an opening for liquid inlet; a diversion structure is arranged at the opening of at least one division zone, and the diversion structure at least includes a first diversion wall, which is arranged opposite the first division wall; a first division channel is formed between the first diversion wall and the first division wall, and the first division channel includes at least two liquid outlets.Type: GrantFiled: February 18, 2022Date of Patent: June 30, 2026Assignee: BOE Technology Group Co LtdInventors: Yunqing Mu, Dandan Chen, Ding Ding
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Patent number: 12645937Abstract: Iterative content-adaptive online training for end-to-end (E2E) neural image compression (NIC) using a neural network performed by at least one processor, is provided, including receiving an input image, to an E2E NIC framework, fine-tuning the E2E NIC framework, based on the input image, computing parameter updates using a first neural network of the fine-tuned E2E NIC framework, enhancing the fine-tuned E2E NIC framework based on a second neural network, the second neural network being a post-enhancement network, and generating an updated E2E NIC framework, based on the enhanced E2E NIC framework and the parameter updates.Type: GrantFiled: September 26, 2022Date of Patent: June 2, 2026Assignee: TENCENT AMERICA LLCInventors: Ding Ding, Wei Wang, Shan Liu
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Patent number: 12635357Abstract: The present application provides a display panel, a fabrication method thereof, and a mobile terminal. The display panel includes a substrate and a driving circuit layer. The driving circuit layer includes a first active layer, a first gate insulating layer, a first gate, a first interlayer insulating layer, and a source and drain layer. An orthographic projection of the first gate insulating layer on the substrate is within an orthographic projection of the first active layer on the substrate, and an orthographic projection the first gate on the substrate is located within an orthographic projection of the first gate insulating layer on the substrate.Type: GrantFiled: November 29, 2021Date of Patent: May 19, 2026Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.Inventors: Ding Ding, Liang Fang
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Patent number: 12625019Abstract: An MEMS pressure sensor, a method for manufacturing an MEMS pressure sensor, and a pressure detection device are provided. The MEMS pressure sensor includes: an adapter board; an integrated circuit chip on one side of the adapter board; and a sensor chip on a side of the adapter board away from the integrated circuit chip. The sensor chip includes a first electrode and a second electrode, and the first electrode is between the adapter board and the second electrode; the second electrode includes a pressure-sensitive portion opposite to the first electrode and an edge portion surrounding the pressure-sensitive portion, the edge portion is fixed onto the adapter board by a bonding layer, and the first electrode, the second electrode, the bonding layer and the adapter board define a cavity. The first and second electrodes of the sensor chip are electrically connected to the integrated circuit chip through the adapter board.Type: GrantFiled: January 3, 2023Date of Patent: May 12, 2026Assignees: Beijing BOE Optoelectronics Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Qiuxu Wei, Yue Li, Lihui Wang, Weilong Guo, Yanfei Ren, Taonan Zhang, Wenbo Chang, Jie Sun, Nana He, Shaohua Wu, Guochen Du, Ding Ding, Feng Qu
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Patent number: 12610054Abstract: This disclosure relates generally to sample clipping in video or image and particularly to methods and systems for sample clipping in video or image based on Low Dynamic Range (LDR) coding. For example, an encoder or decoder may determine a sample clipping range for a bock and apply a sample clipping procedure based on the sample clipping range during one of various stages of encoding or decoding process of the block. The sample clipping range may be derived from an LDR selected for encoding the block.Type: GrantFiled: June 27, 2024Date of Patent: April 21, 2026Assignee: Tencent America LLCInventors: Xin Zhao, Ding Ding, Shan Liu