Patents by Inventor Ding Hui Xu

Ding Hui Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit packaging system with interposer and method of manufacture thereof
    Patent number: 9184122
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing an interposer having an interposer bottom side and an interposer top side; attaching a base integrated circuit to the interposer bottom side; attaching a lead to the interposer bottom side, the lead adjacent the base integrated circuit and entirely below the interposer; and forming an encapsulation partially covering the lead and exposing the interposer top side.
    Type: Grant
    Filed: June 6, 2012
    Date of Patent: November 10, 2015
    Assignee: STATS ChipPAC Ltd.
    Inventors: Wei Qiang Jin, Ding Hui Xu
  • INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF MANUFACTURE THEREOF
    Publication number: 20130328216
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing an interposer having an interposer bottom side and an interposer top side; attaching a base integrated circuit to the interposer bottom side; attaching a lead to the interposer bottom side, the lead adjacent the base integrated circuit and entirely below the interposer; and forming an encapsulation partially covering the lead and exposing the interposer top side.
    Type: Application
    Filed: June 6, 2012
    Publication date: December 12, 2013
    Inventors: Wei Qiang Jin, Ding Hui Xu