Patents by Inventor Ding Liu

Ding Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12183682
    Abstract: A semiconductor package is provided. The semiconductor package includes: semiconductor dies, separated from one another, and including die I/Os at their active sides; and a redistribution structure, disposed at the active sides of the semiconductor dies and connected to the die I/Os, wherein the redistribution structure includes first and second routing layers sequentially arranged along a direction away from the die I/Os, the first routing layer includes a ground plane and first signal lines laterally surrounded by and isolated from the first ground plane, the first signal lines connect to the die I/Os and rout the die I/Os from a central region to a peripheral region of the redistribution structure, the second routing layer includes second signal lines and ground lines, and the second signal lines and the ground lines respectively extend from a location in the peripheral region to another location in the peripheral region through the central region.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: December 31, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Hsun Chen, Chien-Hsun Lee, Chung-Shi Liu, Jiun-Yi Wu, Shou-Yi Wang, Tsung-Ding Wang
  • Patent number: 12174599
    Abstract: An energy-saving strategy formulation method for a semi-automatic production line based on model predictive control is performed as follows. max-plus algebra model is constructed, based on which an optimization objective function with the WIP products as discrete elements and sleep start moment and sleep end moment of the automated device as control variables is established. A first unoptimized WIP product is substituted into the optimization objective function, and the optimization objective function is solved to obtain an optimal sequence, in which a first set of values is output as optimization result. Whether all WIP products have been optimized is determined, and if yes, an energy-saving strategy is generated and used to control the automated device, otherwise, the optimization result is treated as disturbance information to be incorporated into the modeling. An energy-saving strategy formulation system is also provided.
    Type: Grant
    Filed: February 1, 2024
    Date of Patent: December 24, 2024
    Assignee: Guangdong University of Technology
    Inventors: Ding Zhang, Jiafeng Yang, Qiang Liu, Duxi Yan, Rongli Zhao
  • Patent number: 12169913
    Abstract: Example aspects include techniques for implementing a high-frequency attention network for single image super-resolution. These techniques may include extracting a plurality of features from an original image input into a CNN to generate a feature map, and restoring one or more high-frequency details of the original image via an efficient residual block (ERB) and a high-frequency attention block (HFAB) configured to assign a scaling factor to one or more high-frequency areas. In addition, the techniques may include generating reconstruction input information by performing an element-wise operation on the one or more high-frequency details and cross-connection information from the feature map and performing, by the CNN, an enhancement operation on the reconstruction input information to generate an enhanced image.
    Type: Grant
    Filed: February 10, 2022
    Date of Patent: December 17, 2024
    Assignee: LEMON INC.
    Inventor: Ding Liu
  • Publication number: 20240412405
    Abstract: A control method includes obtaining sensing data output by an observation sensor of a movable platform when sensing a target object in an environment, determining a position of the target object based on the sensing data, and sending the position of the target object to another movable platform moving in the environment, or to a relay device for the relay device to send the position of the target object to the another movable platform.
    Type: Application
    Filed: August 16, 2024
    Publication date: December 12, 2024
    Inventors: Ding GONG, Zezao LU, Ang LIU
  • Patent number: 12165379
    Abstract: Described are examples for detecting objects in an image on a device including setting, based on a condition, a number of sparse proposals to use in performing object detection in the image, performing object detection in the image based on providing the sparse proposals as input to an object detection process to infer object location and classification of one or more objects in the image, and indicating, to an application and based on an output of the object detection process, the object location and classification of the one or more objects.
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: December 10, 2024
    Assignee: LEMON INC.
    Inventors: Linjie Yang, Yiming Cui, Ding Liu
  • Patent number: 12167047
    Abstract: A method and apparatus for reducing artifacts in a compressed image using a neural-network based deblocking filter. The method may include receiving at least one reconstructed image, wherein each reconstructed image comprises one or more reconstructed blocks and extracting boundary areas associated with boundaries of the one or more reconstructed blocks in the at least one reconstructed image. The extracted boundary areas may be input in a trained deblocking model to generate boundary areas having reduced artifacts and the trained deblocking mode is trained on training data based on estimated compression by a neural image compression (NIC) network. The edge areas associated with the generated boundary areas may be removed; and at least one reconstructed image with reduced artifacts may be generated based on the generated boundary areas.
    Type: Grant
    Filed: December 13, 2022
    Date of Patent: December 10, 2024
    Assignee: TENCENT AMERICA LLC
    Inventors: Ding Ding, Xiaozhong Xu, Shan Liu
  • Publication number: 20240390892
    Abstract: The present disclosure provides a microfluidic substrate and a microfluidic chip including the microfluidic substrate. The microfluidic substrate includes a plurality of microcavities arranged in an array, at least some of the plurality of microcavities are through holes, and a tangent plane at each of at least some points on a sidewall of each microcavity forms a non-perpendicular angle with a reference plane where the microfluidic substrate is located.
    Type: Application
    Filed: October 28, 2021
    Publication date: November 28, 2024
    Inventors: Zhukai Liu, Ruijun Deng, Ding Ding
  • Publication number: 20240379535
    Abstract: An embodiment semiconductor package includes a bare semiconductor chip, a packaged semiconductor chip adjacent the bare semiconductor chip, and a redistribution structure bonded to the bare semiconductor chip and the packaged semiconductor chip. The redistribution structure includes a first redistribution layer having a first thickness; a second redistribution layer having a second thickness; and a third redistribution layer between the first redistribution layer and the second redistribution layer. The third redistribution layer has a third thickness greater than the first thickness and the second thickness. The package further includes an underfill disposed between the bare semiconductor chip and the redistribution structure and a molding compound encapsulating the bare semiconductor chip, the packaged semiconductor chip, and the underfill.
    Type: Application
    Filed: July 22, 2024
    Publication date: November 14, 2024
    Inventors: Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng, Tsung-Ding Wang, Yu-Min Liang, Li-Wei Chou
  • Patent number: 12142560
    Abstract: An embodiment semiconductor package includes a bare semiconductor chip, a packaged semiconductor chip adjacent the bare semiconductor chip, and a redistribution structure bonded to the bare semiconductor chip and the packaged semiconductor chip. The redistribution structure includes a first redistribution layer having a first thickness; a second redistribution layer having a second thickness; and a third redistribution layer between the first redistribution layer and the second redistribution layer. The third redistribution layer has a third thickness greater than the first thickness and the second thickness. The package further includes an underfill disposed between the bare semiconductor chip and the redistribution structure and a molding compound encapsulating the bare semiconductor chip, the packaged semiconductor chip, and the underfill.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: November 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng, Tsung-Ding Wang, Yu-Min Liang, Li-Wei Chou
  • Publication number: 20240359174
    Abstract: A gene detection substrate is provided, including: a substrate; a gene detection channel in the substrate, an opening of the gene detection channel is on one side of the substrate; the gene detection channel includes a sample injection groove, a sample outgoing groove and a flow channel groove sequentially connected and communicated with each other; the flow channel groove includes reaction holes and flow channel structures; the reaction holes are distributed at intervals, and any two adjacent reaction holes are communicated with each other through the flow channel structure; the flow channel structure includes a first, second, and third sub-grooves sequentially connected and communicated with each other; a width of each of the first and third sub-grooves in a first direction is smaller than that of the second sub-groove in the first direction; and the first direction is perpendicular to an arrangement direction of two adjacent reaction holes.
    Type: Application
    Filed: May 19, 2022
    Publication date: October 31, 2024
    Inventors: Yunqing MU, Haonan LIU, Zhukai LIU, Ding DING
  • Publication number: 20240362482
    Abstract: The present invention relates to an auditing system for a built environment of an age-friendly street based on multisource big data. The auditing system includes: a data acquisition module is configured to acquire urban streetscape image data, urban road network data and urban point-of-interest data; a data classification auditing module is configured to acquire the data of the data acquisition module, classify the image data, and process the image data by using a data processing method to acquire evaluated numerical values of different types of indexes; a data summary analysis module is configured to acquire the evaluated numerical values of the data classification auditing module, calculate sub-item index numerical values of each output unit and calculate result data according to the sub-item index numerical values; a audit result output module is configured to acquire the result data of the data summary analysis module and visualize and output the result data.
    Type: Application
    Filed: January 9, 2023
    Publication date: October 31, 2024
    Applicant: TONGJI UNIVERSITY
    Inventors: Yifan YU, Liu LIU, Ye ZHAN, Ding ZHANG, Yu JIAO, Ye YU
  • Publication number: 20240361609
    Abstract: Disclosed is a method to fabricate a multifunctional collimator structure In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; and a plurality of via holes, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, wherein the substrate has a bulk impurity doping concentration equal to or greater than 1×1019 per cubic centimeter (cm?3) and a first thickness, and wherein the bulk impurity doping concentration and the first thickness of the substrate are configured so as to allow the optical collimator to filter light in a range of wavelengths.
    Type: Application
    Filed: July 11, 2024
    Publication date: October 31, 2024
    Inventors: Hsin-Yu CHEN, Chun-Peng LI, Chia-Chun HUNG, Ching-Hsiang HU, Wei-Ding WU, Jui-Chun WENG, Ji-Hong CHIANG, Yen Chiang LIU, Jiun-Jie CHIOU, Li-Yang TU, Jia-Syuan LI, You-Cheng JHANG, Shin-Hua CHEN, Lavanya SANAGAVARAPU, Han-Zong PAN, Hsi-Cheng HSU
  • Publication number: 20240351026
    Abstract: A chip packaging structure and a chip packaging method, the structure including: a sample substrate with through holes; first and second cover plates on opposite sides of the sample substrate; and at least one pair of a sample inlet and a sample outlet, each pair of the sample inlet and the sample outlet is in one or both of the first cover plate and the second cover plate, a flow path is between each pair of the sample inlet and the sample outlet, a first flow channel structure is on a surface of the first cover plate opposite to the sample substrate, a second flow channel structure is on a surface of the second cover plate opposite to the sample substrate, and the first flow channel structure and the second flow channel structure are connected with the through holes, to form a continuous channel corresponding to the flow path.
    Type: Application
    Filed: March 25, 2022
    Publication date: October 24, 2024
    Inventors: Xiangguo MA, Zhukai LIU, Ding DING, Lin DENG
  • Publication number: 20240353008
    Abstract: A seal structure for an in-wheel electric motor drive system. The seal structure is used for forming a seal between a first sealed portion (90s) of an output shaft and a second sealed portion (10s) of a housing. The seal structure (1) comprises a dustproof ring (11) and a seal assembly (12).
    Type: Application
    Filed: September 6, 2021
    Publication date: October 24, 2024
    Inventors: Bin Zhang, Jin Wang, Xin Liu, Ding Li
  • Publication number: 20240357145
    Abstract: This disclosure relates generally to image coding and particularly to methods and systems for neural image compression (NIC). The disclosed NIC decoder/encoder may include various neural network components that are configured to achieve a balance between network complexity and coding efficiency. Such a NIC decoder/encoder implementation particularly include a core decoder and a hyper decoder each including a neural network architecture adapted for achieving a lightweight decoder/encoder.
    Type: Application
    Filed: April 18, 2024
    Publication date: October 24, 2024
    Applicant: Tencent America LLC
    Inventors: Ding DING, Xiaozhong XU, Shan LIU
  • Patent number: 12119423
    Abstract: The solar cell includes a silicon substrate, multiple first electrodes, and multiple second electrodes. The solar cell further includes a tunneling oxide layer, multiple doped polysilicon layers, and at least one barrier layer. The at least one barrier layer is arranged between every adjacent two doped polysilicon layers in the multiple doped polysilicon layers, and the multiple first electrodes are electrically connected to different doped polysilicon layers. The solar cell provided according to the present application can reduce the total thickness of the polycrystalline silicon layer, so that a thinner polycrystalline silicon layer can reduce parasitic absorption, thereby increasing short-circuit current. Moreover, the risk of slurry burning through the tunneling oxide layer is reduced by the barrier layer, while reducing metal recombination, which increases the open circuit voltage of the solar cell, thereby improving the photoelectric conversion efficiency of the solar cell.
    Type: Grant
    Filed: October 17, 2023
    Date of Patent: October 15, 2024
    Assignees: ZHEJIANG JINKO SOLAR CO., LTD., JINKO SOLAR CO., LTD.
    Inventors: Hao Wang, Wenqi Li, Ding Yu, Jiahao Wu, Xu Liu
  • Publication number: 20240333942
    Abstract: A method and apparatus comprising computer code configured to cause a processor or processors to receive a video bitstream comprising a current block in a current picture and reconstruct the current block by transforming the current block by a neural network comprising a plurality of upsample modules and activation modules, and at least one of the activation modules includes a LeakyReLu function and a convolution function.
    Type: Application
    Filed: April 2, 2024
    Publication date: October 3, 2024
    Applicant: TENCENT AMERICA LLC
    Inventors: Ding DING, Xiaozhong Xu, Shan Liu
  • Publication number: 20240333950
    Abstract: A method and apparatus comprising computer code configured to cause a processor or processors to receive a video bitstream comprising a current block in a current picture and reconstruct the current block by transforming the current block by a neural network comprising a plurality of upsample modules and activation modules, and at least one of the upsample modules includes a convolution layer and a pixel shuffle layer, and at least one of the activation modules includes a LeakyReLu function and a convolution function.
    Type: Application
    Filed: March 26, 2024
    Publication date: October 3, 2024
    Inventors: Ding DING, Xiaozhong XU, Shan Liu
  • Publication number: 20240327458
    Abstract: The present disclosure provides a compound. The compound is a compound shown in formula (1) or a stereoisomer, a tautomer, a nitrogen oxide, a solvate, a metabolite, a pharmaceutically acceptable salt, or a prodrug of the compound shown in formula (1). The compound shown in formula (1) can significantly inhibit Mpro or inhibit coronavirus replication, and has excellent metabolic stability.
    Type: Application
    Filed: April 2, 2024
    Publication date: October 3, 2024
    Inventors: Yang YU, Ding XUE, Wei LIU
  • Patent number: 12092839
    Abstract: Disclosed is a method to fabricate a multifunctional collimator structure In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; and a plurality of via holes, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, wherein the substrate has a bulk impurity doping concentration equal to or greater than 1×1019 per cubic centimeter (cm?3) and a first thickness, and wherein the bulk impurity doping concentration and the first thickness of the substrate are configured so as to allow the optical collimator to filter light in a range of wavelengths.
    Type: Grant
    Filed: July 14, 2023
    Date of Patent: September 17, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsin-Yu Chen, Chun-Peng Li, Chia-Chun Hung, Ching-Hsiang Hu, Wei-Ding Wu, Jui-Chun Weng, Ji-Hong Chiang, Yen Chiang Liu, Jiun-Jie Chiou, Li-Yang Tu, Jia-Syuan Li, You-Cheng Jhang, Shin-Hua Chen, Lavanya Sanagavarapu, Han-Zong Pan, Hsi-Cheng Hsu