Abstract: An embodiment of this application provides an electronic device with a movable lifting component, including a base, a lifting component, and a first driving assembly, where the base is fastened to a rear cover of a housing of the electronic device, the first driving assembly rotatably matches the base, and the lifting component is sleeved on an inner side of the first driving assembly. The first driving assembly may rotate relative to the base, the first driving assembly drives the lifting component to move in a direction parallel to an optical axis toward the outside of the housing to form an avoidance space, and a first lens assembly may move in the avoidance space.

Abstract: An electronic device includes a flexible screen, a support mechanism, and a screen holder. The flexible screen includes a deformation area. The support mechanism includes a door plate corresponding to the deformation area, and the door plate is provided with an avoidance slot facing the flexible screen. In an unfolded state, a holding part is at least partially filled between a holding plate and the door plate corresponding to a main shaft module in the avoidance slot. In a folded state, the holding part slides out of the avoidance slot, so that the deformation area of the flexible screen in the folded state can enter the avoidance slot. In the folded state, the holding part slides out of the avoidance slot to increase available space in the avoidance slot, so that the deformation area of the flexible screen enters the avoidance slot.

Abstract: A semiconductor package is provided. The semiconductor package includes: semiconductor dies, separated from one another, and including die I/Os at their active sides; and a redistribution structure, disposed at the active sides of the semiconductor dies and connected to the die I/Os, wherein the redistribution structure includes first and second routing layers sequentially arranged along a direction away from the die I/Os, the first routing layer includes a ground plane and first signal lines laterally surrounded by and isolated from the first ground plane, the first signal lines connect to the die I/Os and rout the die I/Os from a central region to a peripheral region of the redistribution structure, the second routing layer includes second signal lines and ground lines, and the second signal lines and the ground lines respectively extend from a location in the peripheral region to another location in the peripheral region through the central region.

Abstract: A hinge mechanism includes an inner hinge, a rotating assembly that can rotate relative to the inner hinge, and an outer hinge. The inner hinge is connected to the outer hinge, and the rotating assembly is located between the inner hinge and the outer hinge. The rotating assembly includes a first swing arm, a second swing arm, and a linkage structure, and the first swing arm and the second swing arm may rotate relative to the inner hinge. The linkage structure includes a rotating member, a first translation member, and a second translation member. The first swing arm and the second swing arm can drive the first translation member and the second translation member to move reversely, and the rotating member can move synchronously with the first translation member and the second translation member.

Abstract: Disclosed herein, a haircare appliance using wireless transmission of information and/or energy between the appliance's main body and an accessory. The appliance has a main body with a processing element, a communication element, and a blower for generating an airflow. The main body has an attachment region for connecting an accessory. The accessory has a sensor element to determine a sensor reading, a processing element, and a communication element. The accessory is selectively attachable to the main body at the attachment region, and when attached to the main body, it can receive the airflow from the blower, and discharge the received airflow towards the hair of a user. The main body and accessory have a communication connection for bidirectional communication. The bidirectional communication is a wireless communication connection, and energy for operating the sensor element is provided by the wireless communication and/or a separate wireless energy transfer connection.

Abstract: The present invention relates to a beverage additive comprising a clouding agent comprising a soluble citrus fiber as well as to a beverage comprising said beverage additive. The present invention further relates to a method for the preparation of soluble citrus fibers and the use of said soluble citrus fibers as a clouding agent in a beverage.

Abstract: A hinge mechanism includes a main shaft, a rotating module, a first door plate, and a second door plate. The rotating module includes a first rotating component, a second rotating component, a first housing fastening bracket, and a second housing fastening bracket. The first rotating component includes a first support arm, a first connecting member, and a first door plate fastening bracket. The first connecting member is separately and rotatably connected to the first support arm and the first door plate fastening bracket, and the first connecting member is rotatably or slidably connected to the main shaft. The second rotating component includes a second support arm, a second connecting member, and a second door plate fastening bracket. The second connecting member is rotatably connected to the second support arm and the second door plate fastening bracket, and the second connecting member is rotatably or slidably connected to the main shaft.

Abstract: A semiconductor package includes a circuit board structure, a first redistribution layer structure and first bonding elements. The circuit board structure includes outermost first conductive patterns and a first mask layer adjacent to the outermost first conductive patterns. The first redistribution layer structure is disposed over the circuit board structure. The first bonding elements are disposed between and electrically connected to the first redistribution layer structure and the outermost first conductive patterns of the circuit board structure. In some embodiments, at least one of the first bonding elements covers a top and a sidewall of the corresponding outermost first conductive pattern.

Abstract: A method for treating a micro electro-mechanical system (MEMS) component is disclosed. In one example, the method includes the steps of providing a first wafer, treating the first wafer to form cavities and at least an oxide layer on a top surface of the first wafer using a first chemical vapor deposition (CVD) process, providing a second wafer, bonding the second wafer on a top surface of the at least one oxide layer, treating the second wafer to form a first plurality of structures, depositing a layer of Self-Assembling Monolayer (SAM) to a surface of the MEMS component using a second CVD process.

Abstract: Optical sensors and their making methods are described herein. In some embodiments, a described sensing apparatus includes: an image sensor; a collimator above the image sensor, wherein the collimator includes an array of apertures; and an optical filtering layer above the collimator, wherein the optical filtering layer is configured to filter a portion of light to be transmitted into the array of apertures.

Abstract: Disclosed is a method to fabricate a multifunctional collimator structure In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; and a plurality of via holes, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, wherein the substrate has a bulk impurity doping concentration equal to or greater than 1×1019 per cubic centimeter (cm?3) and a first thickness, and wherein the bulk impurity doping concentration and the first thickness of the substrate are configured so as to allow the optical collimator to filter light in a range of wavelengths.

Abstract: Disclosed is a method to fabricate a multifunctional collimator structure In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; and a plurality of via holes, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, wherein the substrate has a bulk impurity doping concentration equal to or greater than 1×1019 per cubic centimeter (cm?3) and a first thickness, and wherein the bulk impurity doping concentration and the first thickness of the substrate are configured so as to allow the optical collimator to filter light in a range of wavelengths.

Abstract: Optical sensors and their making methods are described herein. In some embodiments, a described sensing apparatus includes: an image sensor; a collimator above the image sensor, wherein the collimator includes an array of apertures; and an optical filtering layer above the collimator, wherein the optical filtering layer is configured to filter a portion of light to be transmitted into the array of apertures.

Abstract: Disclosed is a cost-effective method to fabricate a multifunctional collimator structure for contact image sensors to filter ambient infrared light to reduce noises. In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; a plurality of via holes; and a conductive layer, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, and wherein the conductive layer is formed over at least one of the following: the first surface of the first dielectric layer and a portion of sidewalls of each of the plurality of via holes, and wherein the conductive layer is configured so as to allow the optical collimator to filter light in a range of wavelengths.

Abstract: Optical sensors and their making methods are described herein. In some embodiments, a described sensing apparatus includes: an image sensor; a collimator above the image sensor, wherein the collimator includes an array of apertures; and an optical filtering layer above the collimator, wherein the optical filtering layer is configured to filter a portion of light to be transmitted into the array of apertures.

Abstract: Disclosed is a method to fabricate a multifunctional collimator structure In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; and a plurality of via holes, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, wherein the substrate has a bulk impurity doping concentration equal to or greater than 1×1019 per cubic centimeter (cm?3) and a first thickness, and wherein the bulk impurity doping concentration and the first thickness of the substrate are configured so as to allow the optical collimator to filter light in a range of wavelengths.

Abstract: A modified-material-based high-precision combined antenna for satellite navigation and communications includes a high-frequency satellite navigation antenna metal radiating surface, a low-frequency satellite navigation antenna metal radiating surface, a WIFI/Bluetooth antenna metal radiating surface, a PCB, a shielding metal cavity and an injection molded modified-material-based substrate. The low-frequency satellite navigation antenna metal radiating surface is located between the high-frequency satellite navigation antenna metal radiating surface and the PCB. The WIFI/Bluetooth antenna metal radiating surface is located on a side of the low-frequency satellite navigation antenna metal radiating surface. The injection molded modified-material-based substrate is made of polyphenyl ether doped with a modified material, and the modified material has a relative permittivity of 2.65 and a density of 1.06 g/cm3.

Abstract: Disclosed is a cost-effective method to fabricate a multifunctional collimator structure for contact image sensors to filter ambient infrared light to reduce noises. In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; a plurality of via holes; and a conductive layer, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction.

Abstract: Disclosed is a method to fabricate a multifunctional collimator structure In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; and a plurality of via holes, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, wherein the substrate has a bulk impurity doping concentration equal to or greater than 1×1019 per cubic centimeter (cm?3) and a first thickness, and wherein the bulk impurity doping concentration and the first thickness of the substrate are configured so as to allow the optical collimator to filter light in a range of wavelengths.

Abstract: Optical sensors and their making methods are described herein. In some embodiments, a described sensing apparatus includes: an image sensor; a collimator above the image sensor, wherein the collimator includes an array of apertures; and an optical filtering layer above the collimator, wherein the optical filtering layer is configured to filter a portion of light to be transmitted into the array of apertures.