Abstract: A LED (Light-Emitting Diode) package structure is provided. The LED package improved structure includes a base, a plurality of metallic nanoparticles and a LED unit. The base has an accommodating space, wherein the accommodating space has a bottom surface and at least one side surface surrounding the bottom surface. The metallic nanoparticles cover the bottom surface and/or the side surface. The LED unit is disposed in the accommodating spare, in which light emitted from the LED unit is reflected or scattered by the metallic nanoparticles, each of the metallic nanoparticles has a diameter smaller than 10 nm and is electrically isolated.

Abstract: A light enhancing structure includes a light emitting diode in it and at least one coating layer. The light emitting diode unit includes a plurality of surfaces and a light-emitting surface. The light-emitting surface is for allowing a plurality of lights generated inside the light emitting diode unit to emit through. The coating layer is formed on the surfaces for blocking or reflecting one of the lights generated inside the light emitting diode unit, and to light intensity of the light emitting diode unit is enhanced.

Abstract: A LED (Light-Emitting Diode) package structure is provided. The LED package improved structure includes a base, a plurality of metallic nanoparticles and a LED unit. The base has an accommodating space, wherein the accommodating space has a bottom surface and at least one side surface surrounding the bottom surface. The metallic nanoparticles cover the bottom surface and/or the side surface. The LED unit is disposed in the accommodating spare, in which light emitted from the LED unit is reflected or scattered by the metallic nanoparticles, each of the metallic nanoparticles has a diameter smaller than 10 nm and is electrically isolated.

Abstract: A light emitting diode package structure is provided. The light emitting diode package structure includes at least one light emitting diode unit, an encapsulating body and at least one isolation film. The encapsulating body includes a plurality of surfaces and at least one light-emitting surface, wherein one of the surfaces supports the light emitting diode unit, the other surfaces are exposed. The at least one isolation film is formed on the exposed surfaces. Wherein the isolation film blocks or reflects a portion of light emitted from the light emitting diode unit.

Abstract: A light enhancing structure includes a light emitting diode in it and at least one coating layer. The light emitting diode unit includes a plurality of surfaces and a light-emitting surface. The light-emitting surface is for allowing a plurality of lights generated inside the light emitting diode unit to emit through. The coating layer is formed on the surfaces for blocking or reflecting one of the lights generated inside the light emitting diode unit, and to light intensity of the light emitting diode unit is enhanced.

Abstract: A light emitting diode package structure is provided. The light emitting diode package structure includes at least one light emitting diode unit, an encapsulating body and at least one isolation film. The encapsulating body includes a plurality of surfaces and at least one light-emitting surface, wherein one of the surfaces supports the light emitting diode unit, the other surfaces are exposed. The at least one isolation film is formed on the exposed surfaces. Wherein the isolation film blocks or reflects a portion of light emitted from the light emitting diode unit.

Abstract: An LED chip package having a topographical glass coating on top surface for enhancing heat dissipation is disclosed. A circular wall is optionally built to surround the LED chip for reflecting light beams from the LED chips; the glass coating further extends to cove the inner wall surface of the circular wall. The larger area the glass coating covers, the more heat the package dissipates in a time unit. The LED chip package according to the present invention exhibits higher thermal dissipation and helps to last longer the life of the LED chip package than a traditional one.