Abstract: Systems and methods for cooling a server case are disclosed. In at least one embodiment, a fan switches between an axial operation mode and a centrifugal operation mode to change a direction of an air flow within this server case.

Abstract: A die substrate, including a dielectric body, the body having a first body surface, a second body surface on an opposite side and body edge surfaces located in between. Current-carrying metal lines located in the dielectric body. One or more of the metal lines routed to one or more of the body edge surfaces. A termination layer located on the at least one body edge surface and electrically connected to the least one of the metal lines routed to the body edge surfaces. Electrically conductive plating located on the at least one body edge surface. The plating connected to the termination layer for an electrical current connection or a ground connection to the at least one metal line. A method of manufacturing an integrated circuit package, the package and a computer having the die substrate are also disclosed.

Abstract: Systems and methods for cooling a server case are disclosed. In at least one embodiment, a fan switches between an axial operation mode and a centrifugal operation mode to change a direction of an air flow within this server case.

Abstract: A cooling system for a datacenter device is disclosed. Fins are provided between a first plate and a second plate to dissipate a first amount of heat to an environment in a first configuration of the fins. The first plate is movable relative to the second plate to expose a surface area of the fins to the environment in a second configuration of the fins.

Abstract: A multi-format graphics process unit (GPU) docking board is disclosed. The multi-format GPU docking board includes a first switch to enable communication between a first format (GPU) board and a second format GPU board, and a second switch to enable communication between a central processing unit (CPU) and the first format GPU board and between the CPU and the second format GPU board.