Abstract: A photosensitive assembly for camera module includes a support substrate, a photosensitive chip electrically connected to the support substrate, and a molded part injection-molded on the support substrate, wherein the molded part includes a molded base and a first protrusion, a peripheral side of the molded base has a spacing distance from an edge of the support substrate, the first protrusion is extended outward from the peripheral side of the molded base to the edge of the support substrate, and a volume proportion of silicon powder in the molded part is 75%˜85%. By optimizing the composition of the molding liquid of the molded part, the occurrence of mold sticking is reduced.