Patents by Inventor Dingwei Lu

Dingwei Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Moulding process of composite material including high-thermal conductor and room-temperature magnetic refrigerant
    Patent number: 7621046
    Abstract: A molding process of composite material including high-thermal-conductor and room-temperature magnetic refrigerant comprises the steps of nesting magnetic refrigerant with high-thermal-conductor and connecting them mutually, especially making the room-temperature magnetic-thermal-conductor into sheet, strip or filament, inserting the high-thermal-conductors'sheet, strip or filament in the room-temperature magnetic refrigerant's sheet or filament and connecting them fully. This invention has solved the application of the room-temperature magnetic-thermal-conductor, particularly the application of the room-temperature magnetic-thermal-conductor which is lower thermal-conductor, easier oxidation and powdering. The invention utilizes the high thermal-conductor to solve the problem of room-temperature magnetic refrigerant which is poor in conventional heat exchange, meanwhile decreases the loss of the magnetic-thermal effect.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: November 24, 2009
    Assignee: Nanjing University
    Inventor: Dingwei Lu
  • Moulding process of composite material including high-thermal & shy; conductor and room-temperature magnetic refrigerant
    Publication number: 20050241134
    Abstract: A molding process of composite material including high-thermal-conductor and room-temperature magnetic refrigerant comprises the steps of nesting magnetic refrigerant with high-thermal-conductor and connecting them mutually, especially making the room-temperature magnetic-thermal-conductor into sheet, strip or filament, inserting the high-thermal-conductors'sheet, strip or filament in the room-temperature magnetic refrigerant's sheet or filament and connecting them fully. This invention has solved the application of the room-temperature magnetic-thermal-conductor, particularly the application of the room-temperature magnetic-thermal-conductor which is lower thermal-conductor, easier oxidation and powdering. The invention utilizes the high thermal-conductor to solve the problem of room-temperature magnetic refrigerant which is poor in conventional heat exchange, meanwhile decreases the loss of the magnetic-thermal effect.
    Type: Application
    Filed: June 30, 2003
    Publication date: November 3, 2005
    Inventor: Dingwei Lu