Patents by Inventor Dingwei ZHANG

Dingwei ZHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200201086
    Abstract: A bonding device for a display panel and a bonding method for same are provided. The bonding device for the display panel includes a support platform and a carrier integrally disposed on the support platform. A first surface of the support platform and a first surface of the carrier are configured to carry the display panel and are positioned on a same horizontal plane.
    Type: Application
    Filed: March 20, 2019
    Publication date: June 25, 2020
    Applicant: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventor: Dingwei ZHANG
  • Patent number: 10244620
    Abstract: A circuit board and a display device are disclosed. The circuit board is configured to be bonded onto a display substrate; the circuit board includes a bonding connection end, which includes a base film and a plurality of first connecting terminals disposed on the base film; regions, which are corresponding to at least part of the first connecting terminals, of the base film comprises a transparent membrane material. The circuit board improves the product quality monitoring level during the bonding process, and decreases the product risks.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: March 26, 2019
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Liwen Cai, Xianzhen Tang, Dingwei Zhang, Liang Chen, Ben Guo, Lei Xu, Fei Fang
  • Publication number: 20170118840
    Abstract: A circuit board and a display device are disclosed. The circuit board is configured to be bonded onto a display substrate; the circuit board includes a bonding connection end, which includes a base film and a plurality of first connecting terminals disposed on the base film; regions, which are corresponding to at least part of the first connecting terminals, of the base film comprises a transparent membrane material. The circuit board improves the product quality monitoring level during the bonding process, and decreases the product risks.
    Type: Application
    Filed: September 22, 2016
    Publication date: April 27, 2017
    Inventors: Liwen CAI, Xianzhen TANG, Dingwei ZHANG, Liang CHEN, Ben GUO, Lei XU, Fei FANG