Patents by Inventor Dinh Vu

Dinh Vu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150276533
    Abstract: A device/method for sensing a physical parameter, including a sensor die and a stress-sensitive circuit. The sensor die includes a semiconductor substrate and a cavity that creates an elastic element that bends in response to the physical parameter exerted on the sensor die. The elastic element includes at least at least one rigid island formed within the cavity, a thin area surrounding the at least one rigid island and having smaller thickness than the rigid island, and at least one stress concentrator at least partially formed in the thin area of the elastic element on the side of the substrate opposite the cavity. The stress-sensitive circuit includes at least one stress-sensitive component formed in the thin area of the elastic element. The at least one stress concentrator increases stress in the locations of the at least one stress-sensitive component resulting in an increase of the device sensitivity to the physical parameter.
    Type: Application
    Filed: May 22, 2015
    Publication date: October 1, 2015
    Inventors: Nickolai S. Belov, Lihua Li, Kim Vu, Dinh Vu
  • Publication number: 20150192487
    Abstract: Low pressure sensors and flow sensors are provided. In some embodiments, a pressure sensor can include a sensor die that includes a substrate and a cavity that is formed in a bottom side of the substrate and that defines an elastic element including a thin diaphragm area and a rigid island. A maximum thickness of the rigid island can be substantially smaller than a thickness of the substrate and can be greater than a thickness of the thin diaphragm area. Side walls of the rigid island can be substantially parallel to one another and can be substantially perpendicular to top and bottom surfaces of the wafer and substantially perpendicular to top and bottom surfaces of the die. The side walls of the at least one rigid island can be formed by wet etching the cavity into the die. The wafer can have an impurity diffused in one or more portions thereof prior to the wet etching such that the one or more portions are doped.
    Type: Application
    Filed: January 8, 2014
    Publication date: July 9, 2015
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Nickolai S. Belov, Lihua Li, Kim Vu, Dinh Vu
  • Publication number: 20070248432
    Abstract: A blind fastener is provided comprising a core bolt comprised of a bolt shaft and a bolt head. A metal sleeve is included comprising a rigid cylindrical base and a malleable cylindrical tail, the metal sleeve is positioned around the bolt shaft with the malleable cylindrical tail in communication with the bolt head. A travel stop feature is formed on the rigid cylindrical base opposite the malleable cylindrical tail. A drive feature includes a threaded bolt section extending from a foot end of the bolt shaft and a drive nut rotatably thereto. The drive nut allows the core bolt to be pulled within the metal sleeve such that the bolt head compresses the malleable cylindrical tail to form a retention button.
    Type: Application
    Filed: April 21, 2006
    Publication date: October 25, 2007
    Inventors: Gary Cassatt, Dinh Vu, Robert Mock