Abstract: Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.

Abstract: Embodiments of the present invention are directed generally to methods for producing high purity exo-alkenylnorbornenes from a mixture of conformational isomers thereof.

Abstract: Embodiments in accordance with the present invention provide for a palladium complex characterized by the general formula: where A is a bidentate monoanionic ligand, NHC is a nucleophilic heterocyclic carbene, and Z is an anionic ligand. Such palladium complexes are useful in initiating cross-coupling reactions.

Abstract: Embodiments in accordance with the present invention provide waveguide structures and methods of forming such structures where core and laterally adjacent cladding regions are defined. Some embodiments of the present invention provide waveguide structures where core regions are collectively surrounded by laterally adjacent cladding regions and cladding layers and methods of forming such structures.

Abstract: Embodiments in accordance with the present invention provide for a palladium complex characterized by the general formula: where A is a bidentate monoanionic ligand, NHC is a nucleophilic heterocyclic carbene, and Z is an anionic ligand. Such palladium complexes are useful in initiating cross-coupling reactions.

Abstract: Polymeric compositions for semiconductor applications comprising 10 to 99 wt. % of norbornene-type cycloolefin monomers represented by one or more of Formulae I(a), I(b), and optionally I(c) and/or I(d), 0.0005 to 0.5 wt. % of an addition polymerization procatalyst, and optionally: up to 0.5 wt. % of a cocatalyst, up to 59 wt. % of a crosslinking monomer, up to 50 wt. % of a viscosifier, up to 20 wt. % of a thixotropic additive(s), up to 80 wt. % of a filler, up to 10 wt. % of an antioxidant, and up to 0.6 wt. % of an antioxidant synergist, the total of the components of the formulation adding up to 100%. Such formulations are mass polymerized, or cured, to form polymeric compositions that have properties desirable for a variety of specific electronic, microelectronic, optoelectronic and micro-optoelectronic applications such as die attach adhesives, underfill materials, prepreg binders, encapsulants, protective layers, and other related applications.

Abstract: Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.

Abstract: Palladium compound compositions are provided in accordance with Formulae [((R)3E)aPd(Q)(LB)b]p [WCA]r, where ((R)3E) is a Group 15 electron donor ligand, Q is an anionic ligand, LB is a Lewis base, WCA is a weakly coordinating anion, a is 1, 2 or 3, b is 0, 1 or 2, the sum of a and b is 1, 2 or 3 and each of p and r is an integer such that the molecular charge is zero, or [(E(R)3)(E(R)2R*)Pd(LB)]p[WCA]r where E(R)2R* represents a Group 15 neutral electron donor ligand and where R* is an anionic hydrocarbyl containing moiety, bonded to the Pd and having a ? hydrogen with respect to the Pd center. Such compound composition exhibits latent polymerization activity in the presence of polycyclic olefins.