Abstract: A method of providing uniform application of pressure during thermocompression bonding of semiconductor elements onto a bonding surface of a semiconductor package is described. A member having a plane surface is interposed between the semiconductor element and the bonding tool to provide a uniform force distribution to the plane surface of the member and hence to the semiconductor elements. In a preferred embodiment, a plano-convex vitreous member is placed upon the top of the semiconductor element with the plane surface thereof contacting the semiconductor element. A bonding tool is brought into contact with the convex surface portion of the hemisphere transmitting a uniform force to the plane surface, Thus, uniform force is brought to bear upon the semiconductor element providing a uniform thermocompression bond between the semiconductor element and the bonding surface.

Abstract: A pair of conductive surfaces are provided on opposing surfaces of a vitreous or devitrified apertured insulator. A sheet of lead is prepared by electroplating gold on all surfaces thereof, and the insulators are pressed into a surface of the lead mask so that only a first one of the upper and lower surfaces of the member is exposed on said mask surface. A requisite conductive material is then provided on the exposed first one of the upper and lower surfaces of the insulating member and on said adjacent surface of the mask. The gold layer on the back surface of the mask is scraped away and the lead mask is then immersed in a solution which dissolves the lead. The freed insulators are then recovered and cleaned and the second one of the pair of conductive surfaces is applied to the second one of the upper and lower opposing surfaces of the insulator in a similar manner.