Patents by Inventor Dino Lei

Dino Lei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reduction of chipping damage to MEMS structure
    Patent number: 9738511
    Abstract: A MEMS (microelectromechanical systems) structure comprises a MEMS wafer. A MEMS wafer includes a cap with cavities bonded to a structural layer through a dielectric layer disposed between the cap and the structural layer. Unique configurations of MEMS devices and methods of providing such are set forth which provide for, in part, creating rounded, scalloped or chamfered MEMS profiles by shaping the etch mask photoresist reflow, by using a multi-step deep reactive ion etch (DRIE) with different etch characteristics, or by etching after DRIE.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: August 22, 2017
    Assignee: INVENSENSE, INC.
    Inventors: Jongwoo Shin, Kirt Reed Williams, Cerina Zhang, Kuolung (Dino) Lei
  • REDUCTION OF CHIPPING DAMAGE TO MEMS STRUCTURE
    Publication number: 20150076631
    Abstract: A MEMS (microelectromechanical systems) structure comprises a MEMS wafer. A MEMS wafer includes a cap with cavities bonded to a structural layer through a dielectric layer disposed between the cap and the structural layer. Unique configurations of MEMS devices and methods of providing such are set forth which provide for, in part, creating rounded, scalloped or chamfered MEMS profiles by shaping the etch mask photoresist reflow, by using a multi-step deep reactive ion etch (DRIE) with different etch characteristics, or by etching after DRIE.
    Type: Application
    Filed: March 25, 2014
    Publication date: March 19, 2015
    Applicant: InvenSense, Inc.
    Inventors: Jongwoo SHIN, Kirt Reed WILLIAMS, Cerina ZHANG, Kuolung (Dino) LEI
  • Implantable Addressable Segmented Electrodes
    Publication number: 20080255647
    Abstract: Implantable addressable segmented electrode devices, as well as methods for making and using the same, are provided. The subject devices include segmented electrode structures made up of an integrated circuit electrically coupled to two or more electrodes, where each electrode can be individually activated. Also provided are implantable devices and systems, as well as kits containing such devices and systems or components thereof, which include the segmented electrode structures.
    Type: Application
    Filed: December 22, 2005
    Publication date: October 16, 2008
    Inventors: Marc Jensen, Benedict J. Costello, Todd Thompson, Mark Zdeblick, Jeremy Frank, Dino Lei, Olivier Colliou, George M. Savage
  • Apparatus and method for bubble-free application of a resin to a substrate
    Patent number: 6846360
    Abstract: An apparatus and method which is suitable for the bubble-free application of a resin to a substrate. The apparatus typically includes an airtight chamber which receives the substrate and a resin dispenser for dispensing the liquid resin onto the substrate. After a vacuum pressure is induced in the chamber, the resin is dispensed onto the substrate. Accordingly, air is substantially incapable of becoming trapped between the resin and the substrate and forming air bubbles during subsequent processing of the substrate.
    Type: Grant
    Filed: January 13, 2003
    Date of Patent: January 25, 2005
    Assignee: Aptos Corporation
    Inventor: Dino Lei