Abstract: An implantable cardiac stimulation device having an improved multi-level electronic package is disclosed. The multi-lever package includes at least two stacked internal substrates for mounting electronic circuits, a protective lid for protecting the substrates, and an external interconnect structure mounted on the lid which is also capable of mounting electronic components. The interconnection between the at least two internal substrates is achieved by vertically-oriented wirebonds, and the interconnection between at least one internal substrate and the external interconnect structure is achieved by vertically-oriented brazed-on pins which pass through holes in the protective lid. This construction minimizes the planar dimensions of the electronic package and optimizes space in the physiologically-curved portions of the housing.

Abstract: A cardiac stimulation device having a reduced volumetric configuration contains a pair of high-voltage cylindrical discharge capacitors positioned at rounded edges within a device container. The capacitors have electrical contact tabs at one end which are inserted directly through apertures formed within an associated electronic module. The capacitor tabs are connected directly to the electronic module eliminating the need for secondary connectors or point to point wiring, thus reducing the number of connections. Direct connection of the capacitors to the electronic module allows for optimal positioning of the module within the container. Specifically, the generally planar module is oriented perpendicular to planar cover surfaces of the container. Irregularly shaped components attached to the surface of the module advantageously extend away from the surface into remaining voids within the container.