Patents by Inventor Dion I. de Roo

Dion I. de Roo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8280082
    Abstract: The present invention relates to a microphone that includes a housing and a diaphragm and backplate located with the housing. The housing has a sound port for receiving the sound. The diaphragm undergoes movement relative to the backplate, which it opposes, in response to the incoming sound. The backplate has a charged layer with a first surface that is exposed to the diaphragm and a second surface opposite the first surface. The backplate further includes a conductor for transmitting a signal from the backplate to electronics in the housing. The conductor faces the second surface of the charged layer. To minimize the charge degradation created by contact with or infiltration of foreign materials, the first surface, the second surface, or both surfaces of the charged layer includes a protective layer thereon.
    Type: Grant
    Filed: March 17, 2010
    Date of Patent: October 2, 2012
    Assignee: Sonion Nederland B.V.
    Inventors: Aart Z. van Halteren, Roelof A. Marissen, Michel Bosman, Dion I. de Roo, Raymond Mögelin, Michel de Nooij
  • Publication number: 20100172521
    Abstract: The present invention relates to a microphone that includes a housing and a diaphragm and backplate located with the housing. The housing has a sound port for receiving the sound. The diaphragm undergoes movement relative to the backplate, which it opposes, in response to the incoming sound. The backplate has a charged layer with a first surface that is exposed to the diaphragm and a second surface opposite the first surface. The backplate further includes a conductor for transmitting a signal from the backplate to electronics in the housing. The conductor faces the second surface of the charged layer. To minimize the charge degradation created by contact with or infiltration of foreign materials, the first surface, the second surface, or both surfaces of the charged layer includes a protective layer thereon.
    Type: Application
    Filed: March 17, 2010
    Publication date: July 8, 2010
    Applicant: Sonion Nederland B.V.
    Inventors: Aart Z. van Halteren, Roelof A. Marissen, Michel Bosman, Dion I. de Roo, Raymond Mögelin, Michel de Nooij
  • Patent number: 7684575
    Abstract: The present invention relates to a microphone that includes a housing and a diaphragm and backplate located with the housing. The housing has a sound port for receiving the sound. The diaphragm undergoes movement relative to the backplate, which it opposes, in response to the incoming sound. The backplate has a charged layer with a first surface that is exposed to the diaphragm and a second surface opposite the first surface. The backplate further includes a conductor for transmitting a signal from the backplate to electronics in the housing. The conductor faces the second surface of the charged layer. To minimize the charge degradation created by contact with or infiltration of foreign materials, the first surface, the second surface, or both surfaces of the charged layer includes a protective layer thereon.
    Type: Grant
    Filed: October 6, 2006
    Date of Patent: March 23, 2010
    Assignee: Sonion Nederland B.V.
    Inventors: Aart Z. van Halteren, Roelof A. Marissen, Michel Bosman, Dion I. de Roo, Raymond Mögelin, Michel de Nooij
  • Patent number: 7286680
    Abstract: A microphone includes a separate end cover with a sound port. A diaphragm is directly attached to the end cover. The backplate is positioned within the housing against a ridge near an end of the housing. A spacer is positioned against the backplate. The diaphragm engages the spacer when the end cover, with its attached diaphragm, is installed in the housing. The backplate of the microphone has an integral connecting wire that is made of the same material as the backplate. The integral connecting wire may have an inherent spring force to provide a pressure contact with the accompanying electrical components. The integral connecting wire electrically couples the backplate to the electronic components within the housing and transmits the raw audio signal corresponding to movement of the diaphragm. The housing may have first and second ridges on which the printed circuit board and the electret assembly are mounted, respectively.
    Type: Grant
    Filed: May 19, 2006
    Date of Patent: October 23, 2007
    Assignee: Sonion Nederland B.V.
    Inventors: Michael G. M. Steeman, Hendrik Dolleman, Paul C. van Hal, Adrianus M. Lafort, Jan Hijman, Dion I. de Roo, Auke P. Nauta, Raymond Mögelin
  • Patent number: 7239714
    Abstract: In a microphone cartridge, a flexible printed circuit board serves two functions, separating the diaphragm and backplate, and electrically connecting the cartridge and the buffer amplifier. The flex-print includes a spacer portion that maintains the appropriate distance between the diaphragm and backplate, and an integral lead portion having a conductor serving as the signal path for transmitting the signal from the cartridge to the amplifier. The spacer portion has a conductor that electrically contacts the diaphragm or backplate and is connected to the conductor of the integral lead portion. The integral lead portion may optionally include a second electrical conductor providing a reference path from the cartridge to the amplifier. Further, the flex-print may be used as the carrier for the amplifier, its associated circuitry, and for other circuitry within the listening device.
    Type: Grant
    Filed: October 7, 2002
    Date of Patent: July 3, 2007
    Assignee: Sonion Nederland B.V.
    Inventors: Marcel de Blok, Adrianus M. Lafort, Dion I. de Roo
  • Patent number: 7136496
    Abstract: The present invention relates to a microphone that includes a housing and a diaphragm and backplate located with the housing. The housing has a sound port for receiving the sound. The diaphragm undergoes movement relative to the backplate, which it opposes, in response to the incoming sound. The backplate has a charged layer with a first surface that is exposed to the diaphragm and a second surface opposite the first surface. The backplate further includes a conductor for transmitting a signal from the backplate to electronics in the housing. The conductor faces the second surface of the charged layer. To minimize the charge degradation created by contact with or infiltration of foreign materials, the first surface, the second surface, or both surfaces of the charged layer includes a protective layer thereon.
    Type: Grant
    Filed: October 8, 2002
    Date of Patent: November 14, 2006
    Assignee: Sonion Nederland B.V.
    Inventors: Aart Z. van Halteren, Roelof A. Marissen, Michel Bosman, Dion I. de Roo, Raymond Mögelin, Michel de Nooij
  • Patent number: 7062058
    Abstract: A microphone includes a separate end cover with a sound port. A diaphragm is directly attached to the end cover. The backplate is positioned within the housing against a ridge near an end of the housing. A spacer is positioned against the backplate. The diaphragm engages the spacer when the end cover, with its attached diaphragm, is installed in the housing. The backplate of the microphone has an integral connecting wire that is made of the same material as the backplate. The integral connecting wire may have an inherent spring force to provide a pressure contact with the accompanying electrical components. The integral connecting wire electrically couples the backplate to the electronic components within the housing and transmits the raw audio signal corresponding to movement of the diaphragm. The housing may have first and second ridges on which the printed circuit board and the electret assembly are mounted, respectively.
    Type: Grant
    Filed: April 17, 2002
    Date of Patent: June 13, 2006
    Assignee: Sonion Nederland B.V.
    Inventors: Michael G. M. Steeman, Hendrik Dolleman, Paul C. van Hal, Adrianus M. Lafort, Jan Hijman, Dion I. de Roo, Auke P. Nauta, Raymond Mögelin
  • Patent number: 6937735
    Abstract: A microphone is constructed to be more tolerant to a wide range of relative humidity conditions without adversely affecting the performance of the microphone. The microphone includes a housing with a sound port for receiving sound and an electret assembly for converting the sound into an output signal. The electret assembly includes a diaphragm and a backplate. The backplate is made of at least two layers, usually polymeric layers. The first layer of material has a first hygroscopic coefficient and a second layer of material has a second hygroscopic coefficient. The first and second layers cause the backplate to bend in response to higher humidity conditions, thereby minimizing the adverse effects on microphone performance caused by characteristic changes in the diaphragm at the higher humidity conditions.
    Type: Grant
    Filed: August 1, 2002
    Date of Patent: August 30, 2005
    Assignee: SonionMicrotronic Néderland B.V.
    Inventors: Dion I. de Roo, Adrianus M. Lafort, Michel de Nooij, Raymond Mögelin
  • Publication number: 20030076970
    Abstract: The present invention relates to a microphone that includes a housing and a diaphragm and backplate located with the housing. The housing has a sound port for receiving the sound. The diaphragm undergoes movement relative to the backplate, which it opposes, in response to the incoming sound. The backplate has a charged layer with a first surface that is exposed to the diaphragm and a second surface opposite the first surface. The backplate further includes a conductor for transmitting a signal from the backplate to electronics in the housing. The conductor faces the second surface of the charged layer. To minimize the charge degradation created by contact with or infiltration of foreign materials, the first surface, the second surface, or both surfaces of the charged layer includes a protective layer thereon.
    Type: Application
    Filed: October 8, 2002
    Publication date: April 24, 2003
    Inventors: Aart Z. van Halteren, Roelof A. Marissen, Michel Bosman, Dion I. de Roo, Raymond Mogelin, Michel de Nooij
  • Publication number: 20030068059
    Abstract: In a microphone cartridge, a flexible printed circuit board serves two functions, separating the diaphragm and backplate, and electrically connecting the cartridge and the buffer amplifier. The flex-print includes a spacer portion that maintains the appropriate distance between the diaphragm and backplate, and an integral lead portion having a conductor serving as the signal path for transmitting the signal from the cartridge to the amplifier. The spacer portion has a conductor that electrically contacts the diaphragm or backplate and is connected to the conductor of the integral lead portion. The integral lead portion may optionally include a second electrical conductor providing a reference path from the cartridge to the amplifier. Further, the flex-print may be used as the carrier for the amplifier, its associated circuitry, and for other circuitry within the listening device.
    Type: Application
    Filed: October 7, 2002
    Publication date: April 10, 2003
    Inventors: Marcel de Blok, Adrianus M. Lafort, Dion I. de Roo
  • Publication number: 20030026444
    Abstract: A microphone is constructed to be more tolerant to a wide range of relative humidity conditions without adversely affecting the performance of the microphone. The microphone includes a housing with a sound port for receiving sound and an electret assembly for converting the sound into an output signal. The electret assembly includes a diaphragm and a backplate. The backplate is made of at least two layers, usually polymeric layers. The first layer of material has a first hygroscopic coefficient and a second layer of material has a second hygroscopic coefficient. The first and second layers cause the backplate to bend in response to higher humidity conditions, thereby minimizing the adverse effects on microphone performance caused by characteristic changes in the diaphragm at the higher humidity conditions.
    Type: Application
    Filed: August 1, 2002
    Publication date: February 6, 2003
    Inventors: Dion I. de Roo, Adrianus M. Lafort, Michel de Nooij, Raymond Mogelin
  • Publication number: 20020154790
    Abstract: A microphone includes a separate end cover with a sound port. A diaphragm is directly attached to the end cover. The backplate is positioned within the housing against a ridge near an end of the housing. A spacer is positioned against the backplate. The diaphragm engages the spacer when the end cover, with its attached diaphragm, is installed in the housing. The backplate of the microphone has an integral connecting wire that is made of the same material as the backplate. The integral connecting wire may have an inherent spring force to provide a pressure contact with the accompanying electrical components. The integral connecting wire electrically couples the backplate to the electronic components within the housing and transmits the raw audio signal corresponding to movement of the diaphragm. The housing may have first and second ridges on which the printed circuit board and the electret assembly are mounted, respectively.
    Type: Application
    Filed: April 17, 2002
    Publication date: October 24, 2002
    Inventors: Michael G. M. Steeman, Hendrik Dolleman, Paul C. van Hal, Adrianus M. Lafort, Jan Hijman, Dion I. de Roo, Auke P. Nauta, Raymond Mogelin