Patents by Inventor Dion I. de Roo
Dion I. de Roo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8280082Abstract: The present invention relates to a microphone that includes a housing and a diaphragm and backplate located with the housing. The housing has a sound port for receiving the sound. The diaphragm undergoes movement relative to the backplate, which it opposes, in response to the incoming sound. The backplate has a charged layer with a first surface that is exposed to the diaphragm and a second surface opposite the first surface. The backplate further includes a conductor for transmitting a signal from the backplate to electronics in the housing. The conductor faces the second surface of the charged layer. To minimize the charge degradation created by contact with or infiltration of foreign materials, the first surface, the second surface, or both surfaces of the charged layer includes a protective layer thereon.Type: GrantFiled: March 17, 2010Date of Patent: October 2, 2012Assignee: Sonion Nederland B.V.Inventors: Aart Z. van Halteren, Roelof A. Marissen, Michel Bosman, Dion I. de Roo, Raymond Mögelin, Michel de Nooij
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Publication number: 20100172521Abstract: The present invention relates to a microphone that includes a housing and a diaphragm and backplate located with the housing. The housing has a sound port for receiving the sound. The diaphragm undergoes movement relative to the backplate, which it opposes, in response to the incoming sound. The backplate has a charged layer with a first surface that is exposed to the diaphragm and a second surface opposite the first surface. The backplate further includes a conductor for transmitting a signal from the backplate to electronics in the housing. The conductor faces the second surface of the charged layer. To minimize the charge degradation created by contact with or infiltration of foreign materials, the first surface, the second surface, or both surfaces of the charged layer includes a protective layer thereon.Type: ApplicationFiled: March 17, 2010Publication date: July 8, 2010Applicant: Sonion Nederland B.V.Inventors: Aart Z. van Halteren, Roelof A. Marissen, Michel Bosman, Dion I. de Roo, Raymond Mögelin, Michel de Nooij
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Patent number: 7684575Abstract: The present invention relates to a microphone that includes a housing and a diaphragm and backplate located with the housing. The housing has a sound port for receiving the sound. The diaphragm undergoes movement relative to the backplate, which it opposes, in response to the incoming sound. The backplate has a charged layer with a first surface that is exposed to the diaphragm and a second surface opposite the first surface. The backplate further includes a conductor for transmitting a signal from the backplate to electronics in the housing. The conductor faces the second surface of the charged layer. To minimize the charge degradation created by contact with or infiltration of foreign materials, the first surface, the second surface, or both surfaces of the charged layer includes a protective layer thereon.Type: GrantFiled: October 6, 2006Date of Patent: March 23, 2010Assignee: Sonion Nederland B.V.Inventors: Aart Z. van Halteren, Roelof A. Marissen, Michel Bosman, Dion I. de Roo, Raymond Mögelin, Michel de Nooij
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Patent number: 7286680Abstract: A microphone includes a separate end cover with a sound port. A diaphragm is directly attached to the end cover. The backplate is positioned within the housing against a ridge near an end of the housing. A spacer is positioned against the backplate. The diaphragm engages the spacer when the end cover, with its attached diaphragm, is installed in the housing. The backplate of the microphone has an integral connecting wire that is made of the same material as the backplate. The integral connecting wire may have an inherent spring force to provide a pressure contact with the accompanying electrical components. The integral connecting wire electrically couples the backplate to the electronic components within the housing and transmits the raw audio signal corresponding to movement of the diaphragm. The housing may have first and second ridges on which the printed circuit board and the electret assembly are mounted, respectively.Type: GrantFiled: May 19, 2006Date of Patent: October 23, 2007Assignee: Sonion Nederland B.V.Inventors: Michael G. M. Steeman, Hendrik Dolleman, Paul C. van Hal, Adrianus M. Lafort, Jan Hijman, Dion I. de Roo, Auke P. Nauta, Raymond Mögelin
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Patent number: 7239714Abstract: In a microphone cartridge, a flexible printed circuit board serves two functions, separating the diaphragm and backplate, and electrically connecting the cartridge and the buffer amplifier. The flex-print includes a spacer portion that maintains the appropriate distance between the diaphragm and backplate, and an integral lead portion having a conductor serving as the signal path for transmitting the signal from the cartridge to the amplifier. The spacer portion has a conductor that electrically contacts the diaphragm or backplate and is connected to the conductor of the integral lead portion. The integral lead portion may optionally include a second electrical conductor providing a reference path from the cartridge to the amplifier. Further, the flex-print may be used as the carrier for the amplifier, its associated circuitry, and for other circuitry within the listening device.Type: GrantFiled: October 7, 2002Date of Patent: July 3, 2007Assignee: Sonion Nederland B.V.Inventors: Marcel de Blok, Adrianus M. Lafort, Dion I. de Roo
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Patent number: 7136496Abstract: The present invention relates to a microphone that includes a housing and a diaphragm and backplate located with the housing. The housing has a sound port for receiving the sound. The diaphragm undergoes movement relative to the backplate, which it opposes, in response to the incoming sound. The backplate has a charged layer with a first surface that is exposed to the diaphragm and a second surface opposite the first surface. The backplate further includes a conductor for transmitting a signal from the backplate to electronics in the housing. The conductor faces the second surface of the charged layer. To minimize the charge degradation created by contact with or infiltration of foreign materials, the first surface, the second surface, or both surfaces of the charged layer includes a protective layer thereon.Type: GrantFiled: October 8, 2002Date of Patent: November 14, 2006Assignee: Sonion Nederland B.V.Inventors: Aart Z. van Halteren, Roelof A. Marissen, Michel Bosman, Dion I. de Roo, Raymond Mögelin, Michel de Nooij
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Patent number: 7062058Abstract: A microphone includes a separate end cover with a sound port. A diaphragm is directly attached to the end cover. The backplate is positioned within the housing against a ridge near an end of the housing. A spacer is positioned against the backplate. The diaphragm engages the spacer when the end cover, with its attached diaphragm, is installed in the housing. The backplate of the microphone has an integral connecting wire that is made of the same material as the backplate. The integral connecting wire may have an inherent spring force to provide a pressure contact with the accompanying electrical components. The integral connecting wire electrically couples the backplate to the electronic components within the housing and transmits the raw audio signal corresponding to movement of the diaphragm. The housing may have first and second ridges on which the printed circuit board and the electret assembly are mounted, respectively.Type: GrantFiled: April 17, 2002Date of Patent: June 13, 2006Assignee: Sonion Nederland B.V.Inventors: Michael G. M. Steeman, Hendrik Dolleman, Paul C. van Hal, Adrianus M. Lafort, Jan Hijman, Dion I. de Roo, Auke P. Nauta, Raymond Mögelin
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Patent number: 6937735Abstract: A microphone is constructed to be more tolerant to a wide range of relative humidity conditions without adversely affecting the performance of the microphone. The microphone includes a housing with a sound port for receiving sound and an electret assembly for converting the sound into an output signal. The electret assembly includes a diaphragm and a backplate. The backplate is made of at least two layers, usually polymeric layers. The first layer of material has a first hygroscopic coefficient and a second layer of material has a second hygroscopic coefficient. The first and second layers cause the backplate to bend in response to higher humidity conditions, thereby minimizing the adverse effects on microphone performance caused by characteristic changes in the diaphragm at the higher humidity conditions.Type: GrantFiled: August 1, 2002Date of Patent: August 30, 2005Assignee: SonionMicrotronic Néderland B.V.Inventors: Dion I. de Roo, Adrianus M. Lafort, Michel de Nooij, Raymond Mögelin
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Publication number: 20030076970Abstract: The present invention relates to a microphone that includes a housing and a diaphragm and backplate located with the housing. The housing has a sound port for receiving the sound. The diaphragm undergoes movement relative to the backplate, which it opposes, in response to the incoming sound. The backplate has a charged layer with a first surface that is exposed to the diaphragm and a second surface opposite the first surface. The backplate further includes a conductor for transmitting a signal from the backplate to electronics in the housing. The conductor faces the second surface of the charged layer. To minimize the charge degradation created by contact with or infiltration of foreign materials, the first surface, the second surface, or both surfaces of the charged layer includes a protective layer thereon.Type: ApplicationFiled: October 8, 2002Publication date: April 24, 2003Inventors: Aart Z. van Halteren, Roelof A. Marissen, Michel Bosman, Dion I. de Roo, Raymond Mogelin, Michel de Nooij
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Publication number: 20030068059Abstract: In a microphone cartridge, a flexible printed circuit board serves two functions, separating the diaphragm and backplate, and electrically connecting the cartridge and the buffer amplifier. The flex-print includes a spacer portion that maintains the appropriate distance between the diaphragm and backplate, and an integral lead portion having a conductor serving as the signal path for transmitting the signal from the cartridge to the amplifier. The spacer portion has a conductor that electrically contacts the diaphragm or backplate and is connected to the conductor of the integral lead portion. The integral lead portion may optionally include a second electrical conductor providing a reference path from the cartridge to the amplifier. Further, the flex-print may be used as the carrier for the amplifier, its associated circuitry, and for other circuitry within the listening device.Type: ApplicationFiled: October 7, 2002Publication date: April 10, 2003Inventors: Marcel de Blok, Adrianus M. Lafort, Dion I. de Roo
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Publication number: 20030026444Abstract: A microphone is constructed to be more tolerant to a wide range of relative humidity conditions without adversely affecting the performance of the microphone. The microphone includes a housing with a sound port for receiving sound and an electret assembly for converting the sound into an output signal. The electret assembly includes a diaphragm and a backplate. The backplate is made of at least two layers, usually polymeric layers. The first layer of material has a first hygroscopic coefficient and a second layer of material has a second hygroscopic coefficient. The first and second layers cause the backplate to bend in response to higher humidity conditions, thereby minimizing the adverse effects on microphone performance caused by characteristic changes in the diaphragm at the higher humidity conditions.Type: ApplicationFiled: August 1, 2002Publication date: February 6, 2003Inventors: Dion I. de Roo, Adrianus M. Lafort, Michel de Nooij, Raymond Mogelin
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Publication number: 20020154790Abstract: A microphone includes a separate end cover with a sound port. A diaphragm is directly attached to the end cover. The backplate is positioned within the housing against a ridge near an end of the housing. A spacer is positioned against the backplate. The diaphragm engages the spacer when the end cover, with its attached diaphragm, is installed in the housing. The backplate of the microphone has an integral connecting wire that is made of the same material as the backplate. The integral connecting wire may have an inherent spring force to provide a pressure contact with the accompanying electrical components. The integral connecting wire electrically couples the backplate to the electronic components within the housing and transmits the raw audio signal corresponding to movement of the diaphragm. The housing may have first and second ridges on which the printed circuit board and the electret assembly are mounted, respectively.Type: ApplicationFiled: April 17, 2002Publication date: October 24, 2002Inventors: Michael G. M. Steeman, Hendrik Dolleman, Paul C. van Hal, Adrianus M. Lafort, Jan Hijman, Dion I. de Roo, Auke P. Nauta, Raymond Mogelin