Patents by Inventor Dion Ivo De Roo
Dion Ivo De Roo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240022858Abstract: The invention relates to a moveable element for a transducer, said moveable element being arranged to be moved indirectly or directly by a driving means of said transducer, said moveable element being arranged for outputting acoustic energy or for moving an outputting means for outputting said acoustic energy that is operatively coupled to said moveable element, wherein said moveable element comprises at least one sensor for sensing at least one parameter of the moveable element and/or of a volume defined by a housing of the transducer. The invention further relates to a transducer comprising such a moveable element and an in-ear device comprising such a transducer. The invention further relates to a method for determining the occurrence of a condition in such a transducer.Type: ApplicationFiled: December 15, 2021Publication date: January 18, 2024Applicant: SONION NEDERLAND BVInventors: Dion Ivo DE ROO, Michele COLLOCA, Adrianus Maria LAFORT
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Patent number: 11760624Abstract: A micro-electromechanical transducer including one or more moveable members, and a viscoelastic substance having a predetermined viscoelasticity, the viscoelastic substance being adapted to influence the response of the transducer in a predetermined manner. The micro-electromechanical transducer of the present invention may include a MEMS transducer, such as a MEMS microphone, a MEMS vibration sensor, a MEMS acceleration sensor, a MEMS receiver.Type: GrantFiled: May 20, 2022Date of Patent: September 19, 2023Assignee: Sonion Nederland B.V.Inventors: Raymond Mogelin, Dion Ivo de Roo, Frederik Cornelis Blom, Alwin Fransen, Pavlo Mulyar, Peter Christiaan Post
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Publication number: 20220274826Abstract: A micro-electromechanical transducer including one or more moveable members, and a viscoelastic substance having a predetermined viscoelasticity, the viscoelastic substance being adapted to influence the response of the transducer in a predetermined manner. The micro-electromechanical transducer of the present invention may include a MEMS transducer, such as a MEMS microphone, a MEMS vibration sensor, a MEMS acceleration sensor, a MEMS receiver.Type: ApplicationFiled: May 20, 2022Publication date: September 1, 2022Inventors: Raymond Mogelin, Dion Ivo de Roo, Frederik Cornelis Blom, Alwin Fransen, Pavlo Mulyar, Peter Christiaan Post
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Patent number: 11358859Abstract: A micro-electromechanical transducer including one or more moveable members, and a viscoelastic substance having a predetermined viscoelasticity, the viscoelastic substance being adapted to influence the response of the transducer in a predetermined manner. The micro-electromechanical transducer of the present invention may include a MEMS transducer, such as a MEMS microphone, a MEMS vibration sensor, a MEMS acceleration sensor, a MEMS receiver.Type: GrantFiled: October 1, 2020Date of Patent: June 14, 2022Assignee: Sonion Nederland B.V.Inventors: Raymond Mögelin, Dion Ivo de Roo, Frederik Comelis Blom, Alwin Fransen, Pavlo Mulyar, Peter Christiaan Post
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Publication number: 20210100508Abstract: A hearing device such as a receiver-in-ear assembly. The assembly includes a housing having a cavity extending through the housing; an optical transducer mounted in the cavity within a thickness of the housing, the optical transducer being mounted on a circuit board layer such that a spacing exists between a side of the optical transducer and a sidewall of the cavity. The circuit board layer extends underneath the housing and touching the housing such that the optical transducer is held within the cavity without touching the housing. The assembly further includes a protective substance forming a shield over the optical transducer and the cavity, the protective substance configured to affect a field of view of the optical transducer.Type: ApplicationFiled: October 6, 2020Publication date: April 8, 2021Inventors: Eeuwe Jan Vos, Dion Ivo De Roo, Alwin Fransen
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Patent number: 10947108Abstract: A micro-electromechanical transducer including one or more moveable members, and a viscoelastic substance having a predetermined viscoelasticity, the viscoelastic substance being adapted to influence the response of the transducer in a predetermined manner. The micro-electromechanical transducer of the present invention may include a MEMS transducer, such as a MEMS microphone, a MEMS vibration sensor, a MEMS acceleration sensor, a MEMS receiver.Type: GrantFiled: December 22, 2017Date of Patent: March 16, 2021Assignee: Sonion Nederland B.V.Inventors: Raymond Mögelin, Dion Ivo de Roo, Frederik Cornelis Blom, Alwin Fransen, Pavlo Mulyar, Peter Christiaan Post
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Publication number: 20210017015Abstract: A micro-electromechanical transducer including one or more moveable members, and a viscoelastic substance having a predetermined viscoelasticity, the viscoelastic substance being adapted to influence the response of the transducer in a predetermined manner. The micro-electromechanical transducer of the present invention may include a MEMS transducer, such as a MEMS microphone, a MEMS vibration sensor, a MEMS acceleration sensor, a MEMS receiver.Type: ApplicationFiled: October 1, 2020Publication date: January 21, 2021Inventors: Raymond Mögelin, Dion Ivo de Roo, Frederik Cornelis Blom, Alwin Fransen, Pavlo Mulyar, Peter Christiaan Post
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Patent number: 10349170Abstract: Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generators and single-ended or differential amplifier arrangements. Various embodiments are described that can effectively increase the bias voltage available to the sensor element without resorting to high breakdown voltage semiconductor processes. In addition, control of the one or more bias voltage generators in various operating modes is described, based on consideration of a number of factors.Type: GrantFiled: July 9, 2018Date of Patent: July 9, 2019Assignee: INVENSENSE, INC.Inventors: Kieran Harney, Adrianus Maria Lafort, Brian Moss, Dion Ivo De Roo
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Patent number: 10327072Abstract: A phase correcting system for connection with a transducer. The phase correction may take place before amplifying the output of the transducer. The phase correction system comprises a circuit configured to low-pass filter an input and feed the output to the non-signal terminal of the transducer. This circuit may comprise a transconductance amplifier.Type: GrantFiled: November 17, 2017Date of Patent: June 18, 2019Assignee: Sonion Nederland B.V.Inventors: Adrianus Maria Lafort, Dion Ivo de Roo
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Publication number: 20190141432Abstract: An assembly for a personal audio device configured to amplify and process a signal and to output this signal as sound into an ear canal of a user. The assembly includes a housing portion and a transducer. The housing portion includes a cavity configured to receive the transducer via an opening in the housing portion. The transducer includes a fixing member configured for attachment of the transducer to the housing. The fixing member includes an edge portion extending from the transducer and is configured to support the transducer in the cavity. The edge portion forms a serrated surface for engagement between the transducer and an inner portion of the cavity.Type: ApplicationFiled: November 8, 2018Publication date: May 9, 2019Inventors: Alwin Fransen, Jelle Heuveling, Dion Ivo de Roo, Ewian Vos, Theodorus Maria Verhaar
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Patent number: 10206047Abstract: Improving noise rejection of a micro-electro-mechanical system (MEMS) microphone by utilizing a membrane sandwiched between oppositely biased backplates is presented herein. The MEMS microphone can comprise a diaphragm that converts an acoustic pressure into an electrical signal; a first backplate capacitively coupled to a first side of the diaphragm—the first backplate biased at a first direct current (DC) voltage; a second backplate capacitively coupled to a second side of the diaphragm—the second backplate biased at a second DC voltage; and an electronic amplifier that buffers the electrical signal to generate a buffered output signal representing the acoustic pressure.Type: GrantFiled: April 28, 2016Date of Patent: February 12, 2019Assignee: INVENSENSE, INC.Inventors: Kieran Harney, Adrianus Maria Lafort, Brian Moss, Dion Ivo De Roo
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Publication number: 20180332390Abstract: Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generators and single-ended or differential amplifier arrangements. Various embodiments are described that can effectively increase the bias voltage available to the sensor element without resorting to high breakdown voltage semiconductor processes. In addition, control of the one or more bias voltage generators in various operating modes is described, based on consideration of a number of factors.Type: ApplicationFiled: July 9, 2018Publication date: November 15, 2018Inventors: Kieran Harney, Adrianus Maria Lafort, Brian Moss, Dion Ivo De Roo
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Patent number: 10045121Abstract: Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generators and single-ended or differential amplifier arrangements. Various embodiments are described that can effectively increase the bias voltage available to the sensor element without resorting to high breakdown voltage semiconductor processes. In addition, control of the one or more bias voltage generators in various operating modes is described, based on consideration of a number of factors.Type: GrantFiled: April 29, 2016Date of Patent: August 7, 2018Assignee: Invensense, Inc.Inventors: Kieran Harney, Adrianus Maria Lafort, Brian Moss, Dion Ivo De Roo
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Publication number: 20180186622Abstract: A micro-electromechanical transducer including one or more moveable members, and a viscoelastic substance having a predetermined viscoelasticity, the viscoelastic substance being adapted to influence the response of the transducer in a predetermined manner. The micro-electromechanical transducer of the present invention may include a MEMS transducer, such as a MEMS microphone, a MEMS vibration sensor, a MEMS acceleration sensor, a MEMS receiver.Type: ApplicationFiled: December 22, 2017Publication date: July 5, 2018Inventors: Raymond Mögelin, Dion Ivo de Roo, Frederik Cornelis Blom, Alwin Fransen, Pavlo Mulyar, Peter Christiaan Post
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Publication number: 20180146286Abstract: A phase correcting system for connection with a transducer. The phase correction may take place before amplifying the output of the transducer. The phase correction system comprises a circuit configured to low-pass filter an input and feed the output to the non-signal terminal of the transducer. This circuit may comprise a transconductance amplifier.Type: ApplicationFiled: November 17, 2017Publication date: May 24, 2018Inventors: Adrianus Maria Lafort, Dion Ivo de Roo
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Publication number: 20170318395Abstract: Improving noise rejection of a micro-electro-mechanical system (MEMS) microphone by utilizing a membrane sandwiched between oppositely biased backplates is presented herein. The MEMS microphone can comprise a diaphragm that converts an acoustic pressure into an electrical signal; a first backplate capacitively coupled to a first side of the diaphragm—the first backplate biased at a first direct current (DC) voltage; a second backplate capacitively coupled to a second side of the diaphragm—the second backplate biased at a second DC voltage; and an electronic amplifier that buffers the electrical signal to generate a buffered output signal representing the acoustic pressure.Type: ApplicationFiled: April 28, 2016Publication date: November 2, 2017Inventors: Kieran Harney, Adrianus Maria Lafort, Brian Moss, Dion Ivo De Roo
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Publication number: 20170318385Abstract: Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generators and single-ended or differential amplifier arrangements. Various embodiments are described that can effectively increase the bias voltage available to the sensor element without resorting to high breakdown voltage semiconductor processes. In addition, control of the one or more bias voltage generators in various operating modes is described, based on consideration of a number of factors.Type: ApplicationFiled: April 29, 2016Publication date: November 2, 2017Inventors: Kieran Harney, Adrianus Maria Lafort, Brian Moss, Dion Ivo De Roo
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Publication number: 20160255445Abstract: The present invention relates to a microphone module comprising at least two directional microphones having different polar patterns and a single front sound inlet and a single rear sound inlet. The present invention provides a compact and space saving microphone module being less sensitive for mismatch or drift between the applied directional microphones and thereby very robust in directional performance. The microphone module of the present invention is, in particular, suitable in relation to hearing aid applications. The present invention further relates to an associated method for handling and processing signals from the at least two directional microphones.Type: ApplicationFiled: February 9, 2016Publication date: September 1, 2016Inventors: Adrianus Maria Lafort, Andreas Tiefenau, Anne-Marie Sänger, Arkadiusz Wasylków, Dion Ivo de Roo
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Patent number: 9264798Abstract: The invention relates to a microphone (10). A first (14a) and a second (14b) diaphragm are provided in a housing (12). A first chamber (24a) is delimited by a first side of the first diaphragm (14a) and an inner surface of the housing (12). A first opening (18a) extends from the first chamber (24a) to surroundings of the microphone (10). A second chamber (24b) is delimited by a first side of the second diaphragm (14b) and an inner surface of the housing (12). A second opening (18b) extends from the second chamber (24b) to the surroundings. A common chamber (22) is delimited by a second side of the first diaphragm (14a), a second side of the second diaphragm (14b) and an inner surface of the housing (12). A third opening (20) extends from the common chamber (22) to the surroundings.Type: GrantFiled: July 23, 2012Date of Patent: February 16, 2016Assignee: SONION NEDERLAND B.V.Inventor: Dion Ivo de Roo
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Publication number: 20130028451Abstract: A microphone comprises a housing, a first and a second diaphragm, a first chamber, and a second chamber. A first and a second diaphragm, each having a first and second side, are provided in the housing. The first chamber is delimited at least partly by the first side of the first diaphragm and an inner surface of the housing. A first opening extends from the first chamber and to surroundings of the microphone. The second chamber is delimited at least partly by the first side of the second diaphragm and an inner surface of the housing. A second opening extends from the second chamber and to the surroundings. A common chamber is delimited at least partly by the second side of the first diaphragm, the second side of the second diaphragm and an inner surface of the housing. A third opening extends from the common chamber and to the surroundings.Type: ApplicationFiled: July 23, 2012Publication date: January 31, 2013Applicant: Sonion Nederland BVInventor: Dion Ivo de Roo