Patents by Inventor Diosdado Palacpac

Diosdado Palacpac has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for manufacturing ball grid array ("BGA") packages
    Publication number: 20020081772
    Abstract: According to one embodiment of the invention, a method for manufacturing a ball grid array package includes providing a flip chip, coupling the flip chip to a first side of a substrate, encapsulating the flip chip with a molding, attaching a plurality of solder balls to a second side of the substrate, and cutting the substrate to produce the ball grid array package.
    Type: Application
    Filed: October 25, 2001
    Publication date: June 27, 2002
    Inventors: Ruben P. Madrid, Diosdado Palacpac