Patents by Inventor Dipak Rajhansa

Dipak Rajhansa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6231578
    Abstract: A surgical instrument for excising includes an endoscopic portion with an ultrasonically vibratable loop. The loop is positioned around the tissue and closed, whereupon ultrasonic energy is transmitted to the loop to cut and cauterize the body tissue. The apparatus and method described herein are particularly suitable for colonoscopic polypectomy procedures.
    Type: Grant
    Filed: August 2, 1999
    Date of Patent: May 15, 2001
    Assignee: United States Surgical Corporation
    Inventor: Dipak Rajhansa