Patents by Inventor Dipak Sengupta
Dipak Sengupta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10884551Abstract: An integrated gesture sensor module includes an optical sensor die, an application-specific integrated circuit (ASIC) die, and an optical emitter die disposed in a single package. The optical sensor die and ASIC die can be disposed in a first cavity of the package, and the optical emitter die can be disposed in a second cavity of the package. The second cavity can be conical or step-shaped so that the opening defining the cavity increases with distance from the upper surface of the optical emitter die. The upper surface of the optical emitter die may be higher than the upper surface of the optical sensor die. An optical barrier positioned between the first and second cavities can include a portion of a pre-molded, laminate, or ceramic package, molding compound, and/or metallized vias.Type: GrantFiled: May 13, 2014Date of Patent: January 5, 2021Assignee: Analog Devices, Inc.Inventors: Dipak Sengupta, Shrenik Deliwala, Ying Zhao, Bruce Fried, William Schoppee, Woodrow Beckford
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Patent number: 10593634Abstract: Various embodiments of an integrated device package with integrated antennas are disclosed. In some embodiments, an antenna can be defined along a die pad of the package. In some embodiments, an antenna can be disposed in a first packaging component, and an integrated device die can be disposed in a second packaging component. The first and second packaging components can be stacked on one another and electrically connected. In some embodiments, a package can include one or a plurality of antennas disposed along a wall of a package body. The plurality of antennas can be disposed facing different directions from the package.Type: GrantFiled: December 30, 2016Date of Patent: March 17, 2020Assignee: Analog Devices, Inc.Inventors: Youn-Jae Kook, Yeonsung Kim, Dipak Sengupta
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Patent number: 10490510Abstract: An integrated device package is disclosed. The package can include a package substrate comprising a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction. The composite die pad can include an insulator die pad and a metal die pad. The insulator die pad and the metal die pad can be disposed adjacent one another along the vertical direction. The substrate can include a plurality of leads disposed about at least a portion of a perimeter of the composite die pad. An integrated device die can be mounted on the upper surface of the composite die pad.Type: GrantFiled: August 7, 2017Date of Patent: November 26, 2019Assignee: ANALOG DEVICES, INC.Inventors: Xiaojie Xue, Dipak Sengupta
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Patent number: 10257610Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.Type: GrantFiled: April 7, 2017Date of Patent: April 9, 2019Assignee: INVENSENSE, INC.Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
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Publication number: 20180190600Abstract: Various embodiments of an integrated device package with integrated antennas are disclosed. In some embodiments, an antenna can be defined along a die pad of the package. In some embodiments, an antenna can be disposed in a first packaging component, and an integrated device die can be disposed in a second packaging component. The first and second packaging components can be stacked on one another and electrically connected. In some embodiments, a package can include one or a plurality of antennas disposed along a wall of a package body. The plurality of antennas can be disposed facing different directions from the package.Type: ApplicationFiled: December 30, 2016Publication date: July 5, 2018Inventors: Youn-Jae Kook, Yeonsung Kim, Dipak Sengupta
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Publication number: 20180047675Abstract: An integrated device package is disclosed. The package can include a package substrate comprising a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction. The composite die pad can include an insulator die pad and a metal die pad. The insulator die pad and the metal die pad can be disposed adjacent one another along the vertical direction. The substrate can include a plurality of leads disposed about at least a portion of a perimeter of the composite die pad. An integrated device die can be mounted on the upper surface of the composite die pad.Type: ApplicationFiled: August 7, 2017Publication date: February 15, 2018Inventors: Xiaojie Xue, Dipak Sengupta
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Patent number: 9731959Abstract: An integrated device package is disclosed. The package includes a substrate comprising a cavity through a top surface of the substrate. A first integrated device die is positioned in the cavity. The first integrated device die includes one or more active components. A second integrated device die is attached to the top surface of the substrate and positioned over the cavity. The second integrated device die covers the cavity. Encapsulant can cover the second integrate device die.Type: GrantFiled: November 26, 2014Date of Patent: August 15, 2017Assignee: ANALOG DEVICES, INC.Inventors: Dipak Sengupta, Shafi Saiyed
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Patent number: 9728510Abstract: An integrated device package is disclosed. The package can include a package substrate comprising a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction. The composite die pad can include an insulator die pad and a metal die pad. The insulator die pad and the metal die pad can be disposed adjacent one another along the vertical direction. The substrate can include a plurality of leads disposed about at least a portion of a perimeter of the composite die pad. An integrated device die can be mounted on the upper surface of the composite die pad.Type: GrantFiled: November 25, 2015Date of Patent: August 8, 2017Assignee: ANALOG DEVICES, INC.Inventors: Xiaojie Xue, Dipak Sengupta
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Publication number: 20170215001Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.Type: ApplicationFiled: April 7, 2017Publication date: July 27, 2017Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
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Patent number: 9716193Abstract: An integrated optical sensor module includes an optical sensor die having an optical sensing area on its first surface, and an application-specific integrated circuit (ASIC) die arranged over the first surface of the optical sensor die. A hole in the ASIC die is at least partially aligned with the optical sensing area such that at least some of the light passing through the hole may contact the optical sensing area. The hole through the ASIC die can be configured to receive an optical fiber, lens structure, or other optical element therein.Type: GrantFiled: May 2, 2012Date of Patent: July 25, 2017Assignee: ANALOG DEVICES, INC.Inventor: Dipak Sengupta
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Publication number: 20160300781Abstract: An integrated device package is disclosed. The package can include a package substrate comprising a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction. The composite die pad can include an insulator die pad and a metal die pad. The insulator die pad and the metal die pad can be disposed adjacent one another along the vertical direction. The substrate can include a plurality of leads disposed about at least a portion of a perimeter of the composite die pad. An integrated device die can be mounted on the upper surface of the composite die pad.Type: ApplicationFiled: November 25, 2015Publication date: October 13, 2016Inventors: Xiaojie Xue, Dipak Sengupta
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Publication number: 20160090298Abstract: An integrated device package is disclosed. The package includes a substrate comprising a cavity through a top surface of the substrate. A first integrated device die is positioned in the cavity. The first integrated device die includes one or more active components. A second integrated device die is attached to the top surface of the substrate and positioned over the cavity. The second integrated device die covers the cavity. Encapsulant can cover the second integrate device die.Type: ApplicationFiled: November 26, 2014Publication date: March 31, 2016Inventors: Dipak Sengupta, Shafi Saiyed
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Publication number: 20160044409Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.Type: ApplicationFiled: October 22, 2015Publication date: February 11, 2016Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
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Patent number: 9173015Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.Type: GrantFiled: March 24, 2014Date of Patent: October 27, 2015Assignee: INVENSENSE, INC.Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
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Patent number: 9142470Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.Type: GrantFiled: May 9, 2014Date of Patent: September 22, 2015Assignee: ANALOG DEVICES, INC.Inventors: Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Richard Sullivan, Thomas Goida, Carlo Tiongson, Dipak Sengupta
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Publication number: 20140340302Abstract: An integrated gesture sensor module includes an optical sensor die, an application-specific integrated circuit (ASIC) die, and an optical emitter die disposed in a single package. The optical sensor die and ASIC die can be disposed in a first cavity of the package, and the optical emitter die can be disposed in a second cavity of the package. The second cavity can be conical or step-shaped so that the opening defining the cavity increases with distance from the upper surface of the optical emitter die. The upper surface of the optical emitter die may be higher than the upper surface of the optical sensor die. An optical barrier positioned between the first and second cavities can include a portion of a pre-molded, laminate, or ceramic package, molding compound, and/or metallized vias.Type: ApplicationFiled: May 13, 2014Publication date: November 20, 2014Applicant: ANALOG DEVICES, INC.Inventors: Dipak Sengupta, Shrenik Deliwala, Ying Zhao, Bruce Fried, William Schoppee, Woodrow Beckford
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Publication number: 20140332947Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.Type: ApplicationFiled: May 9, 2014Publication date: November 13, 2014Applicant: ANALOG DEVICES, INC.Inventors: Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Richard Sullivan, Thomas Goida, Carlo Tiongson, Dipak Sengupta
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Publication number: 20140294221Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.Type: ApplicationFiled: March 24, 2014Publication date: October 2, 2014Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
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Patent number: 8767982Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.Type: GrantFiled: October 26, 2012Date of Patent: July 1, 2014Assignee: Invensense, Inc.Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
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Patent number: 8723308Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.Type: GrantFiled: November 17, 2011Date of Patent: May 13, 2014Assignee: Analog Devices, Inc.Inventors: Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Rick Sullivan, Thomas Goida, Carlo Tiongson, Dipak Sengupta