Patents by Inventor Dipak Sengupta

Dipak Sengupta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10884551
    Abstract: An integrated gesture sensor module includes an optical sensor die, an application-specific integrated circuit (ASIC) die, and an optical emitter die disposed in a single package. The optical sensor die and ASIC die can be disposed in a first cavity of the package, and the optical emitter die can be disposed in a second cavity of the package. The second cavity can be conical or step-shaped so that the opening defining the cavity increases with distance from the upper surface of the optical emitter die. The upper surface of the optical emitter die may be higher than the upper surface of the optical sensor die. An optical barrier positioned between the first and second cavities can include a portion of a pre-molded, laminate, or ceramic package, molding compound, and/or metallized vias.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: January 5, 2021
    Assignee: Analog Devices, Inc.
    Inventors: Dipak Sengupta, Shrenik Deliwala, Ying Zhao, Bruce Fried, William Schoppee, Woodrow Beckford
  • Patent number: 10593634
    Abstract: Various embodiments of an integrated device package with integrated antennas are disclosed. In some embodiments, an antenna can be defined along a die pad of the package. In some embodiments, an antenna can be disposed in a first packaging component, and an integrated device die can be disposed in a second packaging component. The first and second packaging components can be stacked on one another and electrically connected. In some embodiments, a package can include one or a plurality of antennas disposed along a wall of a package body. The plurality of antennas can be disposed facing different directions from the package.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: March 17, 2020
    Assignee: Analog Devices, Inc.
    Inventors: Youn-Jae Kook, Yeonsung Kim, Dipak Sengupta
  • Patent number: 10490510
    Abstract: An integrated device package is disclosed. The package can include a package substrate comprising a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction. The composite die pad can include an insulator die pad and a metal die pad. The insulator die pad and the metal die pad can be disposed adjacent one another along the vertical direction. The substrate can include a plurality of leads disposed about at least a portion of a perimeter of the composite die pad. An integrated device die can be mounted on the upper surface of the composite die pad.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: November 26, 2019
    Assignee: ANALOG DEVICES, INC.
    Inventors: Xiaojie Xue, Dipak Sengupta
  • Patent number: 10257610
    Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: April 9, 2019
    Assignee: INVENSENSE, INC.
    Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
  • Publication number: 20180190600
    Abstract: Various embodiments of an integrated device package with integrated antennas are disclosed. In some embodiments, an antenna can be defined along a die pad of the package. In some embodiments, an antenna can be disposed in a first packaging component, and an integrated device die can be disposed in a second packaging component. The first and second packaging components can be stacked on one another and electrically connected. In some embodiments, a package can include one or a plurality of antennas disposed along a wall of a package body. The plurality of antennas can be disposed facing different directions from the package.
    Type: Application
    Filed: December 30, 2016
    Publication date: July 5, 2018
    Inventors: Youn-Jae Kook, Yeonsung Kim, Dipak Sengupta
  • Publication number: 20180047675
    Abstract: An integrated device package is disclosed. The package can include a package substrate comprising a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction. The composite die pad can include an insulator die pad and a metal die pad. The insulator die pad and the metal die pad can be disposed adjacent one another along the vertical direction. The substrate can include a plurality of leads disposed about at least a portion of a perimeter of the composite die pad. An integrated device die can be mounted on the upper surface of the composite die pad.
    Type: Application
    Filed: August 7, 2017
    Publication date: February 15, 2018
    Inventors: Xiaojie Xue, Dipak Sengupta
  • Patent number: 9731959
    Abstract: An integrated device package is disclosed. The package includes a substrate comprising a cavity through a top surface of the substrate. A first integrated device die is positioned in the cavity. The first integrated device die includes one or more active components. A second integrated device die is attached to the top surface of the substrate and positioned over the cavity. The second integrated device die covers the cavity. Encapsulant can cover the second integrate device die.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: August 15, 2017
    Assignee: ANALOG DEVICES, INC.
    Inventors: Dipak Sengupta, Shafi Saiyed
  • Patent number: 9728510
    Abstract: An integrated device package is disclosed. The package can include a package substrate comprising a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction. The composite die pad can include an insulator die pad and a metal die pad. The insulator die pad and the metal die pad can be disposed adjacent one another along the vertical direction. The substrate can include a plurality of leads disposed about at least a portion of a perimeter of the composite die pad. An integrated device die can be mounted on the upper surface of the composite die pad.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: August 8, 2017
    Assignee: ANALOG DEVICES, INC.
    Inventors: Xiaojie Xue, Dipak Sengupta
  • Publication number: 20170215001
    Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.
    Type: Application
    Filed: April 7, 2017
    Publication date: July 27, 2017
    Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
  • Patent number: 9716193
    Abstract: An integrated optical sensor module includes an optical sensor die having an optical sensing area on its first surface, and an application-specific integrated circuit (ASIC) die arranged over the first surface of the optical sensor die. A hole in the ASIC die is at least partially aligned with the optical sensing area such that at least some of the light passing through the hole may contact the optical sensing area. The hole through the ASIC die can be configured to receive an optical fiber, lens structure, or other optical element therein.
    Type: Grant
    Filed: May 2, 2012
    Date of Patent: July 25, 2017
    Assignee: ANALOG DEVICES, INC.
    Inventor: Dipak Sengupta
  • Publication number: 20160300781
    Abstract: An integrated device package is disclosed. The package can include a package substrate comprising a composite die pad having an upper surface and a lower surface spaced from the upper surface along a vertical direction. The composite die pad can include an insulator die pad and a metal die pad. The insulator die pad and the metal die pad can be disposed adjacent one another along the vertical direction. The substrate can include a plurality of leads disposed about at least a portion of a perimeter of the composite die pad. An integrated device die can be mounted on the upper surface of the composite die pad.
    Type: Application
    Filed: November 25, 2015
    Publication date: October 13, 2016
    Inventors: Xiaojie Xue, Dipak Sengupta
  • Publication number: 20160090298
    Abstract: An integrated device package is disclosed. The package includes a substrate comprising a cavity through a top surface of the substrate. A first integrated device die is positioned in the cavity. The first integrated device die includes one or more active components. A second integrated device die is attached to the top surface of the substrate and positioned over the cavity. The second integrated device die covers the cavity. Encapsulant can cover the second integrate device die.
    Type: Application
    Filed: November 26, 2014
    Publication date: March 31, 2016
    Inventors: Dipak Sengupta, Shafi Saiyed
  • Publication number: 20160044409
    Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.
    Type: Application
    Filed: October 22, 2015
    Publication date: February 11, 2016
    Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
  • Patent number: 9173015
    Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: October 27, 2015
    Assignee: INVENSENSE, INC.
    Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
  • Patent number: 9142470
    Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: September 22, 2015
    Assignee: ANALOG DEVICES, INC.
    Inventors: Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Richard Sullivan, Thomas Goida, Carlo Tiongson, Dipak Sengupta
  • Publication number: 20140340302
    Abstract: An integrated gesture sensor module includes an optical sensor die, an application-specific integrated circuit (ASIC) die, and an optical emitter die disposed in a single package. The optical sensor die and ASIC die can be disposed in a first cavity of the package, and the optical emitter die can be disposed in a second cavity of the package. The second cavity can be conical or step-shaped so that the opening defining the cavity increases with distance from the upper surface of the optical emitter die. The upper surface of the optical emitter die may be higher than the upper surface of the optical sensor die. An optical barrier positioned between the first and second cavities can include a portion of a pre-molded, laminate, or ceramic package, molding compound, and/or metallized vias.
    Type: Application
    Filed: May 13, 2014
    Publication date: November 20, 2014
    Applicant: ANALOG DEVICES, INC.
    Inventors: Dipak Sengupta, Shrenik Deliwala, Ying Zhao, Bruce Fried, William Schoppee, Woodrow Beckford
  • Publication number: 20140332947
    Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.
    Type: Application
    Filed: May 9, 2014
    Publication date: November 13, 2014
    Applicant: ANALOG DEVICES, INC.
    Inventors: Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Richard Sullivan, Thomas Goida, Carlo Tiongson, Dipak Sengupta
  • Publication number: 20140294221
    Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.
    Type: Application
    Filed: March 24, 2014
    Publication date: October 2, 2014
    Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
  • Patent number: 8767982
    Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: July 1, 2014
    Assignee: Invensense, Inc.
    Inventors: Kieran P. Harney, Dipak Sengupta, Brian Moss, Alain V. Guery
  • Patent number: 8723308
    Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: May 13, 2014
    Assignee: Analog Devices, Inc.
    Inventors: Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Rick Sullivan, Thomas Goida, Carlo Tiongson, Dipak Sengupta