Patents by Inventor Dipak Thakar

Dipak Thakar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6865805
    Abstract: A device and method of unitarily forming an electrically shielded panel for use in electromagnetically sealing an opening defined in an electronic enclosure. The unitary electrically shielded panel is formed of an electrically non-conductive rigid thermoplastic panel part and a substantially planar, electrically conductive elastomeric gasket bonded together to form the unitary panel in a single tool during a single injection-molding operation.
    Type: Grant
    Filed: July 7, 2003
    Date of Patent: March 15, 2005
    Assignee: Lucent Technologies Inc.
    Inventors: John A. Dispenza, Dipak Thakar
  • Publication number: 20040035599
    Abstract: A device and method of unitarily forming an electrically shielded panel for use in electromagnetically sealing an opening defined in an electronic enclosure. The unitary electrically shielded panel is formed of an electrically non-conductive rigid thermoplastic panel part and a substantially planar, electrically conductive elastomeric gasket bonded together to form the unitary panel in a single tool during a single injection-molding operation.
    Type: Application
    Filed: July 7, 2003
    Publication date: February 26, 2004
    Applicant: Lucent Technologies Inc.
    Inventors: John A. Dispenza, Dipak Thakar
  • Publication number: 20010018979
    Abstract: A device and method of unitarily forming an electrically shielded panel for use in electromagnetically sealing an opening defined in an electronic enclosure. The unitary electrically shielded panel is formed of an electrically non-conductive rigid thermoplastic panel part and a substantially planar, electrically conductive elastomeric gasket bonded together to form the unitary panel in a single tool during a single injection-molding operation.
    Type: Application
    Filed: March 14, 2001
    Publication date: September 6, 2001
    Applicant: Lucent Technologies Inc.
    Inventors: John A. Dispenza, Dipak Thakar