Abstract: A printed circuit board assembly includes a printed circuit board having an upper side and a lower side, and an electrical module having an upper side and a lower side. The upper side of the electrical module is electrically connected to the lower side of the printed circuit board. For the electrical module to make electrical contact, the electrical module has electrical contacts on the upper side of the electrical module. An underfill material is arranged between the upper side of the electrical module and the lower side of the printed circuit board in an area next to the electrical contacts. Each of the electrical contacts is arranged adjacent to a side edge of the upper side of the electrical module, and an edge gap between the respective electrical contact and the adjacent side edge is sealed by an edge bond material.

Abstract: An electrical module and a circuit board arrangement including an electrical module are disclosed. The electrical module includes an upper side and an underside, the upper side having four rectangularly arranged side edges, an electrical component embedded in the electrical module, and at least three electrical solder pads formed on the upper side configured to make electrical contact with the electrical component and configured to come into contact with an associated electrical solder pad of a circuit board via a solder layer. The solder pads of the electrical module are arranged in a symmetrical arrangement on the upper side of the electrical module, and/or the solder pads are arranged axially symmetrically on the upper side of the electrical module, and/or the solder pads extend along two opposite side edges on the upper side of the electrical module.

Abstract: A printed circuit board assembly includes a printed circuit board having an upper side and a lower side, an electrical module having an upper side and a lower side, and a holding down construction. The upper side of the electrical module is arranged on the lower side of the printed circuit board. The holding down construction includes screwing posts that are configured to be screwed against the printed circuit board. The holding down construction is arranged on the upper side of the printed circuit board and includes contact structures that are at a distance from the screwing posts and configured to rest or press on the printed circuit board at specific contact points only. The printed circuit board includes dedicated support points that correspond to the specific contact points of the holding down construction and are contacted by the specific contact points. The dedicated support points are mechanically reinforced.

Abstract: An electrical module and a circuit board arrangement including an electrical module are disclosed. The electrical module includes an upper side and an underside, the upper side having four rectangularly arranged side edges, an electrical component embedded in the electrical module, and at least three electrical solder pads formed on the upper side configured to make electrical contact with the electrical component and configured to come into contact with an associated electrical solder pad of a circuit board via a solder layer. The solder pads of the electrical module are arranged in a symmetrical arrangement on the upper side of the electrical module, and/or the solder pads are arranged axially symmetrically on the upper side of the electrical module, and/or the solder pads extend along two opposite side edges on the upper side of the electrical module.